Custom Product Manufacturing|
Custom Product Manufacturing
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Wafer Backgrind/Polishing Services cover 300 mm processes.
Corwil Technology Corp.
Milpitas, CA 95035
Nov 15, 2013
Made possible via Disco DAG 810 automatic grinder, wafer thinning services include 300 mm wafer backgrinding. This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to <50 Ám on up to 300 mm wafers, individual die thinning, irregular shapes and wafer sizes, exotic materials (SiGe, GaN, GaAs, SiC, sapphire, glass), and multiple backside finishes and backgrind tapes.
Tube and Pipe Cutting Service handles 1-100 in. cut lengths.
Reading, PA 19605
Sep 30, 2013
Utilizing rotary head cut-off machines featuring stationary pipe/tube and rotating tools, GRI provides high volume tube and pipe processing, serving variety of markets and applications, including Oil Country, automotive, and general industry. Service can cut 1–8.5 in. diameter tube or pipe with up to 1.2 in. wall thickness, and can provide square cuts with optional ID and OD chamfer or ID C-bore.
Negative I-Line Photoresist has hydrophobic cured chemistry.
Engineered Material Systems
Delaware, OH 43015
Jun 25, 2013
With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance toámoisture andácorrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165░C andámoderate modulus of 4.5 GPa at 25░C. NR series comes in solids/viscosities that achieve 2–40 Ám thickness in single layer.
Multi-Core Microcontroller drives vehicle safety.
Lexington, MA 02421
Mar 01, 2013
Enabling ISO 26262 functional safety compliance in automotive systems, 32-bit SPC56EL70 combines dualácores with 2 MB Flash and 192 KB internal RAM memory, 3 CAN interfaces, and peripheral set for safety and motor-control applications, supporting up to 2 brushless 3-phase motors. MCU covers applications that need to respect automotive safety integrity levels up to and including ASIL D level, such as anti-lock braking, electric power steering, active suspension, and driver assistance systems.
Product Verification System inspects 200,000 softgels/hour.
Walla Walla, WA 99362
Feb 22, 2013
Designed to verify softgels continuously, in-line after single encapsulator or off-line in batch mode, VeriSym SE Optical Inspection System detects color, size, and shape and removes defects such as spots, color variations, air bubbles, and misshapen softgels. When defective product or unconfirmed object is identified, system activates close-coupled high-speed air ejector system to remove it from product stream. Portableásystem's 9 x 3 ft footprint includes infeed hopper and reject manifold.
SMT Screw Terminal Blocks support PCB I/O interconnects.
WECO Electrical Connectors, Inc.
Mooers, NY 12958
Aug 28, 2012
Featuring 5.0 mm pitch and rectangular flat leads, SMarTconn« 974-D-SMD-DS Series supports 0.20 mm co-planarity specification. Units have fixed terminal bodies and 45░ inclined tower for wire entry and screwdriver access. Available in 2-6 poles, terminal blocks are constructed for reflow processes used in automated manufacturing systems. Series enables printed circuit board designers to migrate interconnect components from through-hole to genuine surface mount technology.
Custom Metal Formed Parts are made with 6-stage press technology.
ARNOLD UMFORMTECHNIK GmbH & Co. KG
D-74670 Forchtenberg-Ernsbach Germany
Aug 24, 2012
With virtually no limit to potential uses or designs, Conform products consist of complex, multifunctional, precision parts produced by metal forming. After initial coordination with customer, company carries out series production check. Development process then moves to production of functional samples in near-series quality, which can be produced with same properties as mass production parts to be manufactured later on as formed parts.
Custom Metal Enclosure Service exactly matches supplied specs.
OKW Enclosures, Inc.
Bridgeville, PA 15017
Jul 06, 2012
Bespoke Enclosures Service helps develop unique housing that exactly matches provided requirements. Enclosures can be manufactured to order, including desktop, portable, wall mount, and 19 in. rack mount cases, utilizing standard extrusion profiles and diecastings as well as fabricated sheet metal parts. Design engineer can specify all mounting parameters for electronic components, assemblies, and PCBs, and service can also supply steel or aluminum internal chassis and mounting plates.
CMOS Fabrication Service offers 8 kV ESD protection.
Schloss Premstaetten A 8141 Austria
May 11, 2012
With 0.35 Ám High-Voltage CMOS fabrication service, austriamicrosystems offers latch up-free ESD protection up to 8 kV at 50 V and up to 4 kV at 120 V operating voltage in integrated circuits fabricated on H35 process. ESD protection cells guarantee 1 kV, 2 kV, 4 kV, and 8 kV HBM ESD protection compliant with MIL-883H, Method 3015.8, JEDEC JESD22-A114F ESD, and AEC-Q100 standards, as well as protection up to 500 V according to Charged Device Model.
Triple Gate Oxide CMOS Process suits mixed signal applications.
Cheongju-si,Chungbuk Korea (south)
Mar 23, 2012
Able to support wide voltage ranges, 0.13 Ám triple gate oxide CMOS process is fully compatible with standard CMOS process and designed to keep all device parameters unchanged within process variation ranges. Additional layer of gate oxide introduces 1.8 V CMOS into standard 1.2/3.3 V CMOS array on 0.13 Ám technology. Using modular characteristic for IC design provides flexibility, allowing selection of 1.2/3.3 V or 1.2/1.8/3.3 V CMOS processes without design reverification.
Outdoor Equipment Enclosures come in application-specific sizes.
INTERTEC Instrumentation Ltd
Sarnia, ON N7T 7H5
Dec 02, 2011
Able to be specified to millimeter accuracy, Multibox Vario environmental protection enclosures accommodate size and form factor needs to precisely match instrumentation content and layout demands of instrumentation and control engineers' applications. Dimensions range from 100 x 100 x 100 mm with 20 mm thick walls to 2,000 x 1200 x 800 mm with 102 mm thick walls, and sandwich type construction is based on UV-resistant glass-fiber reinforced plastic skins and internal insulative foam core.
High-Voltage CMOS Technology targets power grid applications.
Schloss Premstaetten A 8141 Austria
Oct 24, 2011
Built on 0.35 Ám High-Voltage CMOS technology, inter-metal dioxide (IMD) layers enhances galvanic isolation to over 600+ Vrms. Process lets designers forego optocoupler and directly integrate 2 individual ICs within one package for complex analog/mixed signal applications to achieve synchronized performance for information exchange as long as one IC has special IMD layers. Isolated communications may be based on inductive coupling between 2 coils or capacitive coupling of 2 capacitors.
ASIC Protyping Service covers CMOS, high-voltage, Flash, and RF.
Schloss Premstaetten A 8141 Austria
Nov 29, 2010
Multi-Project Wafer (MPW) services include 6 prototyping runs in 0.18 Ám CMOS (C18) process and 4 MPW runs in 0.18 Ám high-voltage CMOS (H18) technology. H18 process technology is based on IBM 0.18 Ám CMOS CMOS7RF process and is suited for smart power management ICs, while 0.35 Ám specialty processes from TSMC is suited for power management products and display drivers. Other options include 20 and 50 V CMOS, 120 V module, and high-voltage CMOS process with Embedded Flash functionality.
Semiconductor Design System helps speed mobile Internet devices.
IBM (Corporate Headquarters)
Armonk, NY 10504-1783
Nov 19, 2010
Suited for creating advanced semiconductors, Cu-32 Custom Logic aids production of chips used in fiber-optic and wireless networks, and in routers and switches. It allows use of embedded DRAM, with up to 600 MHz of random cycle performance, that supports up to 1 GB of memory on single chip. Developers can also use high-speed serial cores in designs, and high-k metal gate, silicon-on-insulator (SOI) process that helps improve energy efficiency in chips.
Foundry Services support molecular beam epitaxial platforms.
RF Micro Devices, Inc.
Greensboro, NC 27409-9421
Oct 15, 2010
In addition to working with customers to develop epitaxial structures and MBE growth conditions, MBE Foundry Services support delivery of epitaxial wafers grown to exact customer specifications and development of epitaxial design of experiments. Ultra-high vacuum cleaning services include wet mechanical cleaning, wet bead blasting, acid wet chemical etch, and base wet chemical etch on variety of stainless steel, refractory metal, and PBN ceramic parts.
Electronic Assembly Packaging vertically stacks components.
Express Manufacturing, Inc.
Santa Ana, CA 92704
Oct 05, 2010
To meet compact design demands of portable and desktop medical devices, Package on Package (PoP) assembly packaging technology vertically stacks discrete controller and memory Ball Grid Array (BGA) components. This allows multi-chip packages to be integrated for space conservation on PCB and simplifies assembly processes using single flow/reflow, which eliminates thermal stress during assembly. Dedicated assembly flow is designed based on thermal coefficient characteristics of components.
Foundry Service adds integrated passive device process technology. .
ON Semiconductor, LLC
Phoenix, AZ 85008
Jul 09, 2010
Building upon HighQ(TM) copper on silicon integrated passive device (IPD) technology, HighQ IPD2 process utilizes 8 in. wafer technology and features second 5 Ám copper layer that promotes inductor performance and flexibility. It supports design of precise IPDs for RF system in package applications in portable electronics equipment. Typical designs include baluns, low pass filters, band pass filters, and diplexers used in portable and wireless applications.
Custom Pallet Covers maintain shipped product temperatures.
Milwaukee, WI 53223
May 24, 2010
Custom-designed to match any size pallet, insulated pallet covers feature materials and flexible structure that help maintain proper temperature of heated or cooled palletized products anywhere throughout supply chain. Covers have collapsible design with handles and are made of fire-retardant industrial vinyl that prohibits water absorption. While multi-layered construction lends to durability, anti-microbial batting delivers thermal insulation.
Design, Manufacturing Services expertly serve electronics industry.
Dallas, TX 75234
May 19, 2010
Enabled by highly skilled engineers, Engineering Design Services (EDS) accommodate those looking for expert advice on tightening their own embedded design or seeking turnkey concept-to-production service. Full-service Electronics Contract Manufacturing (ECM), also available, continually meets/exceeds contract manufacturing requirements for boards, sub-assemblies, and systems using quality processes in ISO-9001, TL-9000, and ISO-14000 certified facilities.
Polycarbonate Cover protects indoor/outdoor devices.
Safety Technology International
Waterford, MI 48327
May 10, 2010
Universal Stopper« (STI-13000 series) offers protection against accidental and intentional physical damage, dust and grime as well as severe environments inside and out. They are available with or without horn, in flush mount, surface mount or waterproof backbox, and red, blue, green, yellow, white or black color options for horn/label hood, spacer and backbox. Measuring less than 4 in., unit protects dual action pull stations, keypads, electrical light switches, and duplex plugs.
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