KMC Systems
Merrimack, NH 03054
Jun 23, 2009 Offering complete program for contract design, manufacture, and maintenance, KMC 360 is designed to support OEMs and start-ups throughout entire medical device and instrumentation product lifecycle by centralizing all outsourcing support. Approach is based on defined processes, continual communication, and cross-functional collaboration throughout each product lifecycle stage. Results include streamlined communication, strengthened product quality, and accelerated time-to-market.

Semiconductor Manufacturing International Corporation
Shanghai   China
Jun 16, 2009 Based on 2T PMOS flash (pFLASH(TM)) architecture, 0.18 µm embedded flash memory process provides non-volatile solution with endurance rated up to 100K cycles and data retention of up to 10 years. Design is optimized for configuration flexibility as well as minimal power consumption and space. Suitable applications include MCUs, USB keys, smartcards, and devices for automotive market.

austriamicrosystems AG
Premstatten   Austria
Jun 12, 2009 Through Silicon Via (TSV) technology enables two 8 in. wafers to be electrically connected. With typical TSV depths of 200-300 µm, it addresses variety of markets requiring 3D integration of CMOS ICs, photo sensors, gas sensors, power devices, or MEMS components such as automotive, industrial, and consumer applications. Flexible manufacturing concept allows for customer specific modifications, and varying wafer thicknesses can be supported.

TSMC
Hsinchu   Taiwan
Apr 16, 2009 Suited for power-sensitive, automotive, and analog applications, 0.18-micron embedded flash (embFlash) process technology family includes baseline 1.8-5 V standard process, ultra-low leakage process, and specific automotive-qualified embedded Flash IP. Process features one low-voltage Flash IP that fully functions at 1.8 V; several Flash IP macros and customization service are available. Process suits large appliance motor controls on refrigerators, washing machines, and A/C units.

MagnaChip Semiconductor
Cheongju-si,Chungbuk   Korea (south)
Dec 09, 2008 Offered to foundry customers, 0.18 and 0.35 µm aBCD (Advanced Bipolar CMOS-DMOS) process technologies adopt DTI (Deep Trench Isolation) process to satisfy reliability and latch-up requirements. Both voltage-scalable solutions are optimized for low Rsp (Specific Ron), promoting drive capability for power management ICs, and reduce high voltage transistor pitch with DTI technology. Switching speed is achieved by removing parasitic resistance and capacitance between high voltage wells.

Raymarine Inc.
Nashua, NH 03063
Nov 11, 2008 Featuring flush-mounted, 6.42 x 3.84 in. design, G-Series Compact Keyboard offers control of up to 4 G-Series displays and 4 GPM400 processors. LED indicators enable captains to determine which display and GPM400 is currently under command. Keyboard also offers color coded softkeys for control that simplify navigation.

Silterra Malaysia Sdn Bhd
Kedah Darul Aman   Malaysia
Aug 21, 2008 Featuring 2.13 micron square SRAM bitcell optimized for high density embedded memory design for high resolution WQVGA, HVGA, and VGA TFT panels with 2.5 in. panel size and above, CL130H32 is 0.13 micron high voltage technology. It offers Asymmetry High Voltage Well for denser design, one-time-programmable cell for gamma color tuning and voltage trimming, ESD protection, and metal capacitors design guideline.

austriamicrosystems AG
Schloss Premstaetten A 8141  Austria
Jul 23, 2008 To ensure ESD robustness of complex analog/mixed-signal designs in power management, automotive or medical applications, 0.35 µm High-Voltage CMOS process technology (H35) offers 4 kV HBM ESD protection level for 50 V max supply voltage. This periphery library includes fully scalable High-Voltage NMOS and PMOS devices, floating logic libraries, as well as optimal power-on resistance. Process allows integration of 3.3/5/20/50/120 V devices on one chip.

Molex Inc.
Lisle, IL 60532-1682
Jul 11, 2008 Optimized for fatigue strength, Solder Charge Surface Mount Technology (SMT) attach method exhibits sloping solder filet that provides durable attach method for its sheer strength and pull-force. Use results in increased PCB retention strength, precise formation of stamping die, and mechanical designs that allow for visual inspections post processing. Flexible solder mass compensates for board warping, and solution is available in tin-lead or lead-free designs.

CML USA, Inc.
Davenport, IA 52804
May 08, 2008 Capable of bending wide range of profiles and materials to centerline radius as small as 4 times diameter of workpiece, Ercolina CE35 Angle Rolls offer capacity of 1½ in. schedule 40 pipe and 1½ in. angle iron. Units are designed to operate in vertical or horizontal position with roll speed up to 20 fpm. All include remote foot pedal for hands-free operation. With single-phase 220 V connection, machines are suited for shop and jobsite fabrication.

Thuro Metal Products, Inc.
Brentwood, NY 11717
Apr 25, 2008 Fittings and connectors, including Dynatube, Parker, and Statoflex Tube Fittings, are used in aerospace and aircraft applications. They can be made to engineering specs or from blueprint drawings, with tolerance held to ±.0001 in. and surface finishes down to 5 RMS. Specialties include machining Titanium and 17-4PH, and secondary capabilities include safety wire hole drilling. All products meet world class quality standards, ISO 9001:2000 Certified.

Pickering Interfaces Inc
GRANTS PASS, OR 97526
Mar 06, 2008 Offered as 4- or 8-slot BRIC module, 40-569 integrates 16-wire analog bus with BUS Matrix cards and Resource Distributor cards. Scalable design permits inclusion of up to 2 off Resource Distributor subsystems and 6 off Bus Matrix subsystems. Also available, 40-618 Source Switching Module implements switching functions defined in Appendix D of ARINC specification. Each module can be supported in any 3U PXI chassis or Pickering Interfaces LXI Modular Switching Chassis.

Photo Sciences, Inc.
Torrance, CA 90505
Nov 20, 2007 Multifaceted microlithography techniques pattern photoimageable color polymer-coated substrates using direct-write laser, direct-write e-beam, optical reduction, and full field exposure lithography. Photoimageable color polymers provide means of producing microscopic patterns in various standard colors as well as custom polymer colors. Line widths can be produced as small as 2 microns in color polymers, offering compatible with nanoscale applications.

Silterra Malaysia Sdn Bhd
Kedah Darul Aman   Malaysia
Nov 09, 2007 Suited for devices used in construction of TFT panels, 0.16 µm High Voltage Technology features 3.17 µm² SRAM bitcell which facilitates high density embedded memory design in display driver for QVGA (240 RGB x 320) and WQVGA (320 RGB x 432, Wide-Quarter-VGA) TFT panels. Technology offers asymmetry high voltage well for denser design, one-time-programmable cell for gamma color tuning, ESD protection, and metal capacitors design guidelines.

Elma Electronic Inc.
Fremont, CA 94538
Aug 15, 2007 Suited for medical products, industrial enclosures, and various commercial applications, Type 35 Variety Case allows exact sizing of enclosure. Aluminum extrusions are cut to any specified length, and can accept tapped strips, sealing cords for EMC, optional direct mounting of panel or PCB, grounding terminals, or screws. Enclosures have conductive inner surface and sufficient contact points for EMC, and removable side panels that allow access to inside components.

Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Chu 300, R.O.C.  Taiwan
Aug 09, 2007 With advanced standard cell, standard I/O, and SRAM compiler, Reference Flow v8.0 provides mature design flows for mainstream technologies from 0.13-0.25 micron. It offers intra-die statistical timing analysis along with statistical leakage and statistical timing optimization. Automated DFM (design for manufacturability) hot spot fixing eliminates need for manual correction, while DFM electrical variability consideration monitors parametric performance shifts caused by DFM effects.

Parker Hannifin Corp., Cylinder Division
Des Plaines, IL 60016 3198
Jun 18, 2007 Designed for clamping, load holding, or E-stop applications, Series 3MA and 4MA cylinders hold loads in static condition while air pressure is removed from system. Available in 7 bore sizes ranging from 1.125-5.00 in., low friction 3MA cylinders have maximum operating air pressure of 250 psi and operating temperature range of -10 to +165°F. Intended for customization, 4MA units feature -50 to +250°F temperature range, standard and oversize rods, and externally removable rod gland.

Zarlink Semiconductor
Ontario K2K 3H4  Canada
Jun 05, 2007 With modular WPX power management process, designs can be developed using minimal layers in applications such as DC-DC power bricks, mobile telephone battery power management, linear and switching regulators, and other linear power management applications. This low-capacitance, linear bipolar process features lateral PNP transistors, poly resistors, and nitride capacitors. Its 2-layer metal allows low-current circuits to be built with high packing densities.

austriamicrosystems AG
Premstatten   Austria
May 18, 2007 Utilizing 0.35 µm SiGe-BiCMOS process technology, 2.7, 3.3, 5, and 12 V devices can be integrated on single chip without any process changes. Devices rated at 12 V enable high frequency operations, such as NPNs with BVceo of 14 V and ft/fmax of 15/32 GHz and RF-PLMDOS with BVds of 18 V and ft/fmax of 11/28 GHz. SiGe-BiCMOS technology is suited for users developing products such as line drivers for xDSL modems, Ethernet applications, and power amplifiers.

Optotherm, Inc.
Sewickley, PA 15143
Apr 02, 2007 PCB Test Arm Probe provides probing of surface mount devices (SMDs), and connects test instruments to variety of SMDs including PLCC, SOIC, QFP, and VIAS or test point holes. With length of 8.33 in., height of 2.92 in., and base length of 2.53 in., it includes spring loaded tip, rotatable head, and fine vertical adjustment knob, and is available in 3 and 10 A models. Connection post supports single or multiple test leads.