Flux

Materials & Material Processing

Water-Soluble Solder Paste is suited for PCB assembly.

February 16, 2016

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes. In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over time at various humidity levels. Read More

Materials & Material Processing, Welding Equipment & Supplies

Submerged Arc Welding Flux is formulated for chrome-moly steels.

January 12, 2016

Formulated to improve weld quality on chrome-moly, creep-resistant steels, SWX 160 provides low-residual content weld deposit to help reduce risk of temper embrittlement in high-temperature applications. This neutral, agglomerated, fluoride-basic flux also helps meet X-factor requirements and provides impact toughness. Resulting slag detaches easily to help minimize post-weld cleaning. Suitable areas of use include power generation, petrochemical refinery, and pressure vessel applications. Read More

Materials & Material Processing, Welding Equipment & Supplies

Submerged Arc Flux comes in lightweight, heavy-duty packaging.

December 23, 2015

OK submerged arc welding flux is available with Flux Pack™ packaging, which uses heavy-duty LDPE (low-density polyethylene) material to protect dry agglomerated welding flux against moisture re-absorption from atmosphere. Packaging, by affording extended shelf life, ensures fresh and dry flux is ready to use for high-production SAW applications. Net weight of flux packaging is 50 lb, which helps meet EHS and ergonomic requirements of end users. Read More

Materials & Material Processing

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

July 6, 2015

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings. Flip-Chip...Read More

Materials & Material Processing, Paints & Coatings

Flux Coating helps meet flatness, tight tolerance needs.

April 21, 2015

Available for solder preforms, LV1000 is halide-free, meets ROL0 requirements, and passes Telcordia GR-78 testing in unactivated state. Durability of glossy, uniform coating facilitates integration of this material into automated assembly processes, while minimal voiding accommodates bottom termination components that do not allow for proper outgassing of volatized flux. With tolerances controlled down to 0.25% by weight, coating can be applied to unique geometries and sizes.

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Materials & Material Processing, Paints & Coatings

Indium Corporation Receives NPI Award

March 3, 2015

Indium Corporation was presented with CIRCUITS ASSEMBLY’s NPI Award for its LV1000 flux coating for solder preforms at the IPC APEX Expo on Feb. 24 in San Diego, Calif. Sponsored by CIRCUITS ASSEMBLY, the NPI Awards program recognizes the electronics assembly industry’s leading new products. Awards are selected by an independent panel of practicing industry engineers. LV1000is a series...Read More

Adhesives & Sealants, Materials & Material Processing

YINCAE President, Dr. Wusheng Yin, Presents: \"The Future of Solder Joint Encapsulation\" IPC Tech Summit 2014 in Raleigh, NC

October 28, 2014

Albany, NY– Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on "The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives...Read More

Materials & Material Processing, Welding Equipment & Supplies

Flux Cored Electrode welds plates with surface contaminants.

October 13, 2014

Available in 3/32 in. dia, Select 70CRP is suited for welding automatic or semi-automatic fillet welds on ship panels, barges, or any structural plate that has been coated with rust-preventive primer or non-coated plate that has rusted. Formulation of this flux cored, carbon steel electrode enables welding on primer and rust with minimal porosity/blowholes. Additionally, wire delivers smooth arc characteristics, minimal spatter, and optimized slag removal. Read More

Materials & Material Processing

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS

September 19, 2014

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif. NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer...Read More

Materials & Material Processing

Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi

September 8, 2014

Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers...Read More

Materials & Material Processing, Paints & Coatings

Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS

August 26, 2014

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif. LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput...Read More

Materials & Material Processing

Henkel's APEX Presence Brings High Reliability and High Performance to the Fore

March 18, 2014

Broad Range of Solder and Protection Materials to be Demonstrated During Three-Day Event At the annual APEX event, set to take place March 25-27 in Las Vegas, Nevada, show delegates will have the opportunity to learn more about the innovation that has resulted in several new high-reliability, high-performance materials from The Electronics Group of Henkel. Spanning a wide range of material...Read More

Materials & Material Processing, Welding Equipment & Supplies

Flux-Cored Wire offers low hydrogen weld deposits.

March 14, 2014

Featuring less than 4 mL of diffusible hydrogen per 100 g of weldment, Hobart® FabCO® 712M minimizes chance of underbead cracking and can lessen amount of preheating needed. Gas-shielded flux-cored wire also has low moisture pickup so there is less chance of hydrogen entering weld after exposure to atmosphere. With fast-freezing, easily removable slag, wire is suitable for all-position welding. Product provides tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT. Read More

Materials & Material Processing

Solder Pastes help reduce potential for tombstoning.

February 11, 2014

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available. Read More

Fluid & Gas Flow Equipment, Material Handling & Storage, Materials & Material Processing, Paints & Coatings

Sono-Tek Corporation to Showcase SonoFlux Servo Dual Flux System at Productronica

October 14, 2013

Milton, NY– Sono-Tek Corporation (OTC BB: SOTK), today announced that it will feature its SonoFlux Servo Dual Flux ultrasonic spray fluxing system in Stand 141-3 at the 20th international Productronica International Trade Fair, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany. A variation of Sono-Tek's proven, versatile SonoFlux Servo system,...Read More

Electronic Components & Devices, Machinery & Machining Tools, Material Handling & Storage, Materials & Material Processing

Indium Corporation Soldering Products Meet New IPC J-STD004B

October 7, 2013

Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability. ...Read More

Materials & Material Processing, Welding Equipment & Supplies

Submerged Arc Flux features ultra-low diffusible hydrogen.

July 29, 2013

Suitable for offshore welding joints with narrow groove angles and heavy wall thickness, Lincolnweld® 842-H™ features ultra-low diffusible hydrogen with less than 3 mL/100 g of deposited weld metal in DC and AC polarities. Impact toughness is capable of exceeding CVN values of 118 lb-ft at -76°F in body and cap pass. For cap pass welding in fatigue sensitive applications, flux features smooth bead profile with low entry angles, as well as optimized slag detachment. Read More

Materials & Material Processing

VOC-Free Solder Paste has environmentally safe formulation.

May 20, 2013

Able to withstand thermal preheats required for palletized selective soldering, NC277 halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. While designed to be no-clean, non-visible residue flux, product can be cleaned if critical to product application. Read More

Materials & Material Processing, Welding Equipment & Supplies

Submerged Arc Flux for Stainless Steel and Nickel Alloys.

May 6, 2013

Designed for specialty stainless steel and nickel grades, such as 625, 347, duplex, and super duplex, Lincolnweld® P2000™ neutral basic flux produces sound welds with optimal slag removal and bead appearance. This SAW flux, which is available in 50 lb plastic bag, also exhibits resistance to moisture pickup. When welding with this product, use of stainless steel and nickel-grade wire containing Niobium (Nb) is recommended. Read More

Adhesives & Sealants, Material Handling & Storage, Materials & Material Processing

Water-Soluble Solder Paste minimizes voids.

May 3, 2013

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. Read More