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Services -> Manufacturing -> Custom Product Manufacturing

Custom Product Manufacturing

(Showing headlines 1 - 20)   more ....
Cleanroom Operations produce film for medical devices.

Cleanroom Operations produce film for medical devices.

Polyzen, Inc.    Apex, NC 27539
Jun 13, 2014 Providing film extrusion in Class 10,000 environment, Cleanroom Manufacturing Operations support prototype development, scale-up, and manufacturing of film for use in regulated medical devices, including wound care and implants. Extrusion line is capable of producing film up to 52 in. wide in thicknesses from 0.0005–0.070 in., with in-line X-ray gauge dimension reporting. Line processes wide range of materials, including TPUs, TPEs, polyolefins, fluoropolymers, and bioresorbable polymers.

Contract Manufacturing Services support PCB assembly.

Contract Manufacturing Services support PCB assembly.

Oven Industries    Mechanicsburg, PA 17055
Jun 11, 2014 To maximize assembly efficiencies in Electronic Contract Manufacturing, Oven Industries has added Automatic Optical Inspection and PCB cleaning capabilities. AOI equipment supports solder and lead defect detection, component presence and position, and read nomenclature all at 4 in.▓/sec and more than 200,000 components/hr. With zero discharge, Deionizer Board Cleaner eliminates need for wastewater management. It offers fully automatic wash, rinse, and dry and is compatible with all flux types.

Agronomic Service provides 3-D soil mapping and analysis.

Trimble Navigation Limited    Sunnyvale, CA 94085-3913
Jun 11, 2014 Part of Connected Farm™ solution, Soil Information System™ provides farmers and advisors with in-depth 3-D soil data they can use to make informed decisions about crop production goals. Technology uses advanced sensors along with intelligent targeting and geo-processing algorithms to produce high-resolution soil and topographic maps. Some examples of map types include: root zone depth, soil texture, plant available water, macro and micro-nutrient levels, and salt and toxicity concentrations.

Custom Case Made Menu Covers are durable and washable.

Custom Case Made Menu Covers are durable and washable.

Advanced Looseleaf Technologies Inc.    Dighton, MA 02715
Apr 30, 2014 ALT Restaurant Menu Covers feature turned-edge, case made construction from leather-like, padded, or smooth materials. Made to order products — menu covers, wine list covers, table tents, bistro menus, check presenters, and order pads — can be supplied as matched sets. Able to be debossed, foil imprinted, or screen printed, products can also be designed for standard or custom paper sizes. Other options include die-cut windows, bar pockets with corner guards, and medallions.

Wafer Backgrind/Polishing Services cover 300 mm processes.

Corwil Technology Corp.    Milpitas, CA 95035
Nov 15, 2013 Made possible via Disco DAG 810 automatic grinder, wafer thinning services include 300 mm wafer backgrinding. This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to <50 Ám on up to 300 mm wafers, individual die thinning, irregular shapes and wafer sizes, exotic materials (SiGe, GaN, GaAs, SiC, sapphire, glass), and multiple backside finishes and backgrind tapes.

Tube and Pipe Cutting Service handles 1-100 in. cut lengths.

GRAEBENER-REIKA, Inc.    Reading, PA 19605
Sep 30, 2013 Utilizing rotary head cut-off machines featuring stationary pipe/tube and rotating tools, GRI provides high volume tube and pipe processing, serving variety of markets and applications, including Oil Country, automotive, and general industry. Service can cut 1–8.5 in. diameter tube or pipe with up to 1.2 in. wall thickness, and can provide square cuts with optional ID and OD chamfer or ID C-bore.

Negative I-Line Photoresist has hydrophobic cured chemistry.

Negative I-Line Photoresist has hydrophobic cured chemistry.

Engineered Material Systems    Delaware, OH 43015
Jun 25, 2013 With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance toámoisture andácorrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165░C andámoderate modulus of 4.5 GPa at 25░C. NR series comes in solids/viscosities that achieve 2–40 Ám thickness in single layer.

Multi-Core Microcontroller drives vehicle safety.

STMicroelectronics    Lexington, MA 02421
Mar 01, 2013 Enabling ISO 26262 functional safety compliance in automotive systems, 32-bit SPC56EL70 combines dualácores with 2 MB Flash and 192 KB internal RAM memory, 3 CAN interfaces, and peripheral set for safety and motor-control applications, supporting up to 2 brushless 3-phase motors. MCU covers applications that need to respect automotive safety integrity levels up to and including ASIL D level, such as anti-lock braking, electric power steering, active suspension, and driver assistance systems.

Product Verification System  inspects 200,000 softgels/hour.

Product Verification System inspects 200,000 softgels/hour.

SYMETIX    Walla Walla, WA 99362
Feb 22, 2013 Designed to verify softgels continuously, in-line after single encapsulator or off-line in batch mode, VeriSym SE Optical Inspection System detects color, size, and shape and removes defects such as spots, color variations, air bubbles, and misshapen softgels. When defective product or unconfirmed object is identified, system activates close-coupled high-speed air ejector system to remove it from product stream. Portableásystem's 9 x 3 ft footprint includes infeed hopper and reject manifold.

SMT Screw Terminal Blocks support PCB I/O interconnects.

SMT Screw Terminal Blocks support PCB I/O interconnects.

WECO Electrical Connectors, Inc.    Mooers, NY 12958
Aug 28, 2012 Featuring 5.0 mm pitch and rectangular flat leads, SMarTconn« 974-D-SMD-DS Series supports 0.20 mm co-planarity specification. Units have fixed terminal bodies and 45░ inclined tower for wire entry and screwdriver access. Available in 2-6 poles, terminal blocks are constructed for reflow processes used in automated manufacturing systems. Series enables printed circuit board designers to migrate interconnect components from through-hole to genuine surface mount technology.

Custom Metal Formed Parts are made with 6-stage press technology.

Custom Metal Formed Parts are made with 6-stage press technology.

ARNOLD UMFORMTECHNIK GmbH & Co. KG    D-74670 Forchtenberg-Ernsbach   Germany
Aug 24, 2012 With virtually no limit to potential uses or designs, Conform products consist of complex, multifunctional, precision parts produced by metal forming. After initial coordination with customer, company carries out series production check. Development process then moves to production of functional samples in near-series quality, which can be produced with same properties as mass production parts to be manufactured later on as formed parts.

Custom Metal Enclosure Service exactly matches supplied specs.

Custom Metal Enclosure Service exactly matches supplied specs.

OKW Enclosures, Inc.    Bridgeville, PA 15017
Jul 06, 2012 Bespoke Enclosures Service helps develop unique housing that exactly matches provided requirements. Enclosures can be manufactured to order, including desktop, portable, wall mount, and 19 in. rack mount cases, utilizing standard extrusion profiles and diecastings as well as fabricated sheet metal parts. Design engineer can specify all mounting parameters for electronic components, assemblies, and PCBs, and service can also supply steel or aluminum internal chassis and mounting plates.

CMOS Fabrication Service offers 8 kV ESD protection.

austriamicrosystems AG    Schloss Premstaetten A 8141  Austria
May 11, 2012 With 0.35 Ám High-Voltage CMOS fabrication service, austriamicrosystems offers latch up-free ESD protection up to 8 kV at 50 V and up to 4 kV at 120 V operating voltage in integrated circuits fabricated on H35 process. ESD protection cells guarantee 1 kV, 2 kV, 4 kV, and 8 kV HBM ESD protection compliant with MIL-883H, Method 3015.8, JEDEC JESD22-A114F ESD, and AEC-Q100 standards, as well as protection up to 500 V according to Charged Device Model.

Triple Gate Oxide CMOS Process suits mixed signal applications.

MagnaChip Semiconductor    Cheongju-si,Chungbuk   Korea (south)
Mar 23, 2012 Able to support wide voltage ranges, 0.13 Ám triple gate oxide CMOS process is fully compatible with standard CMOS process and designed to keep all device parameters unchanged within process variation ranges. Additional layer of gate oxide introduces 1.8 V CMOS into standard 1.2/3.3 V CMOS array on 0.13 Ám technology. Using modular characteristic for IC design provides flexibility, allowing selection of 1.2/3.3 V or 1.2/1.8/3.3 V CMOS processes without design reverification.

Outdoor Equipment Enclosures come in application-specific sizes.

INTERTEC Instrumentation Ltd    Sarnia, ON N7T 7H5
Dec 02, 2011 Able to be specified to millimeter accuracy, Multibox Vario environmental protection enclosures accommodate size and form factor needs to precisely match instrumentation content and layout demands of instrumentation and control engineers' applications. Dimensions range from 100 x 100 x 100 mm with 20 mm thick walls to 2,000 x 1200 x 800 mm with 102 mm thick walls, and sandwich type construction is based on UV-resistant glass-fiber reinforced plastic skins and internal insulative foam core.

High-Voltage CMOS Technology targets power grid applications.

austriamicrosystems AG    Schloss Premstaetten A 8141  Austria
Oct 24, 2011 Built on 0.35 Ám High-Voltage CMOS technology, inter-metal dioxide (IMD) layers enhances galvanic isolation to over 600+ Vrms. Process lets designers forego optocoupler and directly integrate 2 individual ICs within one package for complex analog/mixed signal applications to achieve synchronized performance for information exchange as long as one IC has special IMD layers. Isolated communications may be based on inductive coupling between 2 coils or capacitive coupling of 2 capacitors.

ASIC Protyping Service covers CMOS, high-voltage, Flash, and RF.

austriamicrosystems AG    Schloss Premstaetten A 8141  Austria
Nov 29, 2010 Multi-Project Wafer (MPW) services include 6 prototyping runs in 0.18 Ám CMOS (C18) process and 4 MPW runs in 0.18 Ám high-voltage CMOS (H18) technology. H18 process technology is based on IBM 0.18 Ám CMOS CMOS7RF process and is suited for smart power management ICs, while 0.35 Ám specialty processes from TSMC is suited for power management products and display drivers. Other options include 20 and 50 V CMOS, 120 V module, and high-voltage CMOS process with Embedded Flash functionality.

Semiconductor Design System helps speed mobile Internet devices.

IBM (Corporate Headquarters)    Armonk, NY 10504-1783
Nov 19, 2010 Suited for creating advanced semiconductors, Cu-32 Custom Logic aids production of chips used in fiber-optic and wireless networks, and in routers and switches. It allows use of embedded DRAM, with up to 600 MHz of random cycle performance, that supports up to 1 GB of memory on single chip. Developers can also use high-speed serial cores in designs, and high-k metal gate, silicon-on-insulator (SOI) process that helps improve energy efficiency in chips.

Foundry Services support molecular beam epitaxial platforms.

RF Micro Devices, Inc.    Greensboro, NC 27409-9421
Oct 15, 2010 In addition to working with customers to develop epitaxial structures and MBE growth conditions, MBE Foundry Services support delivery of epitaxial wafers grown to exact customer specifications and development of epitaxial design of experiments. Ultra-high vacuum cleaning services include wet mechanical cleaning, wet bead blasting, acid wet chemical etch, and base wet chemical etch on variety of stainless steel, refractory metal, and PBN ceramic parts.

Electronic Assembly Packaging vertically stacks components.

Express Manufacturing, Inc.    Santa Ana, CA 92704
Oct 05, 2010 To meet compact design demands of portable and desktop medical devices, Package on Package (PoP) assembly packaging technology vertically stacks discrete controller and memory Ball Grid Array (BGA) components. This allows multi-chip packages to be integrated for space conservation on PCB and simplifies assembly processes using single flow/reflow, which eliminates thermal stress during assembly. Dedicated assembly flow is designed based on thermal coefficient characteristics of components.

(Showing headlines 1 - 20)   more ....

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