Soldering Supplies

Materials & Material Processing

Solder Paste is temperature stable at 26.5°C for 1 year.

March 4, 2015

Halogen-free and lead-free, LOCTITE GC 10 enables abandon times of up to 24 hours and has startup time of 0. Product offers stabilized and consistent print transfer efficiency, expanded reflow window, and increased activity for optimum results with soak temperature from 150–200°C. Temperature stable up to 40°C for one month, paste eliminates requirement for cold packing, overnight shipping, and refrigerated storage. Read More

Materials & Material Processing

Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.

March 2, 2015

Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields, while stencil print transfer efficiency suits diverse processes. Read More

Materials & Material Processing

Masking Agent protects components during conformal coating.

January 7, 2015

Added to latex, No. 8691 Mighty Mask provides short-term, high-temperature protection up to 510°F, safeguarding components during conformal coating processes and component-free areas on PCBs during soldering. Heat-resistant compound will be tack-free in 20 minutes and completely cured in 1 hour. Applied with spatula or supplied squeeze bottle, plastic-safe, peelable solder mask removes by hand or with tweezers without contaminating or corrosive residues. Read More

Welding Equipment & Supplies, Materials & Material Processing

Flux-Cored Wires enable welding in all positions.

November 10, 2014

Designed for welding low-alloy, high-strength steels such as 4130, Dual Shield II 4130 SR is suited for offshore oil and gas topsides requiring corrosion resistance. Dual Shield II 70-Ni1 H4, designed for use under 75% Ar/25% CO2 gas protection, provides low-temperature toughness in as-welded and stress-relieved conditions. Wire produces diffusible hydrogen levels lower than 4 ml/100 g and resists stress corrosion cracking. Both produce weld bead with almost no ripple and very little spatter. Read More

Welding Equipment & Supplies, Materials & Material Processing

Flux Cored Electrode welds plates with surface contaminants.

October 13, 2014

Available in 3/32 in. dia, Select 70CRP is suited for welding automatic or semi-automatic fillet welds on ship panels, barges, or any structural plate that has been coated with rust-preventive primer or non-coated plate that has rusted. Formulation of this flux cored, carbon steel electrode enables welding on primer and rust with minimal porosity/blowholes. Additionally, wire delivers smooth arc characteristics, minimal spatter, and optimized slag removal. Read More

Materials & Material Processing

Rework Solder Paste desolders Pb-free components.

September 30, 2014

With desoldering temperature of 180°C, RoHS-compliant Bi Rework Solder Paste provides optimized removal of through-hole and SMT components, including LEDs. No-clean, halide-free flux minimizes risk of board damage during desoldering process. In addition, product offers easy dispensing and clean-up. Read More

Electrical Equipment & Systems, Green & Clean, Materials & Material Processing

PV Metallization Pastes optimize solar panel performance.

August 12, 2014

Intended for crystalline silicon solar cells, DuPont™ Solamet® PV18H and PV18J utilize proprietary Tellurium technology, which optimizes conversion efficiency of solar cells and allows extremely fine line printability down to 35 microns. Solamet® PV18H enables optimized contact resistance to enhanced lightly doped emitters on mono-crystalline solar cells, while Solamet® PV18J demonstrates superior adhesion even with thinner busbars, and offers wide solder temperature window. Read More

Materials & Material Processing

Solder Ball Placement Kit reworks small components.

July 23, 2014

When added to hot air pencil, Solder Ball Placement Kit provides complete solution for reworking most small chip components, such as 01005, 0201, 0402, and 0602s. Kit contains: 2,000 each of .04, .06, .08, and .10 mm solder balls with container; 4 ESD-safe carbon fiber reinforced oilers; one part positioning matrix and squeegee; one PEEK spudger; one bent tweezers; one half tweezers; and one 5,000 grit sharpening stone. Read More

Materials & Material Processing

Pb-Free Solder Paste suits high complexity PCBs.

July 15, 2014

Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F, RMA-155 is best suited for military and aerospace PCB assemblies. Read More

Welding Equipment & Supplies, Materials & Material Processing

Seamless Wires resist moisture pickup.

June 30, 2014

Available in flux-cored and metal-cored versions, Hobart® MEGAFIL® Wires have less than 4 mL of diffusible hydrogen per 100 g of weldment, which helps mitigate cracking risks. Copper coating optimizes current carrying capabilities as well as weld quality. Proprietary manufacturing process adds to consistency of wires by ensuring uniform flux filling, while uniform shape helps minimize contact tip wear, making wires suitable for semi-automatic and robotic welding applications. Read More

Material Handling & Storage, Materials & Material Processing

Solder Paste Retainer features spring loaded design.

June 19, 2014

Designed to optimize management of solder paste within printing area, Model SPR helps eliminate leakage of solder paste by way of floating spring supported paste retainer attached to end of squeegee holder. Unit applies constant pressure downward and glides along stencil surface, setting up optimized dam and seal. Read More

Welding Equipment & Supplies, Materials & Material Processing

Welding Electrode exhibits smooth arc transfer.

June 9, 2014

Available in .045, .052, and 1/16 in. diameters, Select 707 E71T-1 Flux Cored Gas-Shielded Electrode provides optimized weldability at low or high current settings while exhibiting arc stability. All-position wire also delivers robust mechanical properties at temperatures as low as -20°F. Applications include general fabrication, structural steel, construction equipment, railcar fabrication, and shipbuilding. Read More

Welding Equipment & Supplies, Materials & Material Processing

Flux-Cored Wire offers low hydrogen weld deposits.

March 14, 2014

Featuring less than 4 mL of diffusible hydrogen per 100 g of weldment, Hobart® FabCO® 712M minimizes chance of underbead cracking and can lessen amount of preheating needed. Gas-shielded flux-cored wire also has low moisture pickup so there is less chance of hydrogen entering weld after exposure to atmosphere. With fast-freezing, easily removable slag, wire is suitable for all-position welding. Product provides tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT. Read More

Machinery & Machining Tools, Materials & Material Processing

Batch Selective Soldering System offers operational flexibility.

February 19, 2014

Able to be configured with single nozzle or 2 nozzles, CUBE.460 offers batch platform with flexibility for through-hole applications. Selective mini-wave soldering system supports exchangeable solder pot for dual alloys and comes with various features: heated nitrogen at soldering nozzle; 0° and 7° soldering to accommodate various types of nozzles, including wetted nozzle tips and non-wetted nozzles; live viewing camera, and Quartz IR bottom side preheater. Read More

Materials & Material Processing

Solder Pastes help reduce potential for tombstoning.

February 11, 2014

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available. Read More

Materials & Material Processing

Pb-Free Solder Paste targets small, low-voltage QFN packages.

February 10, 2014

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. Read More

Materials & Material Processing

Non-Conductive Paste promotes flip chip application reliability.

February 6, 2014

Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion. Read More

Materials & Material Processing

Solder Pastes come in lead-free, no-clean formulas.

January 10, 2014

Lead-free SN100C P506 D4 can be stored at room temperature for more than 60 days without deterioration, while SN100C P820 D5 can suppress flux residue. With Alconano Nano-Silver Paste, users can join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Highly active surface of nano-silver particles make it possible to achieve strong bonds with electrical and thermal conductivity at low temperature without external pressure. Read More

Materials & Material Processing

Pb-Free Solder Paste delivers high first pass yields.

December 16, 2013

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. Read More

Materials & Material Processing

Halogen-Free Solder Paste offers consistent print performance.

September 13, 2013

Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag, and OSP copper. In addition, paste has very low residues and minimal hot slump. Read More