Built to support high-volume manufacturing requirements, EVG®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up to 8 in. wafer and is configurable with up to 5 modules that can process in parallel. Read More
With cure capacity up to 1400°F, single- or dual-zone ACR®3 meets all relevant European health, safety, and environmental protection requirements as well as Canadian and U.S. safety requirements. Dual vacuum system consists of built-in electric vacuum pump and vacuum venturi for each zone, and 8.4 in. HD touchscreen-based interface aids operation. Accepting J-type thermocouples, unit accommodates 10 thermocouple sensors per zone and offers 30 A output per heat zone.
Able to weld multiple layers and/or delicate foils to tabs or terminals, SonoWeld® 1600 and Dual Head Spot Welders also accommodate battery pouch assembly and HV termination welding. Durable bonds are created in one operation that takes seconds; does not employ any heat, current, fluxes, or filler; and does not produce any arcs, sparks, or fumes. Dual Head Spot Welder can join up to 100 layers of copper or aluminum foil in one pulse. Systems offer outputs of 1,500 and 2,500 W. Read More
GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. Read More
LowTemp™ debonding platform features 3 room-temperature wafer debonding processes and extended material supply chain. Two debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBOND® technology, which has been implemented into production across compound semiconductor and advanced packaging markets. Read More
Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires. Read More
With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer. Read More
Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production. Read More