Flux

Materials & Material Processing

Water-Soluble Solder Paste is suited for PCB assembly.

February 16, 2016

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes. In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over time at various humidity levels. Read More

Materials & Material Processing, Welding Equipment & Supplies

Submerged Arc Welding Flux is formulated for chrome-moly steels.

January 12, 2016

Formulated to improve weld quality on chrome-moly, creep-resistant steels, SWX 160 provides low-residual content weld deposit to help reduce risk of temper embrittlement in high-temperature applications. This neutral, agglomerated, fluoride-basic flux also helps meet X-factor requirements and provides impact toughness. Resulting slag detaches easily to help minimize post-weld cleaning. Suitable areas of use include power generation, petrochemical refinery, and pressure vessel applications. Read More

Materials & Material Processing, Welding Equipment & Supplies, Green & Clean

Submerged Arc Flux comes in lightweight, heavy-duty packaging.

December 23, 2015

OK submerged arc welding flux is available with Flux Pack™ packaging, which uses heavy-duty LDPE (low-density polyethylene) material to protect dry agglomerated welding flux against moisture re-absorption from atmosphere. Packaging, by affording extended shelf life, ensures fresh and dry flux is ready to use for high-production SAW applications. Net weight of flux packaging is 50 lb, which helps meet EHS and ergonomic requirements of end users. Read More

Materials & Material Processing, Green & Clean

The Balver Zinn Group Going for VOC Emission Reduction with Low-VOC Fluxes during Productronica

October 1, 2015

The Balver Zinn Group announces that it will exhibit in Hall A4, Booth #261 at the international Productronica Trade Fair, scheduled to take place November 10 - 13, 2015 at the New Munich Trade Fair Centre in Munich, Germany. They will highlight the company’s extensive range of Cobar’s low-VOC fluxes for VOC emission reduction. In today’s production technology of electronic products the... Read More

Materials & Material Processing

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

July 6, 2015

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings. Flip-Chip... Read More

Materials & Material Processing, Paints & Coatings

Flux Coating helps meet flatness, tight tolerance needs.

April 21, 2015

Available for solder preforms, LV1000 is halide-free, meets ROL0 requirements, and passes Telcordia GR-78 testing in unactivated state. Durability of glossy, uniform coating facilitates integration of this material into automated assembly processes, while minimal voiding accommodates bottom termination components that do not allow for proper outgassing of volatized flux. With tolerances controlled down to 0.25% by weight, coating can be applied to unique geometries and sizes.

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Materials & Material Processing, Paints & Coatings

Indium Corporation Receives NPI Award

March 3, 2015

Indium Corporation was presented with CIRCUITS ASSEMBLY’s NPI Award for its LV1000 flux coating for solder preforms at the IPC APEX Expo on Feb. 24 in San Diego, Calif. Sponsored by CIRCUITS ASSEMBLY, the NPI Awards program recognizes the electronics assembly industry’s leading new products. Awards are selected by an independent panel of practicing industry engineers. LV1000is a series... Read More

Materials & Material Processing

Nihon Superior Announces Successful Product Launches at NEPCON Japan

January 30, 2015

OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C... Read More

Adhesives & Sealants, Materials & Material Processing

YINCAE President, Dr. Wusheng Yin, Presents: "The Future of Solder Joint Encapsulation" IPC Tech Summit 2014 in Raleigh, NC

October 28, 2014

Albany, NY – Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on "The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives... Read More

Materials & Material Processing, Welding Equipment & Supplies

Flux Cored Electrode welds plates with surface contaminants.

October 13, 2014

Available in 3/32 in. dia, Select 70CRP is suited for welding automatic or semi-automatic fillet welds on ship panels, barges, or any structural plate that has been coated with rust-preventive primer or non-coated plate that has rusted. Formulation of this flux cored, carbon steel electrode enables welding on primer and rust with minimal porosity/blowholes. Additionally, wire delivers smooth arc characteristics, minimal spatter, and optimized slag removal. Read More

Materials & Material Processing

Rework Solder Paste desolders Pb-free components.

September 30, 2014

With desoldering temperature of 180°C, RoHS-compliant Bi Rework Solder Paste provides optimized removal of through-hole and SMT components, including LEDs. No-clean, halide-free flux minimizes risk of board damage during desoldering process. In addition, product offers easy dispensing and clean-up. Read More

Materials & Material Processing

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS

September 19, 2014

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif. NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer... Read More

Materials & Material Processing

Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi

September 8, 2014

Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers... Read More

Materials & Material Processing

The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

August 29, 2014

The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services. OT2 is Cobar’s latest halide and... Read More

Materials & Material Processing, Paints & Coatings

Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS

August 26, 2014

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif. LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput... Read More

Materials & Material Processing

Henkel's APEX Presence Brings High Reliability and High Performance to the Fore

March 18, 2014

Broad Range of Solder and Protection Materials to be Demonstrated During Three-Day Event At the annual APEX event, set to take place March 25-27 in Las Vegas, Nevada, show delegates will have the opportunity to learn more about the innovation that has resulted in several new high-reliability, high-performance materials from The Electronics Group of Henkel.  Spanning a wide range of material... Read More

Materials & Material Processing, Welding Equipment & Supplies

Flux-Cored Wire offers low hydrogen weld deposits.

March 14, 2014

Featuring less than 4 mL of diffusible hydrogen per 100 g of weldment, Hobart® FabCO® 712M minimizes chance of underbead cracking and can lessen amount of preheating needed. Gas-shielded flux-cored wire also has low moisture pickup so there is less chance of hydrogen entering weld after exposure to atmosphere. With fast-freezing, easily removable slag, wire is suitable for all-position welding. Product provides tensile strength of 83 ksi in as-welded condition and 80 ksi after PWHT. Read More

Materials & Material Processing

The Balver Zinn Group to Showcase OT2 and WW50 at APEX

March 7, 2014

The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort Convention Center in Las Vegas, NV. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services. OT2 is Cobar’s latest halide... Read More

Materials & Material Processing

Solder Pastes help reduce potential for tombstoning.

February 11, 2014

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available. Read More

Materials & Material Processing

Balver Zinn Grants Sublicenses to Stannol GmbH, Wuppertal and Felder GmbH

December 2, 2013

Balver Zinn today announced that it has granted sublicenses to Stannol GmbH, Wuppertal and Felder GmbH, Oberhausen for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing in Germany and sales globally with the exception of UK and Ireland. President Tetsuro Nishimura of Nihon Superior Co. Ltd. stated, "With granting Balver Zinn the right of sublicensing the SN100C... Read More