Bonding Machines

Material Handling & Storage, Materials & Material Processing

Wafer Bonding System operates in high-vacuum-process environment.

October 14, 2014

Built to support high-volume manufacturing requirements, EVG®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up to 8 in. wafer and is configurable with up to 5 modules that can process in parallel. Read More

Materials & Material Processing

Composite Curing Hot Bonder features CE and UL approvals.

October 8, 2014

With cure capacity up to 1400°F, single- or dual-zone ACR®3 meets all relevant European health, safety, and environmental protection requirements as well as Canadian and U.S. safety requirements. Dual vacuum system consists of built-in electric vacuum pump and vacuum venturi for each zone, and 8.4 in. HD touchscreen-based interface aids operation. Accepting J-type thermocouples, unit accommodates 10 thermocouple sensors per zone and offers 30 A output per heat zone.
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Welding Equipment & Supplies, Green & Clean, Materials & Material Processing

Ultrasonic Spot Welders work with foils as thin as 7 microns.

July 21, 2014

Able to weld multiple layers and/or delicate foils to tabs or terminals, SonoWeld® 1600 and Dual Head Spot Welders also accommodate battery pouch assembly and HV termination welding. Durable bonds are created in one operation that takes seconds; does not employ any heat, current, fluxes, or filler; and does not produce any arcs, sparks, or fumes. Dual Head Spot Welder can join up to 100 layers of copper or aluminum foil in one pulse. Systems offer outputs of 1,500 and 2,500 W. Read More

Material Handling & Storage, Materials & Material Processing

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

July 8, 2014

GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. Read More

Materials & Material Processing

Debonding Processes promote manufacturing flexibility.

July 9, 2013

LowTemp™ debonding platform features 3 room-temperature wafer debonding processes and extended material supply chain. Two debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBOND® technology, which has been implemented into production across compound semiconductor and advanced packaging markets. Read More

Material Handling & Storage, Machinery & Machining Tools, Materials & Material Processing

Automated Wafer Bonding Machine uses room temperature production.

January 20, 2012

Eliminating heat stress and strain in bonding process, Bond Meister MWB-12-ST produces 3D integrated LSI (large-scale integration) circuits at room temperature. Fast atom beam (FAB) gun irradiates atoms for activating material surface to bond, and up to 20 ton weight loading is applicable for bonding. In addition to being able to perform wafer transfer and alignment, machine accommodates setting of bonding conditions for individual wafers for production of various types in small lots. Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding Machine produces 3D LSI circuits at room temp.

January 19, 2012

Utilizing fast atom beam gun to irradiate atoms for activating material surface, Bond Meister MWB-12-ST can provide continuous bonding of up to five 12 in. wafers and perform wafer transfer and alignment for automatic bonding. FAB gun effectively removes oxide film on surface of bonding metal material that normally impedes bonding. By eliminating heating process, room-temperature bonding frees devices from heat stress and eliminates need for heating/cooling cycle. Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding System offers throughput up to 20 wafers/hr.

September 14, 2011

Designed for integrated and automated loading, alignment, bonding, and unloading of wafers up to 300 mm in diameter, GEMINI FB supports CMOS image sensors and 3D integration applications. Local material buffer enables 10 front opening unified pods on system for continuous mode operation. To accelerate wafer handling, system utilizes double-end effectors. Low temperature plasma activation enables wafer bonding and stress/damage-free annealing at less than 400°C. Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding Machine produces 3-D ICs at room temperature.

July 13, 2011

Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By eliminating heating process, room-temperature bonding frees devices from heat stress. Read More

Test & Measuring Instruments, Material Handling & Storage, Machinery & Machining Tools, Materials & Material Processing

Wafer Bonding System offers in-line metrology module.

June 27, 2011

Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production. Read More

Materials & Material Processing

Hot Bonder performs composite curing repairs anywhere.

July 27, 2010

With total weight under 18 lb, single-zone ACR® MiniPro(TM) features 20 A capacity and ability to cure up to 1,400°F. Unit monitors all thermocouples for alarms and records real-time status of cure, including program parameters. Equipped with 10 thermocouples inputs, USB data port, vacuum venturi pump, and 8 in. full-color touch screen, bonder is suited for repairs in aircraft and wind turbine blades, as well as automotive, marine, and recreational vehicles. Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding System suits high-volume HB-LED manufacturing.

July 20, 2010

With design for multi-substrate bonding, EVG560HBL offers throughput rates of 160 bonds/hr. Force capability, in-situ low-force wedge compensation, and compliant layer technologies ensure bond uniformity across entire wafer. Integrated pre-processing modules are included for low-temperature metal wafer bonding, and bond chamber design enables substrate change-out in under 30 min. Along with warped/bowed wafer handling, bonder features SECS II/GEM interface and wafer ID tracking. Read More

Materials & Material Processing

Desktop Bonder features motorized X-, Y-, or XY-axis table.

October 24, 2008

Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires. Read More

Materials & Material Processing

Wire Bonders include programmable power supply system.

March 25, 2008

With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer. Read More

Machinery & Machining Tools, Laboratory and Research Supplies & Equipment, Materials & Material Processing

Capillary is suited for fine pitch wire bonding.

December 22, 2006

Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production. Read More

Materials & Material Processing

Stud Bumper targets flip chip market.

March 31, 2005

Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die. Read More

Materials & Material Processing

Portable Hot Bonder utilizes Windows®-like interface.

March 2, 2005

Advanced Composite Repair (ACR) 2 Hot Bonder provides users with everything needed to perform composite and metal bond repairs in one suitcase. To facilitate programming, unit is equipped with color touchscreen, software, and USB data port. Product is offered with vacuum venturi pump, or electric vacuum pump for self-contained system. Read More

Materials & Material Processing

Capillary Flip-Chip Underfill suits lead-free assemblies.

April 30, 2004

Hysol® FP4547FC is compatible with clean and no-clean flux residues. It protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260°C moisture test requirements. Incorporating 2 additives that remove and neutralize flux residues from between flip-chip die and substrate, product provides moisture resistance and facilitates assembly process. In most cases, post-assembly flip-chip cleaning processes may be eliminated. Read More

Materials & Material Processing

Capillary suits copper wire bonding applications.

April 22, 2004

CuPRA(TM) handles copper wire from 0.8-3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications. Read More

Materials & Material Processing

DVD Bonding System provides 1,000 W/cm² peak pulse power.

March 2, 2004

CoolCureXL-DVD® Bonding System features pulsed UV curing lamps capable of 0.6 sec cure times for DVD-5 formats. Tilt management is achieved using lamps on top and bottom during curing process. Eliminating need for DVD repositioning while curing, system uses spiral-shaped lamps that match DVD profile and expose full disc to 1,000 W/cm² peak pulse power. Pulsed UV curing lamps provide instant on/off and cool operation. Read More