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Materials & Material Processing -> Soldering Equipment & Supplies -> Soldering Supplies


Soldering Supplies







(Showing headlines 1 - 20)   more ....
Flux-Cored Wire  offers low hydrogen weld deposits.

Flux-Cored Wire offers low hydrogen weld deposits.

Hobart Brothers Company    Troy, OH 45373-2900
Mar 14, 2014 Featuring less than 4 mL of diffusible hydrogen per 100 g of weldment, Hobart® FabCO® 712M minimizes chance of underbead cracking and can lessen amount of preheating needed. Gas-shielded flux-cored wire also has low moisture pickup so there is less chance of hydrogen entering weld after exposure to atmosphere. With fast-freezing, easily removable slag, wire is suitable for all-position welding. Product provides tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT.

Batch Selective Soldering System offers operational flexibility.

Batch Selective Soldering System offers operational flexibility.

Juki Automation Systems    Morrisville, NC 27560
Feb 19, 2014 Able to be configured with single nozzle or 2 nozzles, CUBE.460 offers batch platform with flexibility for through-hole applications. Selective mini-wave soldering system supports exchangeable solder pot for dual alloys and comes with various features: heated nitrogen at soldering nozzle; 0° and 7° soldering to accommodate various types of nozzles, including wetted nozzle tips and non-wetted nozzles; live viewing camera, and Quartz IR bottom side preheater.

Solder Pastes help reduce potential for tombstoning.

Fct Assembly    Greeley, CO 80631
Feb 11, 2014 Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available.

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Indium Corporation    Clinton, NY 13323
Feb 10, 2014 Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Non-Conductive Paste promotes flip chip application reliability.

Engineered Materials Systems Inc.    Delaware, OH 43015
Feb 06, 2014 Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion.

Solder Pastes come in lead-free, no-clean formulas.

Solder Pastes come in lead-free, no-clean formulas.

Nihon Superior Co. Ltd    Suita City   Japan
Jan 10, 2014 Lead-free SN100C P506 D4 can be stored at room temperature for more than 60 days without deterioration, while SN100C P820 D5 can suppress flux residue. With Alconano Nano-Silver Paste, users can join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Highly active surface of nano-silver particles make it possible to achieve strong bonds with electrical and thermal conductivity at low temperature without external pressure.

Pb-Free Solder Paste delivers high first pass yields.

Pb-Free Solder Paste delivers high first pass yields.

Indium Corporation    Clinton, NY 13323
Dec 16, 2013 Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows.

Halogen-Free Solder Paste offers consistent print performance.

Henkel Corporation    Rocky Hill, CT 06067
Sep 13, 2013 Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag, and OSP copper. In addition, paste has very low residues and minimal hot slump.

Gas-Shielded Flux-Cored Wire improves comfort, productivity.

Gas-Shielded Flux-Cored Wire improves comfort, productivity.

Hobart Brothers Company    Troy, OH 45373-2900
Aug 19, 2013 Designed for single- and multi-pass welding, Hobart® FabCO® 70XHP can be used in flat and horizontal position with either 100% CO2 or 75% argon, 25% CO2 shielding gas mixture. Fume generation rates help improve operator comfort, and deposition rates increase productivity. Available in 1/16, 5/64, and 3/32 in. dia, wire offers tensile strengths from 78,000–85,000 psi. Charpy V-Notch impact values exceed 20 ft•lbs at -40°F after 2 hr of stress relief at 1150°F.

Solder Alloy maximizes drop shock performance of electronics.

Solder Alloy maximizes drop shock performance of electronics.

Indium Corporation    Clinton, NY 13323
Aug 15, 2013 Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling.

Filler Metals address range of application requirements.

Filler Metals address range of application requirements.

Hobart Brothers Company    Troy, OH 45373-2900
Jul 19, 2013 Hobart® FabCOR® F6 gas-shielded metal-cored wire provides deposition rates and travel speeds that help increase productivity on single-pass, flat, and horizontal welding applications. Due to formulation of flux fill, Hobart Element™ gas-shielded flux-cored wires achieve low manganese levels and offer consistent arc stability and low spatter. MAXAL® 4943 aluminum wire and TIG cut-lengths, classified by AWS, offer strength, corrosion resistance, and low hot cracking sensitivity.

Nickel Alloy Electrode withstands rigorous environments.

Nickel Alloy Electrode withstands rigorous environments.

Select-Arc, Inc.    Fort Loramie, OH 45845-0259
Jul 10, 2013 Designed to tackle critical welding applications in demanding environments, SelectAlloy 182-AP produces uniform, well washed beads with minimal weaving, low spatter, and optimized slag peeling. Gas-shielded, flux cored, all position wire offers resistance to hot cracking, corrosion, and oxidation. Available in .045 and 1/16 in. diameters, ENiCrFe-3 class electrode is suitable for welding in desalination plants, petrochemical facilities, power generation plants, and furnace equipment.

Soldering Alloy offers optimal drop shock performance.

Soldering Alloy offers optimal drop shock performance.

Indium Corporation    Clinton, NY 13323
Jul 09, 2013 Doped with manganese for strength, SACM™ meets electronics assembly market's demand for solder alloy that offers combination of optimal drop shock performance, thermal cycling, and lead-free composition. Product features tensile strength of 5,625 psi, yield strength of 3,590 psi, and 15.7% elongation. Alloy is especially suitable for manufacture of consumer electronics that experience frequent handling, such as mobile devices.

Tips and Sponges meet diverse soldering challenges.

Tips and Sponges meet diverse soldering challenges.

Techspray    Amarillo, TX 79107
Jul 09, 2013 Offered in 19 styles, Plato XT tips are compatible with Weller WX stations using WXP120 iron. Soldering tip geometries include conical, screwdriver, bevel, knife, and SMD flow tip. Available to fit Hakko FX-888 and FX-888E stations, slitted sponge (part No. CS-888S) captures solder as operators wipe off tip. Sponge with large hole (No. CS-888H) adds surface area for wiping, and all Plato sponges are made of pure cellulose, which will not contaminate soldering tips.

Flux-Cored Wire  creates low-hydrogen welds in pipelines.

Flux-Cored Wire creates low-hydrogen welds in pipelines.

Hobart Brothers Company    Troy, OH 45373-2900
Jul 09, 2013 Designed for overmatch welding on API 5L Grade X80 steel pipelines, Fabshield® X90 ensures welds remain ductile and resist cracking with low-temperature impacts. Diffusible hydrogen designation of 6.2 mL/100 g of weldment further minimizes chance of cracking. Available in 5/64 in. diameter, wire operates on DCEN, requires no shielding gas, and features fast-freezing slag for consistent vertical-down welding. Impact strengths vary per temperature, with properties as high as 86 lb-ft at -40°F.

Solder Paste is suited for use on miniaturized assemblies.

Solder Paste is suited for use on miniaturized assemblies.

Indium Corporation    Clinton, NY 13323
Jun 19, 2013 Suited for assemblers and OEMs of mobile phones and other personal electronics devices contending with sub-8 mil challenges, Indium8.9HFA halogen- and Pb-free solder paste optimizes print performance and mitigates common defects such as QFN voiding, head-in-pillow, and graping. Transfer efficiency lends to consistent, full volume print deposits (8 mil), while print pressure and response-to-pause conserve time on stencils and line changes. Print speed and wipe frequency reduce cycle time.

VOC-Free Solder Paste has environmentally safe formulation.

VOC-Free Solder Paste has environmentally safe formulation.

AIM, Inc.    Cranston, RI 02920
May 20, 2013 Able to withstand thermal preheats required for palletized selective soldering, NC277 halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. While designed to be no-clean, non-visible residue flux, product can be cleaned if critical to product application.

Solder Paste minimizes post-process residue and graping.

Solder Paste minimizes post-process residue and graping.

AIM, Inc.    Cranston, RI 02920
May 16, 2013 Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigating head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

Water-Soluble Solder Paste minimizes voids.

Water-Soluble Solder Paste minimizes voids.

Indium Corporation    Clinton, NY 13323
May 03, 2013 Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance.

Tin/Bismuth Solder Paste features low-melting formulation.

Tin/Bismuth Solder Paste features low-melting formulation.

Fct Assembly    Greeley, CO 80631
May 02, 2013 With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life.




(Showing headlines 1 - 20)   more ....



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