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Materials & Material Processing -> Soldering Equipment & Supplies


Soldering Equipment & Supplies







(Showing headlines 1 - 20)   more ....
Selective Soldering System  features modular design.

Selective Soldering System features modular design.

SEHO Systems GmbH    Kreuzwertheim 97892  Germany
Apr 11, 2014 With no change-over required, SEHO SelectLine can dynamically process variety of assemblies with short cycle times. Fluxer module, various preheat modules, and soldering modules may be equipped individually, and depending on requirements, they can be configured into complete manufacturing line. Two electro-magnetic soldering units for mini-wave processes may be integrated. With automatic ultrasonic cleaning unit, liquid solder is set into oscillation which gently cleans surface of nozzle.

Rework System offers automation and mobility options.

Rework System offers automation and mobility options.

Metcal, A Brand of OK International    Garden Grove, CA 92841
Mar 19, 2014 Scorpion Rework System is available with Automatic Placement Package, capable of 50 mm of motorized travel in Z-axis and full 360° in ϴ (Theta), that offers fine motor control in Z-axis and ϴ during alignment of component to pad. Force feedback control during placement process enables unit to accurately pick and place components without disturbing component or solder. System is also available in Mobile version with 1080p, HD camera system that fosters accurate alignment and positioning.

Flux-Cored Wire  offers low hydrogen weld deposits.

Flux-Cored Wire offers low hydrogen weld deposits.

Hobart Brothers Company    Troy, OH 45373-2900
Mar 14, 2014 Featuring less than 4 mL of diffusible hydrogen per 100 g of weldment, Hobart® FabCO® 712M minimizes chance of underbead cracking and can lessen amount of preheating needed. Gas-shielded flux-cored wire also has low moisture pickup so there is less chance of hydrogen entering weld after exposure to atmosphere. With fast-freezing, easily removable slag, wire is suitable for all-position welding. Product provides tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT.

Advanced Reflow Systems include batch ovens and inline variants.

Advanced Reflow Systems include batch ovens and inline variants.

Seika Machinery, Inc.    Torrance, CA 90503
Mar 10, 2014 Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering.

Batch Selective Soldering System offers operational flexibility.

Batch Selective Soldering System offers operational flexibility.

Juki Automation Systems    Morrisville, NC 27560
Feb 19, 2014 Able to be configured with single nozzle or 2 nozzles, CUBE.460 offers batch platform with flexibility for through-hole applications. Selective mini-wave soldering system supports exchangeable solder pot for dual alloys and comes with various features: heated nitrogen at soldering nozzle; 0° and 7° soldering to accommodate various types of nozzles, including wetted nozzle tips and non-wetted nozzles; live viewing camera, and Quartz IR bottom side preheater.

Solder Pastes help reduce potential for tombstoning.

Fct Assembly    Greeley, CO 80631
Feb 11, 2014 Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available.

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Indium Corporation    Clinton, NY 13323
Feb 10, 2014 Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Non-Conductive Paste promotes flip chip application reliability.

Engineered Materials Systems Inc.    Delaware, OH 43015
Feb 06, 2014 Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion.

Print-Place-Reflow Package performs prescision, high-mix assembly.

Print-Place-Reflow Package performs prescision, high-mix assembly.

Manncorp    Willow Grove, PA 19090
Jan 29, 2014 Occupying minimal floor space, 2500-MV accommodates companies that require short-run, in-house production capability for ultra-precise, high component-mix SMT assembly. Included MC-400 pick and place system features Cognex® on-the-fly and bottom vision alignment for high-accuracy, 2,500 cph placement of SMDs. Additional package components include heavy-duty MC-110 stencil printer, which offers ±0.02 mm (<1 mil) repeatability, and MC-301 profilable batch reflow oven with benchtop design.

Solder Pastes come in lead-free, no-clean formulas.

Solder Pastes come in lead-free, no-clean formulas.

Nihon Superior Co. Ltd    Suita City   Japan
Jan 10, 2014 Lead-free SN100C P506 D4 can be stored at room temperature for more than 60 days without deterioration, while SN100C P820 D5 can suppress flux residue. With Alconano Nano-Silver Paste, users can join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Highly active surface of nano-silver particles make it possible to achieve strong bonds with electrical and thermal conductivity at low temperature without external pressure.

Pb-Free Solder Paste delivers high first pass yields.

Pb-Free Solder Paste delivers high first pass yields.

Indium Corporation    Clinton, NY 13323
Dec 16, 2013 Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows.

Digital Hot Air Pencil suits small component applications.

Digital Hot Air Pencil suits small component applications.

Metcal, A Brand of OK International    Garden Grove, CA 92841
Nov 13, 2013 Equipped with 120 W ceramic heater and dual stage air pump, Model HCT2-120 is suited for applications that use small components and integrated circuits. Two LED displays provide graphical and numerical representation of desired airflow and temperature. Supplied with 6 nozzles, work stand with nozzle plate holder, and nozzle removal pad, handheld convection tool allows users freedom to access and rework components on board without affecting adjacent parts.

Soldering and Rework System features benchtop form factor.

Soldering and Rework System features benchtop form factor.

Metcal, A Brand of OK International    Garden Grove, CA 92841
Nov 11, 2013 With SmartHeat™ Technology for responsive and controlled heating, benchtop model MX-500 delivers energy needed to ensure precise and reliable solder connection. Features include switchable, dual-port, 40 W operation; ground fault interrupt; and universal power supply. Also, unit is compatible with existing MX-500 products: MX upgrade kits, tip-cartridges, and accessories.

Battery Powered Hot Iron suits hot melt applications in field.

Battery Powered Hot Iron suits hot melt applications in field.

Malcom Company Inc., DBA: Malcom Technologies    Portsmouth, RI 02871
Oct 02, 2013 Running on 48 Vdc, 180 W Model MCH-100-HM can reach temperatures up to 900°F. Portable tool features internal thermocouple that protrudes into brass tip which feeds back to Watlow temperature controller. Programmable controller allows operator to set upper and lower temperatures, adjust temperatures as needed, and set alarms. Designed to military standards, tool is suited for soldering, shrinking, curing, smoothing, hot-melt, bonding, and pre-heating.

Halogen-Free Solder Paste offers consistent print performance.

Henkel Corporation    Rocky Hill, CT 06067
Sep 13, 2013 Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag, and OSP copper. In addition, paste has very low residues and minimal hot slump.

Gas-Shielded Flux-Cored Wire improves comfort, productivity.

Gas-Shielded Flux-Cored Wire improves comfort, productivity.

Hobart Brothers Company    Troy, OH 45373-2900
Aug 19, 2013 Designed for single- and multi-pass welding, Hobart® FabCO® 70XHP can be used in flat and horizontal position with either 100% CO2 or 75% argon, 25% CO2 shielding gas mixture. Fume generation rates help improve operator comfort, and deposition rates increase productivity. Available in 1/16, 5/64, and 3/32 in. dia, wire offers tensile strengths from 78,000–85,000 psi. Charpy V-Notch impact values exceed 20 ft•lbs at -40°F after 2 hr of stress relief at 1150°F.

Solder Alloy maximizes drop shock performance of electronics.

Solder Alloy maximizes drop shock performance of electronics.

Indium Corporation    Clinton, NY 13323
Aug 15, 2013 Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling.

Filler Metals address range of application requirements.

Filler Metals address range of application requirements.

Hobart Brothers Company    Troy, OH 45373-2900
Jul 19, 2013 Hobart® FabCOR® F6 gas-shielded metal-cored wire provides deposition rates and travel speeds that help increase productivity on single-pass, flat, and horizontal welding applications. Due to formulation of flux fill, Hobart Element™ gas-shielded flux-cored wires achieve low manganese levels and offer consistent arc stability and low spatter. MAXAL® 4943 aluminum wire and TIG cut-lengths, classified by AWS, offer strength, corrosion resistance, and low hot cracking sensitivity.

Nickel Alloy Electrode withstands rigorous environments.

Nickel Alloy Electrode withstands rigorous environments.

Select-Arc, Inc.    Fort Loramie, OH 45845-0259
Jul 10, 2013 Designed to tackle critical welding applications in demanding environments, SelectAlloy 182-AP produces uniform, well washed beads with minimal weaving, low spatter, and optimized slag peeling. Gas-shielded, flux cored, all position wire offers resistance to hot cracking, corrosion, and oxidation. Available in .045 and 1/16 in. diameters, ENiCrFe-3 class electrode is suitable for welding in desalination plants, petrochemical facilities, power generation plants, and furnace equipment.

Soldering Alloy offers optimal drop shock performance.

Soldering Alloy offers optimal drop shock performance.

Indium Corporation    Clinton, NY 13323
Jul 09, 2013 Doped with manganese for strength, SACM™ meets electronics assembly market's demand for solder alloy that offers combination of optimal drop shock performance, thermal cycling, and lead-free composition. Product features tensile strength of 5,625 psi, yield strength of 3,590 psi, and 15.7% elongation. Alloy is especially suitable for manufacture of consumer electronics that experience frequent handling, such as mobile devices.




(Showing headlines 1 - 20)   more ....



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