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MEP
Materials & Material Processing -> Soldering Equipment & Supplies -> Soldering Supplies


Soldering Supplies



Sub-Categories
Other Soldering Consumables




(Showing headlines 1 - 20)   more ....
VOC-Free Solder Paste has environmentally safe formulation.

VOC-Free Solder Paste has environmentally safe formulation.

AIM, Inc.    Cranston, RI 02920
May 20, 2013 Able to withstand thermal preheats required for palletized selective soldering, NC277 halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. While designed to be no-clean, non-visible residue flux, product can be cleaned if critical to product application.

Solder Paste minimizes post-process residue and graping.

Solder Paste minimizes post-process residue and graping.

AIM, Inc.    Cranston, RI 02920
May 16, 2013 Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigating head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

Water-Soluble Solder Paste minimizes voids.

Water-Soluble Solder Paste minimizes voids.

Indium Corporation    Clinton, NY 13323
May 03, 2013 Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance.

Tin/Bismuth Solder Paste features low-melting formulation.

Tin/Bismuth Solder Paste features low-melting formulation.

Fct Assembly    Greeley, CO 80631
May 02, 2013 With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life.

Flux-Cored Wires offer low manganese levels.

Flux-Cored Wires offer low manganese levels.

Hobart Brothers Co.    Troy, OH 45373-2900
Apr 29, 2013 Available in 0.045 and 1/16 in. diameters, Element™ gas-shielded, flux-cored wires address stringent environmental requirements and recommendations set forth by ACGIH and OSHA. Each 71-type wire offers tensile strength in 70,000–75,000 psi range, while 81-type products produce welds with tensile strength from 80,000–85,000 psi. In addition to low spatter, consistent arc stability, and out-of-position welding capability, wires feature low hydrogen levels of 5.0 mg per 100 g of weldment.

No-Clean Solder Paste suits PoP applications.

No-Clean Solder Paste suits PoP applications.

Indium Corporation    Clinton, NY 13323
Mar 20, 2013 Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping.

Reflow Soldering System offers void-free results. .

Reflow Soldering System offers void-free results. .

SEHO Systems GmbH    Kreuzwertheim 97892  Germany
Feb 20, 2013 Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures homogeneous heat distribution with large volume of ventilated process gas.

Flux-Cored Wires offer high deposition rates.

Flux-Cored Wires offer high deposition rates.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Feb 18, 2013 Available in standard diameters of 0.045, 0.052, and 1/16 in., UltraCore® HD-12C and UltraCore® HD-12M are E71T-12C-JH8 and E71T-12M-JH8 flux-cored wires offering weld deposition rates of more than 14 lb/hr out-of-position. UltraCore® HD-12C is optimized for use with 100% CO2, while UltraCore® HD-12M uses mix of 75-80% Ar/balance CO2. Both mild steel FCAW-G products offer low-temperature-impact toughness exceeding 30 lbf-ft at -40°F.

Solder Alloy is available in Pb-free bar form.

AIM, Inc.    Cranston, RI 02920
Oct 22, 2012 Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickel and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does not require nitrogen atmosphere and will not erode copper from holes, pads, and tracks.

Gas-Shielded, Flux-Cored Wire suits pressure vessel fabrication.

Gas-Shielded, Flux-Cored Wire suits pressure vessel fabrication.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Oct 12, 2012 Suited for applications requiring post-weld heat treatment (PWHT) of mild steel, .045 in. dia UltraCore® SR-12 exceeds AWS E71T-12M-JH8 strength and low-temperature impact toughness requirements in as-welded and stress-relieved conditions with impacts of 80–150 lbf-ft @ -40°F. This 75%–80% Argon/balance CO2 gas-shielded flux-cored (FCAW-G) welding wire offers arc performance and bead shape which promote usability for welders of all skill levels.

Solder Paste exhibits low voiding properties.

Solder Paste exhibits low voiding properties.

Nihon Superior Co. Ltd    Suita City   Japan
Sep 21, 2012 Designed for use in vacuum reflow with nitrogen, SN100C P810 D4 no-clean, lead-free solder paste reduces voiding to less than 1% in measured void area. Properties include melting point of 227°C, flux content of 11.5% mass, and spread factor of 75%. Generally, product can be reflowed with profile similar to that commonly used with SAC305 and SAC405 with 245°C peak. It is also formulated to deliver optimal reflow with minimum mid-chip balling.

Lead-Free Solder Paste offers low voiding characteristics.

Nihon Superior Co. Ltd    Suita City   Japan
Jul 06, 2012 Formulated to deliver optimal reflow with minimum mid-chip balling, SN100C P810 D4 is based on silver-free and lead-free solder alloy SN100C®. Product also exhibits optimal wetting on all common substrates. Tests indicate that when used in combination with vacuum reflow paste can produce solder joints on 19 x 19 mm pads and joints to power transistors with less than 1% voiding.

Welding Wire suits shipbuilding and general fabrication.

Welding Wire suits shipbuilding and general fabrication.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Jun 11, 2012 Delivering flat bead face when used in all positions, UltraCore® HD-M is 75% Argon/25% CO2 gas-shielded flux-cored wire that features fast freezing slag and provides deposition rates of more than 10 lb/hr. Wire is available in 15, 33, and 50 lb packages and in standard diameters of .045, .052, and 1/16 in. UltraCore® HD-M conforms to AWS A5.20/A5.20M: E71T-1M/9M-H8 classification and is ABS approved to 3YSA H10.

VOC-Free Flux passes SIR and corrosion testing requirements.

VOC-Free Flux passes SIR and corrosion testing requirements.

AIM, Inc.    Cranston, RI 02920
Jun 01, 2012 Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.

Tacky Flux targets lead-free solders.

Tacky Flux targets lead-free solders.

Cobar Solder Products    Londonderry, NH 03053
May 09, 2012 Available in blue color for inspection purposes when required, Tempotac 120-TEM removes bridges in QFP rework and can be used instead of solder paste during BGA placement. Product is also suitable for reballing where availability of BGAs with lead-free spheres is limited. Safe for use, Tempotac passes all SIR tests. Any residues left can be removed using typical flux-remover.

Gas-Shielded Flux-Cored Wire offers low hydrogen weld deposits.

Gas-Shielded Flux-Cored Wire offers low hydrogen weld deposits.

Hobart Brothers Co.    Troy, OH 45373-2900
Apr 09, 2012 Designed for optimal weld quality on offshore drilling rig applications and jack-up rig fabrication, FabCO® 712M welding wire has less than 4 ml diffusible hydrogen per 100 g of weldment. This decreases chance of underbead cracking and can lessen requisite preheating, while degree of moisture pickup minimizes chance of hydrogen entering weld after exposure to atmosphere. Supplied in 0.045 and 0.052 in. dia, wire has tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT.

Self-Shielded, Flux-Cored Wire suits offshore welding.

Self-Shielded, Flux-Cored Wire suits offshore welding.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Dec 02, 2011 Designed for welding in narrow TKY joints and poor fit-up conditions, Innershield® NR-440Ni2 features optimal toe wash-in and is capable of delivering flat bead face when used in vertical-up or vertical-down welding applications. Wire meets H8 diffusible hydrogen requirements over range of humidity levels. Available in 5/64 in. diameter on 14 lb coils, product is hermetically sealed in ProTech® packaging for moisture resistance.

Martensitic Electrodes  weld 410 stainless steel.

Martensitic Electrodes weld 410 stainless steel.

Select-Arc, Inc.    Fort Loramie, OH 45845-0259
Nov 11, 2011 Delivering flat, well washed beads with minimal weaving, Select 410-AP all position wire welds straight 410 SS while providing corrosion and oxidation resistance up to 1,200°F. Select 410NiMo, featuring nominal weld metal composition of 12% chromium, 4.5% nickel, 0.6% molybdenum, and max carbon content of 0.06%, delivers smooth stable arc with low spatter residue and well washed beads. Both gas-shielded, flux cored electrodes are available in .045 in. and 1/16 in. diameters.

Stainless Steel Electrodes produce little or no spatter.

Stainless Steel Electrodes produce little or no spatter.

Select-Arc, Inc.    Fort Loramie, OH 45845-0259
Oct 10, 2011 Available in .045 and 1/16 in. diameters, SelectAlloy 16-8-2 Electrodes are composed of 15.5% chromium, 8.5% nickel, and 1.5% molybdenum. Flux cored SelectAlloy 16-8-2-AP, designed to weld in all positions, delivers flat, well washed beads, while metal cored SelectAlloy 16-8-2-C wire provides smooth, spray arc transfer and produces little or no slag. Both gas-shielded electrodes are suitable for welding 16-8-2, 316, and 347 grades of stainless steel in high-temperature piping systems.

Metallization Paste  supports solar cell processing.

Metallization Paste supports solar cell processing.

DuPont Microcircuit Materials    Research Triangle Park, NC 27709
Sep 01, 2011 Designed for rotary screen printing, DuPont(TM) Solamet® PV414 enables high-speed roll to roll processing of thin and flexible solar cells and modules. Formula is engineered to ensure optimal printability and line resolution while maintaining adhesion to Transparent Conductive Oxide layer, low contact resistance, and maximum conductivity.




(Showing headlines 1 - 20)   more ....



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