AIM, Inc.    Cranston, RI 02920
May 16, 2013 Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigating head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

OK International    Garden Grove, CA 92841
May 08, 2013 Available for Scorpion Rework System, Side-View Camera Upgrade Kit facilitates visibility of reflow during rework process and helps operator set placement height of vacuum and reflow nozzles. Kit features high magnification optics, CMOS sensor camera with USB 2.0 connection, and picture-in-picture functionality, eliminating need for second monitor. Adjustable double articulated arm provides camera mount, while LED lighting lets operator direct light onto part from different angles.

Indium Corporation    Clinton, NY 13323
May 03, 2013 Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance.

Fct Assembly    Greeley, CO 80631
May 02, 2013 With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life.

Hobart Brothers Co.    Troy, OH 45373-2900
Apr 29, 2013 Available in 0.045 and 1/16 in. diameters, Element™ gas-shielded, flux-cored wires address stringent environmental requirements and recommendations set forth by ACGIH and OSHA. Each 71-type wire offers tensile strength in 70,000–75,000 psi range, while 81-type products produce welds with tensile strength from 80,000–85,000 psi. In addition to low spatter, consistent arc stability, and out-of-position welding capability, wires feature low hydrogen levels of 5.0 mg per 100 g of weldment.

Indium Corporation    Clinton, NY 13323
Mar 20, 2013 Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping.

SEHO Systems GmbH    Kreuzwertheim 97892  Germany
Feb 20, 2013 Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures homogeneous heat distribution with large volume of ventilated process gas.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Feb 18, 2013 Available in standard diameters of 0.045, 0.052, and 1/16 in., UltraCore® HD-12C and UltraCore® HD-12M are E71T-12C-JH8 and E71T-12M-JH8 flux-cored wires offering weld deposition rates of more than 14 lb/hr out-of-position. UltraCore® HD-12C is optimized for use with 100% CO2, while UltraCore® HD-12M uses mix of 75-80% Ar/balance CO2. Both mild steel FCAW-G products offer low-temperature-impact toughness exceeding 30 lbf-ft at -40°F.

Manncorp    Willow Grove, PA 19090
Jan 21, 2013 Suited for companies that hand solder through-hole components on PCBs, ULTIMA TR2 is equipped with 35 lb-capacity solder pot that handles lead-free or Sn/Pb solders. Integral nitrogen hood with micro pre-heater inerts solder site and stabilizes wave temperature, while 3-axis drive mechanism moves PCB with positional accuracy of ±0.01 mm. Point-to-point and drag soldering functions, along with solder pump speed, wave height control, dip height, and dwell parameter settings, are fully programmable.

ACE Production Technologies    Spokane Valley, WA 99216
Jan 21, 2013 Fully-configured SMEMA-compatible, KISS-205 Selective Soldering System combines fluxing, pre-heating, and soldering into simultaneous functions to achieve gains in productivity. Dual universal PCB edge conveyor provides program controlled width adjustment, positive PCB location, and PCB flattening. Additional features include automated fiducial XY and skew correction, volumetric atomized and/or drop jet fluxer, and independently controlled dual pre-heater modules.

OK International    Garden Grove, CA 92841
Dec 04, 2012 Metcal MX-5200 provides dual simultaneous use option, where 2 hand-pieces can work from one power supply at same time. Dynamic option lets 2 hand-pieces share 80 W output power based on demand, promoting application flexibility and speed. SmartHeat™ Technology promotes responsive, controlled heating and delivers exact amount of energy needed to ensure precise, reliable solder connection. Simultaneous dual operation is supported by 4 hand-pieces and various soldering and rework cartridges.

AIM, Inc.    Cranston, RI 02920
Oct 22, 2012 Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickel and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does not require nitrogen atmosphere and will not erode copper from holes, pads, and tracks.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Oct 12, 2012 Suited for applications requiring post-weld heat treatment (PWHT) of mild steel, .045 in. dia UltraCore® SR-12 exceeds AWS E71T-12M-JH8 strength and low-temperature impact toughness requirements in as-welded and stress-relieved conditions with impacts of 80–150 lbf-ft @ -40°F. This 75%–80% Argon/balance CO2 gas-shielded flux-cored (FCAW-G) welding wire offers arc performance and bead shape which promote usability for welders of all skill levels.

Manncorp    Willow Grove, PA 19090
Oct 10, 2012 Suitable for soldering through-hole components and connectors to SMT and mixed technology PCBs, ULTIMA TR2 incorporates X-, Y-, Z-axis drive that moves PCB, rather than solder pot. Solder pot and pump assembly features integral nitrogen hood with built-in micro-preheater for inerting solder site and stabilizing wave temperature. Via bottom-side witness camera, operator can view live video of soldering process on laptop/PC. Universal PCB holders handle boards up to 13 x 10 in. or 18 x 15 in.

Nihon Superior Co. Ltd    Suita City   Japan
Sep 21, 2012 Designed for use in vacuum reflow with nitrogen, SN100C P810 D4 no-clean, lead-free solder paste reduces voiding to less than 1% in measured void area. Properties include melting point of 227°C, flux content of 11.5% mass, and spread factor of 75%. Generally, product can be reflowed with profile similar to that commonly used with SAC305 and SAC405 with 245°C peak. It is also formulated to deliver optimal reflow with minimum mid-chip balling.

BTU International, Inc.    North Billerica, MA 01862
Aug 13, 2012 PYRAMAX(TM) features High Efficiency flux management system, which collects flux residue by processing oven atmosphere from multiple extraction points through series of heat exchangers, ensuring clean operation. Dual-lane design doubles throughput of oven by allowing 2 boards to be run simultaneously in parallel, with identical or near identical boards. With ability to adjust one lane while other lane continues production, WINCON 5.0 control software offers true dual process capability.

Nihon Superior Co. Ltd    Suita City   Japan
Jul 06, 2012 Formulated to deliver optimal reflow with minimum mid-chip balling, SN100C P810 D4 is based on silver-free and lead-free solder alloy SN100C®. Product also exhibits optimal wetting on all common substrates. Tests indicate that when used in combination with vacuum reflow paste can produce solder joints on 19 x 19 mm pads and joints to power transistors with less than 1% voiding.

MARTIN    Manchester, NH 03109
Jun 20, 2012 Used to rework LEDs and power components on metal or ceramic boards from 30 x 30 mm to 300 x 300 mm, EXPERT 04.6IXM is designed for applications where substrates need to be heated quickly up to 200°C and without overshoot. Single-sided PCBs are placed on glass plate heated with IR radiators rated at up to 3,000 W. Dual manipulator arms, each with movement lock, individually carry placement tool and hot air solder pen to cover entire working area.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Jun 11, 2012 Delivering flat bead face when used in all positions, UltraCore® HD-M is 75% Argon/25% CO2 gas-shielded flux-cored wire that features fast freezing slag and provides deposition rates of more than 10 lb/hr. Wire is available in 15, 33, and 50 lb packages and in standard diameters of .045, .052, and 1/16 in. UltraCore® HD-M conforms to AWS A5.20/A5.20M: E71T-1M/9M-H8 classification and is ABS approved to 3YSA H10.

AIM, Inc.    Cranston, RI 02920
Jun 01, 2012 Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.