Lincoln Electric Co. Inc., The
Cleveland, OH 44117
Jun 19, 2008 Suited for offshore, pressure vessel, shipbuilding, and structural fabrication industries, Lincolnweld® 888(TM) flux meets AWS H4 requirements for low diffusible hydrogen levels under 4 mL/100 g of weld metal. Designed for low alloy and mild steel as-welded and stress relieved applications, it can handle up to 5 welding arcs. Available in moisture resistant packaging, unit can remove slag from deep grooves and narrow gaps, and has cap-pass impact properties.

Cobar Solder Products
Londonderry, NH 03053
Aug 07, 2007 Suited for wave, reflow, selective, and hand (cored wire) soldering, Model SN100C flux system is available in low VOC, VOC-free, and alcohol-based formulations, in solder paste form and also as paste and liquid fluxes. It has synthetic base that gives it stability under high temperatures required by lead-free alloys. Flux works well in air or under nitrogen blanket and is compatible with many different finishes, including OSP, Ni/Au, Ag, and Sn.

Almit Technology Ltd
East Sussex RH18 5DW  United Kingdom
Dec 08, 2006 Suited for re-working or post mass soldering applications, no-clean SR-7 is halide-free and rosin-free material designed for soldering on all PCB finishes, from lead-free HASL to immersion silver, tin ENIG, and OSP. Inherent low solids content ensures minimal post soldering residues are non-sticky, allowing for unhindered probe testing. Compliant with Bellcore SIR, flux comes in 1 and 5 liter containers as well as pen format.

EFD Inc., Solder Paste Group
Lincoln, RI 02865
Sep 11, 2006 PrintPlus® P530 printing series and SolderPlus® D550 dispensing series consist of lead-free solder pastes with clear, colorless, no-clean flux residue that allows solder joints to be used in applications requiring shiny, cosmetic finish. Easing inspection and optimizing wetting capabilities, products are suited for SMT, mechanical, electronic, and electro-mechanical soldering applications.

Cobar Solder Products
Londonderry, NH 03053
Apr 12, 2006 Combining freely rinsable, thermally stable synthetic polymers with activator system, 92-XCON OA liquid flux withstands high temperatures associated with lead-free processing without breaking down or losing its activity. Product delivers metallurgically sound solder joints with brilliant shiny appearance even under high thermal load. Categorized as IPC-Jstd-004 ORH0 product, flux passes Silver Chromate test for halides.

Cobar Solder Products
Londonderry, NH 03053
Jan 20, 2006 Suited for lead (Pb)-free wave soldering applications, Cobar 396-FTA eliminates solder balls as well as wetting and wicking issues, even on OSP assemblies. Product has less than 2% solids, yielding clean post solder surfaces. It is suited for use on most types of circuit boards.

Indium Corporation
Clinton, NY 13323
Jul 13, 2005 Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies.

Lincoln Electric Co. Inc., The
Cleveland, OH 44117
Jun 10, 2005 Suited for submerged arc welding, Lincolnweld® 888 highly basic flux is classified to AWS H4 requirements for diffusible hydrogen levels under 4 mL/100 g of weld metal. It exhibits weld metal toughness and features packaging properties that positively impact moisture resistance. Product is suited for pressure vessel, shipbuilding, and structural fabrication as well as narrow gap applications requiring deep-groove slag removal.

Henkel Loctite Corporation
Rocky Hill, CT 06067
May 24, 2005 Multicore® TTC-LF consists of lead-free grade solder powder and flux, formed into shape of thick disk for cleaning and de-wetting soldering irons. Users wipe tip of iron across surface of TTC-LF to produce local melting, and then wipe on damp sponge. Suited for lead and lead-free applications, product features activators that thermally decompose into inert components, and ability to clean heavily oxidized metal surfaces such as copper and iron plated soldering tips.

Henkel Loctite Corporation
Rocky Hill, CT 06067
May 23, 2005 Multicore® MF101 and MF300 are VOC-free, no-clean liquid fluxes suited for low solderability surfaces such as oxidized copper. They minimize or eliminate solder balling and are non-flammable. To complement lead-free wave soldering applications, MF200 helps eliminate micro solder balling, leaves minimal residue, and offers maximum process window. No-clean, sustained activity flux, MFR301 is suited for fast soldering on conventional leaded and SMD components.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Mar 15, 2005 Designed for surfaces with poor solderability, Multicore® MF210 is resin-free and halide-free. Sustained activity flux works over range of solder resists and is compatible with rosin and OSP-based surface preservatives. Material allows for high-speed soldering on conventional leaded and surface-mount components and offers good through hole penetration. No-clean characteristic ensures minimal residues so there is no interference with test probes.

Cobar Solder Products
Londonderry, NH 03053
Jan 20, 2005 Able to withstand temperatures required for lead-free soldering, 94QMB9 maintains its wetting characteristics and has evaporative formula that reduces preheating time and potential for oxidation and splatter. No-clean flux contains DI-water and alcohol and features non-ionic activator system that exhibits block-polymer functionality. Product is suited for lead-free soldering in wave and selective soldering systems.

EFD Inc., Solder Paste Group
Lincoln, RI 02865
Dec 01, 2004 Colorless, no-clean P520 Flux leaves clear residue for cosmetic joint finish. Printed or dispensed solder paste deposits retain shape through reflow cycle without slumping or bridging, making flux suited for fine pitch, no-clean electronic and electro-mechanical soldering applications. Flux is environmentally safe and exceeds IPC Joint Industry Standards J-STD-004A.

Indium Corporation of America
Utica, NY 13502
Sep 30, 2004 No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys.

Indium Corporation of America
Utica, NY 13502
Jul 29, 2004 Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Nov 25, 2003 Loctite® Multicore® MFR301 sustained activity liquid flux, designed for wave soldering PCBs, is suited for dual wave processing. Rosin/solvent synergism ensures optimum drainage behavior at exit of wave, minimizing bridging, spiking, and mid-pad solder balling. Product leaves thin, protective coating of rosin on soldered PCBs and leaves them dry to touch with slight rosinous luster. It passes J-STD-004 SIR and Bellcore electromigration tests.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Oct 28, 2003 High-activity, VOC-free Multicore® MF300 is effective on low-solderability surfaces, such as oxidized copper. Non-flammable, halide-free, low-residue flux meets US air-quality legislation and is compatible with most commonly used preservative materials. It passes Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning, and IPC-TM-650 copper mirror testing. Flux is suitable for foam or spray application.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Jul 29, 2003 Multicore MF200 lead-free compatible liquid flux is optimized for wave soldering in air. Resin- and halide-free and suited for Sn/Pb type processes, product is formulated to minimize incidence of mid-pad solder balling. Process windows can be extended with nitrogen. Formulated for use in various pcb assembly applications, product is classified as ORMO (J-STD 004) and meets/exceeds Bellcore GR-78-CORE tests for electromigration.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Jan 23, 2003 Loctite® Multicore® MF101 stable, VOC-free, no-clean liquid flux eliminates lead from wave and selective soldering processes. Rosin-in-water suspension flux runs standard leaded products and requires no transition to switch to lead-free processes. Non-flammable product can be thinned with water and aids in wetting and topside fillet formation. Halide-free liquid flux passes Bellcore SIR and J-STD-004 standards.

Lincoln Electric Company, Inc., The
Cleveland, OH 44117
May 01, 2002 Power Wave(TM) 355/Power Feed(TM) 10 Welding System is comprised of digitally-controlled inverter power source and industrial wire feeder. It provides control of welding parameters and allows user to select welding output waveform using Mode Selector Switch. Inverter offers 350A at 60% duty cycle. Power Feed 10 features 4-driven rolls in heavy duty drive system for feeding every wire type. Guide ensures alignment and allows positive wire loading.