New mTOP Probe Hardware Platform Features USB Interface and Remote Accessibility

New mTOP Probe Hardware Platform Features USB Interface and Remote Accessibility

Smaller (compact) design make it is suitable for field testing, monitoring and troubleshooting network conditions. Incorporates testing features for multiple TDM optical and packet interfaces along with PC hardware in a single box. Unit includes different GL’s USB based test equipment (PacketExpert™, tProbe™ (T1 E1), USB T3 E3, Dual UTAs, and LightSpeed1000™).

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Solder Redefined
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Solder Redefined

Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.

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