Thermo Electron Corporation / Molecular Spectroscopy
Madison, WI 53711-4495
Nov 16, 2009 Escalab 250Xi X-ray photoelectron spectrometer lets analysts configure it with range of surface characterization techniques. Ion scattering spectroscopy and reflection electron energy loss spectroscopy are provided, while ultra violet photoelectron spectroscopy and Auger electron spectroscopy are available as options. Sample preparation chamber is also provided, and system can be expanded with selection of sample preparation options and additional experimental chambers.

Nikon Instruments Inc.
Melville, NY 11747-3064
Oct 05, 2009 Model BW-H501 3D surface profile system features high-speed X-Cycle Imager allowing image capture of 900 fps with output/display of height images at 5 fps. It also integrates BridgeElements software which supports simultaneous capture of multiple images, allowing real-time image comparison. By utilizing fringe cycle method, system can achieve height resolution of 100 nm and perform surface profiling in as little as 200 ms for height of 40 µm.

Micro-Epsilon UK Ltd
Cheshire   United Kingdom
Jun 24, 2009 Using several laser optical sensors, dimensionCONTROL 8260 for Ingots can inspect surface of silicon ingots by measuring side lengths, phase lengths, angles, diagonal lengths, and planarity of side areas. Automatic measuring system compares target data with actual measured values and then classifies ingot accordingly. Able to measure ingot lengths up to 2,500 mm, system calibrates itself automatically to common ingot sizes of 125 x 125 mm, 156 x 156 mm, and 210 x 210 mm.

The Modal Shop, Inc.
Cincinnati, OH 45241
Dec 03, 2008 Weight Compensation software option for resonant acoustic method (NDT-RAM(TM)) can automate system testing criteria modification based on variances in weight for powder metal components. It conserves time by automatically modifying templates based on part weight and allows software to identify real-time small resonant frequency shifts resulting from internal or external flaws due to cracks, voids, material density, dimensions, porosity, and nodularity.

Rudolph Technologies, Inc.
Flanders, NJ 07836
Sep 12, 2008 Suitable for any production environment, E30(TM) and B30(TM) modules are suited for inspection and in-line monitoring of 32 nm manufacturing processes from front end of line (FEOL) through final manufacturing. Edge defects as small as 2 µm on patterned, production wafers can be detected. Part of all-surface Explorer(TM) Inspection Cluster, modules can also be used with NSX(TM) Series inspection systems commonly used in outgoing quality assurance and back-end fab applications.

Brookfield Engineering Laboratories, Inc.
Middleboro, MA 02346
Sep 11, 2008 Model CT3 is offered with TexturePro CT v1.0 software designed for collecting data and analyzing test samples of various shapes/sizes with real-time graphic plotting for food, cosmetics, and pharmaceutical industries. Custom reports and graphs are created directly from menu screen, and sample identification set-up helps operators get started with test fields outlining parameters. Mean and standard deviation can be evaluated for each test result parameter of up to 30 samples.

GE Sensing
Billerica, MA 01821
Aug 07, 2008 Phasec 3 is single-frequency instrument for crack and corrosion detection and conductivity and coating measurements, while Phasec 3s adds dynamic rotating inspection capability and Phasec 3d adds dual-frequency capability to 3s for inspection at 2 different depths. Devices feature ¼ VGA TFT display with choice of 8 color combinations to differentiate between stored and active signals. Units have onboard memory for 200 setups and 200 traces, USB connectivity, and battery life up to 6 hr.

Brookfield Engineering Laboratories, Inc.
Middleboro, MA 02346
Jul 07, 2008 Including both Compression and Tension mode, CT3 Texture Analyzer offers load cells in 100, 1,000, 1,500, and 4,500 g as well as 10 kg limit. It features wide speed range for probe movement, USB port for direct connection to any PC, and optional temperature probe. With large vertical work area for large sample placement, stand-alone analyzer features 7 test modes such as normal, hold time, cycle count, bloom, TPA, tension, and static load calibrator check.

Detroit Precision Hommel
Rochester Hills, MI 48309
Jun 27, 2008 Able to measure roughness and contour of any shape in 1 pass, HOMMEL nanoscan can measure surfaces with stroke of 24 mm with resolution of 0.68 nm. Laser interferometer features resolution of 0.6 nm, allowing surface structures from submicrometer range to 24 or 48 mm to be recorded. CNC-controlled horizontal and vertical axes include digital scales providing resolution of 10 nm and probe arms are magnetically coupled on traverse unit to simplify handling, operation, and safety.

SICK, Inc.
Minneapolis, MN 55438
Jun 05, 2008 Providing pass/fail output, Inspector Vision Sensor verifies completeness and quality of product regardless of angle/orientation as it comes down line. Unit features 384 x 384 resolution, IP 67 metal housing, and integrated dome light that delivers high quality images even on glossy and reflective surfaces. Applications include verifying label position, date code presence and cap inspection in packaging, as well as bowl feeder inspection and verification of part assembly.

Detroit Precision Hommel
Rochester Hills, MI 48309
Feb 14, 2008 Consisting of optical sensor, computer, and slide to position sensor, IPS-10 internal inspection system installs within production line to inspect bores with diameter of 14-50 mm and depths to 450 mm. Images are scanned continuously by CMOS ring sensor array and system automatically detects surface flaws such as cavities, scratches, porosity, valleys, edge flaws, and unmachined surfaces. Included software sorts out defective parts and displays results as flaw statistics.

Zetec, Inc.
Issaquah, WA 98027 0140
Nov 15, 2007 DYNARAY(TM) Phased Array Ultrasound System can be configured with up to 256 simultaneously active channels. It can dynamically adapt focal laws sent to phased array probe during inspection sequence as function of probe position. Hardware is controlled by UltraVision® 3 software, which generates optimized acoustic beams through complex inspection surfaces and offers 3D work environment including creation of components and visualization of examination data.

Rudolph Technologies, Inc.
Flanders, NJ 07836
Jul 27, 2007 Offering full color, image-based inspection with real-time capture capability, Explorer(TM) Inspection Cluster uses adaptive wafer scheduling and offers flexible configurability. Individual systems can be configured with any combination of wafer backside and edge inspection capabilities to suit application. Designed for macro inspection, system is built on automated handling platform that supports 2 loadports and 3 independently configurable inspection/measurement modules.

KLA-Tencor Corp.
San Jose, CA 95134
Oct 02, 2006 With spatial bandwidth coverage from 0.22-2,000 microns and noise floor below 0.5 angstroms, Candela Optical Surface Analyzer 6300 Series delivers metrology and inspection capabilities for data storage substrates and finished media in both radial and circumferential directions. Multi-channel optics, combined with laser stability management technology, delivers measurement capabilities for edge roll-off and texture/polish uniformity, as well as scratch and particle inspection.

Rudolph Technologies, Inc.
Flanders, NJ 07836
Aug 15, 2006 Inspection tool-set, comprised of NSX(TM) and B20(TM) Systems, features backside color processing capability and auto-die classification. NSX Systems offer frontside inspection, B20 Systems offer backside inspection, and Harmony ASR(TM) (all-surface review) Software offers defect analysis and management. Combined with brightfield and darkfield capabilities, B20 Systems use color processing capability to increase sensitivity to subtle color defects such as chemical stains and micro arcings.

Thermo Electron Corp.
Waltham, MA 02454
Jul 26, 2006 Equipped with integral ion source, K-Alpha utilizes x-ray photoelectron spectroscopy to quantitatively determine surface chemical composition of top few nanometers of solid materials. Data processing algorithms enable full automation, from acquisition to data interpretation and reporting. Electron optics provide insight into complex surface chemistries in traditional materials as well as those used in biotech, nanotech, and pharmaceutical industries.

Bede
Durham DH1 1TW  United Kingdom
Jun 13, 2006 Sensitive to dislocations, precipitates, mechanically introduced cracks, and inclusions, BedeScan(TM) defect inspection system is capable of looking at process induced defects on surface of wafer and detects crystallographic abnormalities inside wafer that can lead to wafer breakage. System monitors pin marks, thermal slip dislocations, misfit dislocations, back-side and front-side scratches, as well as surface and buried mechanical edge damage.

Paul N. Gardner Co., Inc.
Pompano Beach, FL 33060 6608
May 25, 2006 Designed for high- to semi-gloss surfaces, wave-scan dual aids in analysis and trouble-shooting of appearance problems by evaluating surface quality at each step of paint process. Able to measure both curved and flat areas, it detects optical profile of surfaces for structure spectrum of 0.1-30 mm. Tool features USB port and software auto-chart, and offers selectable scales and scan lengths. Using Access DB for database management, unit provides QC reports in Excel®.

RKI Instruments, Inc.
Union City, CA 94587
May 25, 2006 Designed for atmospheric pressure operation, Model AC-2 consists of open counter equipped with UV source. It measures ionization potential and work function of surfaces in air, without vacuum, in as little as 5 min. With 50 x 50 mm capacity, unit can measure powder samples, films on surface, and any sample that emits photoelectrons such as metals, semiconductors, organics, magnetic and polarized materials as well as catalysts, pigments, and ceramics.

Unilux, Inc.
Saddle Brook, NJ 07663
Mar 22, 2006 Two-camera Q-EYE Video Inspection System enables mill operators to spot defects as small as 0.04 in. across strip 60 in. wide at production speeds up to 4,400 fpm. Each 8-bit, black-and-white camera offers 1,392 x 1,040 pixel resolution and will capture image size of 1,000 x 750 cm. Depending on type of processing line being inspected, system can store up to 12 hr of entire strip data in raw video and be programmed to store predetermined section of strip.