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Soldering Equipment & Supplies
(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force,... Read More
PF606-P245 Lead-free Solder Paste is suitable for PCB designs. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.Read More
PF606-P140 Lead-free Solder Paste offers continuous high-speed printability. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.Read More
Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017May 05, 2017
Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif.
Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF... Read More
Innovative Technology from SEHO
SEHO is the leading global manufacturer of complete solutions, providing innovative systems for all fields of automated soldering processes, solutions for automated optical solder joint inspection, and automized production lines including board handling, creative work places and intelligent material management. At SEHO we combine innovative engineering... Read More
Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo.
Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes:
- Are designed to provide ultra-low voiding
- Offer great print capabilities for small and low profile components
- Are designed to overcome... Read More
Unique architecture enables the first true volume solution for today’s consumer demands. Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and... Read More
Along withÂ 6–9 min cycle times or less, programmable 4040 provides SMT assemblers with optimized soldering quality, instant product changeovers, and 0% risk of overheating.Â Design enables installation in any workspace without requiring complex ductwork and external venting, while heat transfer efficacy and gentle conditions of vapor phase process minimize exhaust generation. Other... Read More
Don't miss the latest news!
Chester, Connecticut, USA – Ascentech, LLC will exhibit and demonstrate new test and process optimization instruments and solutions at the upcoming SMTA International Conference and Exhibition in Rosemont, IL, Sep. 25 - 29, 2016. Ascentech will exhibit these new products in booth #219.Â Products will include the Solder Saver Solder/Dross separation tool, award-winning GENSONIC Ultra-Sonic... Read More
Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMSÂ®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key... Read More
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill. Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability. This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique... Read More
BURNSVILLE, MN - July 2016 - IBL Technologies, LLC today announced plans to participate in the PHASE 4, Inc. Mini-show Technical conference, scheduled to take place August 9-11, 2016 at TechShop in Chandler, AZ. Jochen Lipp, CEO of IBL Technologies, will be available to demonstrate the redesigned SV260 Economy Vapor Phase Soldering Machine for small series and prototyping. The SV260 reflow vapor... Read More
Available in 3/32 in. diameter, FabCOÂ® 85HXP Wire optimizes deposition rates and travel speeds, particularly when welding thick materials up to 6–8 in. Gas-shielded flux-cored wire operates with 100% CO2 and has AWS classification of E70T-5CJ H4. Low hydrogen levels help mitigate cracking risks and rework. Wire is suited for flat and horizontal welding of earth moving equipment, non-alloyed... Read More
Triton PTH (Press to Heat), or HOT LIPS,Â includes transformer housed in box withÂ carry handle. This design promotes transformer mobility and stability. Using plier action to supply instant heat, handheld tool draws up to 30 A on High setting and at no load resistance. Carbon electrodes are standard, and wire electrode tips are alternatively available to reach tight areas. WeighingÂ 4 oz,... Read More
ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,... Read More
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÂ® GC 3W and Gap PadÂ® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development.Â ... Read More
In addition to low manganese levels, FabCOÂ® Element 71C and 71M offer optimized out-of-position capabilities, enabling welding operators to create quality welds regardless of joint placement. Gas-shielded flux-cored wires produce low spatter levels and have fast-freezing, easy-to-remove slag. Available in diameters of 0.045, 0.052, and 1/16 in. on 33 lb fiber spools, Element 71C is formulated... Read More
ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which... Read More
Plymouth, WIÂ – Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Monterrey Expo Tech Forum, scheduled to take place Thursday, April 14th at the Crowne Plaza Hotel (Apodaca) in Monterrey. Ersa is one of the world’s largest suppliers for rework, inspection and hand soldering equipment. For more than 15... Read More
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut two additional new products at the 2016 IPC APEX EXPO. A new McDry Cabinet and Eightech reflow soldering system will be introduced at the show. The McDry (HM-1001BNF) with Automatic N2 Flow Rate Control allows nitrogen to flow in at up to 20 L/min until the oxygen level... Read More