Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Mar 25, 2008 With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer.

SUSS MicroTec Inc.
Yokohama   Japan
Jun 14, 2007 Suited for R&D laboratories, universities, and pre-production environments, KADETT provides flexible and open platform for assembly and bonding of devices on variety of substrates. Semi-automatic machine performs accurate pick-and-place functions, and accurate alignment is achieved via vision system with 2 independent video microscopes and high-resolution (0.1 µm) XY alignment stage. Various bonding processes are available for forces up to 75 N.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Dec 22, 2006 Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Sonobond Ultrasonics
West Chester, PA 19380
Jan 05, 2006 Suited for chemical and industrial liquid applications, Filter Collar Bonder(TM) ultrasonically attaches rigid plastic circular frames to non-woven filter bags using SureWeld 20(TM) technology. Operator loads plastic ring and filter bag onto center fixture. Start button is activated causing welding head to close on part, ultrasonically weld it, and retract. Operator then manually rotates center fixture 60° and repeats process 6 times to achieve 360° weld.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Mar 31, 2005 Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die.

BriskHeat Products (BH Thermal Corp.)
Columbus, OH 43201
Mar 02, 2005 Advanced Composite Repair (ACR) 2 Hot Bonder provides users with everything needed to perform composite and metal bond repairs in one suitcase. To facilitate programming, unit is equipped with color touchscreen, software, and USB data port. Product is offered with vacuum venturi pump, or electric vacuum pump for self-contained system.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Apr 30, 2004 Hysol® FP4547FC is compatible with clean and no-clean flux residues. It protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260°C moisture test requirements. Incorporating 2 additives that remove and neutralize flux residues from between flip-chip die and substrate, product provides moisture resistance and facilitates assembly process. In most cases, post-assembly flip-chip cleaning processes may be eliminated.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Apr 22, 2004 CuPRA™ handles copper wire from 0.8–3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.

Xenon Corp.
Woburn, MA 01801 1057
Mar 02, 2004 CoolCureXL-DVD® Bonding System features pulsed UV curing lamps capable of 0.6 sec cure times for DVD-5 formats. Tilt management is achieved using lamps on top and bottom during curing process. Eliminating need for DVD repositioning while curing, system uses spiral-shaped lamps that match DVD profile and expose full disc to 1,000 W/cm² peak pulse power. Pulsed UV curing lamps provide instant on/off and cool operation.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Jan 13, 2004 MaxµmplusT Ultra High Speed Ball Bonder incorporates 2.20 x 2.60 in. bonding area, S-Scan imaging technology, µT-Sonics™ transducer, and Precision-Arc™ EFO system. Servo control system for X-Y Table reduces wire cycle times to 63.0 msecs, and Precision-touchT bondhead technology delivers optimum bond force control. Teaching and calibration software delivers bond placement accuracy to 2.5 µm, and wire feed path handles wire diameters down to 15 µm.

Contech
Goddard, KS 67052
Sep 25, 2003 AppliPhase HVA enables operators to set control unit for temperature and length of exposure to ensure correct bonding of flexible back-light signage transfers, reflective sheeting, Panaflex signs, backlit awnings, traffic signs, and premask application tape. Features include steel construction and oil-free vacuum pump. Lamp bank and diaphragm may be raised to offer clearance for handling of materials. No special operator training is required.

Newport Corp.
Irvine, CA 92606
Sep 08, 2003 Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53 mm² die handling capability, and advanced vision and lighting.

Newport Corp.
Irvine, CA 92606
Jul 31, 2003 Able to provide assembly solutions for epoxy die attach, eutectic, and flip chip bonding, MRSI-605 AP Advanced Packaging Die Bonder is based on MRSI-505 platform. Machine includes 6-head, feather-touch tool turret that rotates through full 360° of orientation to align dies no matter how they are presented to system. It also provides feather touch force control with closed loop force feedback, Windows® GUI, XML formatted database, and various vision tools.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
May 28, 2003 CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and consistent distribution of inter-metallic coverage.

Sonobond Ultrasonics
West Chester, PA 19380
Jun 21, 2002 SureWeld 20 kHz ultrasonic plunge welders can assemble cylindrical filters from pleated HEPA filter media. In overlapping applications, ultrasonic welders bond and trim edges of pleated filter media in one step to create 10 in. filter tube, which maintains HEPA rating. SureWeld bonders feature rectangular support columns, which eliminate deflection and keep filter unit in perfect alignment during assembly process.

ElectroStatics, Inc.
Harleysville, PA 19438 2017
May 06, 2002 Model 3000 Autostat(R) uses forces of static electricity for adhering one material to another, such as temporary bonding of protective covering to metal sheets or wood paneling, spot pinning of over-wrapping material prior to heat sealing, edge pinning of web to einsure constant direction, and removal of air pockets during laminating. Power supply has variable output to insure highest degree of bonding necessary to complete holding process.