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Newly refurbished facility to showcase automation solutions and deliver comprehensive services. Universal Instruments recently held a celebration ceremony to mark the grand opening of its Asia Advanced Technology Center in Shanghai with the participation of more than 50 distributors, customers and guests from all over China. The company’s flagship FuzionÂ® platform and new Flexbond™ hot bar... Read More
Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic ComponentsApr 04, 2016
Ultrasonic Metal Welding Capabilities to be on Display at the May 2016 National Wire Processing Expo WEST CHESTER, Pennsylvania – Sonobond Ultrasonics’ metal welding technology is keeping pace with the growing number of increasingly complex electronic components used in automotive and other circuitry.Â The company even offers wire-to-terminal welders that produce single point ground... Read More
Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The NetherlandsÂ – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson... Read More
US-Made Ultrasonic Metal Welding Machines Offer Manufacturers Increased Productivity and Efficiency WEST CHESTER, Pennsylvania – Sonobond Ultrasonics has been buttressing what some analysts expect will be a resurgence in U.S. manufacturing.Â "Our faith in the U.S.A. as a manufacturing base has never wavered," says Sonobond President Janet Devine.Â She adds that despite the domestic... Read More
Designed for universities and R&D groups, EVGÂ®580 ComBondÂ® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm... Read More
Built to support high-volume manufacturing requirements, EVGÂ®580 ComBondÂ® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up... Read More
With cure capacity up to 1400Â°F, single- or dual-zone ACRÂ®3 meets all relevant European health, safety, and environmental protection requirements as well as Canadian and U.S. safety requirements. Dual vacuum system consists of built-in electric vacuum pump and vacuum venturi for each zone, and 8.4 in. HD touchscreen-based interfaceÂ aids operation. Accepting J-type thermocouples, unit... Read More
Able to weld multiple layers and/or delicate foils to tabs or terminals, SonoWeldÂ® 1600 and Dual Head Spot Welders also accommodate battery pouch assembly and HV termination welding. Durable bonds are created in one operation that takes seconds; does not employ any heat, current, fluxes, or filler; and does not produce any arcs, sparks, or fumes. Dual Head Spot Welder can join up to 100 layers... Read More
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GEMINIÂ®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs),Â incorporates SmartViewÂ® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma).Â Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for... Read More
EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power DevicesJan 20, 2014
EVGÂ® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon... Read More
Ultrasonic Technology Gains Favor with Major Body Armor Manufacturers for Achieving Compliance with NIJ Waterproof StandardsDec 04, 2013
Sonobond's SeamMaster™ High Profile Ultrasonic Sewing Machine to be Featured at SHOT Show, in Las Vegas, January 14-17, 2014 WEST CHESTER, Pennsylvania – Ultrasonic technology is increasingly being used as an assembly method for body armor – and the machine of choice for virtually every major manufacturer is Sonobond's SeamMaster High Profile Ultrasonic Sewing Machine. "One of the reasons... Read More
Sonobond Ultrasonics' Equipment Assembles High Efficiency and Specialty Filtration Products for Great Lakes FiltersSep 16, 2013
Attendees at FILTRATION 2013 (Chicago, November 12-14) Will See Machinery that Produces Strong, Perforation-Free Seams Four Times Faster than Sewing and Ten Times Faster than Adhesive Machines WEST CHESTER, Pennsylvania –Â When Great Lakes Filters, in Hillsdale, Mich., needed an assembly method to produce a liquid filter bag that could hold up to hydraulic pressing without splitting or... Read More
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's... Read More
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCOÂ – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for... Read More
LowTemp™ debonding platform featuresÂ 3 room-temperature wafer debonding processes and extended material supply chain. TwoÂ debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBONDÂ® technology, which has been implemented into production across... Read More
Sonobond's Free, No-Obligation Ultrasonic Bonding Viability Test Helps Companies Find Practical, Cost-Effective Solutions for Their Textile and Filtration-Assembly ApplicationsMar 01, 2013
Sample ultrasonic bonds are made using materials supplied by prospective customers.Â Sonobond then recommends the appropriate ultrasonic bonding equipment to match each firm’s specific needs and requirements. WEST CHESTER, PA - Janet Devine, President of Sonobond Ultrasonics, announced today that the company's free Ultrasonic Bonding Viability Test is proving to be very important to firms in... Read More
Sonobond Offers a Variety of Ultrasonic Equipment for Manufacturing Applications in the Defense and Aerospace FieldsFeb 06, 2013
Two Sonobond Machines-the Dual Head SpliceRite(TM) and the SeamMaster(TM) High Profile Textile Bonder-will be Exhibited in Booth #4195 at the AeroCon Show in Anaheim, California on February 12-14, 2013. WEST CHESTER, Pennsylvania- Sonobond Ultrasonics announced today that it will be exhibiting at the AeroCon Aerospace & Defense Show next month in Anaheim. In making the announcement, Sonobond's... Read More
West Palm Beach, FL - Syneo, the medical device solutions company, and Vante, the leader in catheter tipping equipment, will be displaying the first fully automated system for catheter tipping, the ATS, at the MD&M West tradeshow in Anaheim, California.Â The ATS couples Vante's Saffire Â® RF tipping technology with the Syneo Accu-Feed tube feeding system. The end result is a fully automated... Read More
Finetech will showcase the sub-micron placement accuracy FINEPLACERÂ® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA. The semi-automated configuration of the FINEPLACERÂ® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual... Read More