Mitsubishi Heavy Industries America, Inc.    New York, NY 10111
Jan 20, 2012 Eliminating heat stress and strain in bonding process, Bond Meister MWB-12-ST produces 3D integrated LSI (large-scale integration) circuits at room temperature. Fast atom beam (FAB) gun irradiates atoms for activating material surface to bond, and up to 20 ton weight loading is applicable for bonding. In addition to being able to perform wafer transfer and alignment, machine accommodates setting of bonding conditions for individual wafers for production of various types in small lots.

Mitsubishi Heavy Industries America    Leetonia, OH 44431
Jan 19, 2012 Utilizing fast atom beam gun to irradiate atoms for activating material surface, Bond Meister MWB-12-ST can provide continuous bonding of up to five 12 in. wafers and perform wafer transfer and alignment for automatic bonding. FAB gun effectively removes oxide film on surface of bonding metal material that normally impedes bonding. By eliminating heating process, room-temperature bonding frees devices from heat stress and eliminates need for heating/cooling cycle.

EV Group Inc.    Tempe, AZ 85284
Sep 14, 2011 Designed for integrated and automated loading, alignment, bonding, and unloading of wafers up to 300 mm in diameter, GEMINI FB supports CMOS image sensors and 3D integration applications. Local material buffer enables 10 front opening unified pods on system for continuous mode operation. To accelerate wafer handling, system utilizes double-end effectors. Low temperature plasma activation enables wafer bonding and stress/damage-free annealing at less than 400°C.

Mitsubishi Heavy Industries America    Leetonia, OH 44431
Jul 13, 2011 Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By eliminating heating process, room-temperature bonding frees devices from heat stress.

EV Group Inc.    Tempe, AZ 85284
Jun 27, 2011 Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production.

BriskHeat Products(BH Thermal Corp.)    Columbus, OH 43201
Jul 27, 2010 With total weight under 18 lb, single-zone ACR® MiniPro(TM) features 20 A capacity and ability to cure up to 1,400°F. Unit monitors all thermocouples for alarms and records real-time status of cure, including program parameters. Equipped with 10 thermocouples inputs, USB data port, vacuum venturi pump, and 8 in. full-color touch screen, bonder is suited for repairs in aircraft and wind turbine blades, as well as automotive, marine, and recreational vehicles.

EV Group Inc.    Tempe, AZ 85284
Jul 20, 2010 With design for multi-substrate bonding, EVG560HBL offers throughput rates of 160 bonds/hr. Force capability, in-situ low-force wedge compensation, and compliant layer technologies ensure bond uniformity across entire wafer. Integrated pre-processing modules are included for low-temperature metal wafer bonding, and bond chamber design enables substrate change-out in under 30 min. Along with warped/bowed wafer handling, bonder features SECS II/GEM interface and wafer ID tracking.

Questar Products International, Inc    Pleasanton, CA 94566
Jan 29, 2010 As fine-pitch, fine-wire (17-75 micron), automatic gold ball bonder, Q2119A meets production demands associated with smaller lot sizes, multiple product variations, and frequent set-up changes. Package conversions can be completed in minutes while accommodating various device configurations, and features such as pattern recognition system, ball bumping and coining capability, and programmable security bonds support needs from prototyping to medium volume production.

Sonobond Ultrasonics    West Chester, PA 19380
Mar 11, 2009 Able to accommodate tinned or heavily oxidized wires, Dual Head SpliceRite(TM) welds wire bundles that have cross-sectional areas of up to 100 mm². It comes with 3,500 W power supply and utilizes Wedge-Reed system, which directs high frequency ultrasonic energy via welding tips to wires to be welded. Welding heads on each side of weld area enables accelerated splicing of large wire bundles. Up to 250 jobs can be stored/recalled, and welds may be controlled by height, energy, or time.

Unitek Miyachi Corporation    Monrovia, CA 91017 7133
Oct 24, 2008 Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Mar 25, 2008 With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer.

SUSS MicroTec Inc.    Yokohama   Japan
Jun 14, 2007 Suited for R&D laboratories, universities, and pre-production environments, KADETT provides flexible and open platform for assembly and bonding of devices on variety of substrates. Semi-automatic machine performs accurate pick-and-place functions, and accurate alignment is achieved via vision system with 2 independent video microscopes and high-resolution (0.1 µm) XY alignment stage. Various bonding processes are available for forces up to 75 N.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Dec 22, 2006 Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Sonobond Ultrasonics    West Chester, PA 19380
Jan 05, 2006 Suited for chemical and industrial liquid applications, Filter Collar Bonder(TM) ultrasonically attaches rigid plastic circular frames to non-woven filter bags using SureWeld 20(TM) technology. Operator loads plastic ring and filter bag onto center fixture. Start button is activated causing welding head to close on part, ultrasonically weld it, and retract. Operator then manually rotates center fixture 60° and repeats process 6 times to achieve 360° weld.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Mar 31, 2005 Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die.

BriskHeat Products(BH Thermal Corp.)    Columbus, OH 43201
Mar 02, 2005 Advanced Composite Repair (ACR) 2 Hot Bonder provides users with everything needed to perform composite and metal bond repairs in one suitcase. To facilitate programming, unit is equipped with color touchscreen, software, and USB data port. Product is offered with vacuum venturi pump, or electric vacuum pump for self-contained system.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Apr 30, 2004 Hysol® FP4547FC is compatible with clean and no-clean flux residues. It protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260°C moisture test requirements. Incorporating 2 additives that remove and neutralize flux residues from between flip-chip die and substrate, product provides moisture resistance and facilitates assembly process. In most cases, post-assembly flip-chip cleaning processes may be eliminated.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Apr 22, 2004 CuPRA™ handles copper wire from 0.8–3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.

Xenon Corp.    Woburn, MA 01801 1057
Mar 02, 2004 CoolCureXL-DVD® Bonding System features pulsed UV curing lamps capable of 0.6 sec cure times for DVD-5 formats. Tilt management is achieved using lamps on top and bottom during curing process. Eliminating need for DVD repositioning while curing, system uses spiral-shaped lamps that match DVD profile and expose full disc to 1,000 W/cm² peak pulse power. Pulsed UV curing lamps provide instant on/off and cool operation.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Jan 13, 2004 MaxµmplusT Ultra High Speed Ball Bonder incorporates 2.20 x 2.60 in. bonding area, S-Scan imaging technology, µT-Sonicsâ„¢ transducer, and Precision-Arcâ„¢ EFO system. Servo control system for X-Y Table reduces wire cycle times to 63.0 msecs, and Precision-touchT bondhead technology delivers optimum bond force control. Teaching and calibration software delivers bond placement accuracy to 2.5 µm, and wire feed path handles wire diameters down to 15 µm.