Bonding Machines

Materials & Material Processing, Welding Equipment & Supplies

Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic Components

April 4, 2016

Ultrasonic Metal Welding Capabilities to be on Display at the May 2016 National Wire Processing Expo WEST CHESTER, Pennsylvania – Sonobond Ultrasonics’ metal welding technology is keeping pace with the growing number of increasingly complex electronic components used in automotive and other circuitry.  The company even offers wire-to-terminal welders that produce single point ground... Read More

Materials & Material Processing, Packaging Equipment

Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA

March 11, 2016

Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The Netherlands – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson... Read More

Machinery & Machining Tools, Materials & Material Processing, Welding Equipment & Supplies

Sonobond Ultrasonics Celebrates the Resurgence in U.S. Manufacturing Sector

October 20, 2015

US-Made Ultrasonic Metal Welding Machines Offer Manufacturers Increased Productivity and Efficiency WEST CHESTER, Pennsylvania – Sonobond Ultrasonics has been buttressing what some analysts expect will be a resurgence in U.S. manufacturing.  "Our faith in the U.S.A. as a manufacturing base has never wavered," says Sonobond President Janet Devine.  She adds that despite the domestic... Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding Systems support wafers up to 200 mm in diameter.

March 24, 2015

Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment. Read More

Material Handling & Storage, Materials & Material Processing

Wafer Bonding System operates in high-vacuum-process environment.

October 14, 2014

Built to support high-volume manufacturing requirements, EVG®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up to 8 in. wafer and is configurable with up to 5 modules that can process in parallel. Read More

Materials & Material Processing

Composite Curing Hot Bonder features CE and UL approvals.

October 8, 2014

With cure capacity up to 1400°F, single- or dual-zone ACR®3 meets all relevant European health, safety, and environmental protection requirements as well as Canadian and U.S. safety requirements. Dual vacuum system consists of built-in electric vacuum pump and vacuum venturi for each zone, and 8.4 in. HD touchscreen-based interface aids operation. Accepting J-type thermocouples, unit accommodates 10 thermocouple sensors per zone and offers 30 A output per heat zone.<br /> Read More

Materials & Material Processing, Welding Equipment & Supplies, Green & Clean

Ultrasonic Spot Welders work with foils as thin as 7 microns.

July 21, 2014

Able to weld multiple layers and/or delicate foils to tabs or terminals, SonoWeld® 1600 and Dual Head Spot Welders also accommodate battery pouch assembly and HV termination welding. Durable bonds are created in one operation that takes seconds; does not employ any heat, current, fluxes, or filler; and does not produce any arcs, sparks, or fumes. Dual Head Spot Welder can join up to 100 layers of copper or aluminum foil in one pulse. Systems offer outputs of 1,500 and 2,500 W. Read More

Material Handling & Storage, Materials & Material Processing

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

July 8, 2014

GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. Read More

Machinery & Machining Tools, Material Handling & Storage, Materials & Material Processing

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

January 20, 2014

EVG® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, Austria – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon... Read More

Machinery & Machining Tools, Materials & Material Processing, Textile Industry Products

Ultrasonic Technology Gains Favor with Major Body Armor Manufacturers for Achieving Compliance with NIJ Waterproof Standards

December 4, 2013

Sonobond's SeamMaster™ High Profile Ultrasonic Sewing Machine to be Featured at SHOT Show, in Las Vegas, January 14-17, 2014 WEST CHESTER, Pennsylvania – Ultrasonic technology is increasingly being used as an assembly method for body armor – and the machine of choice for virtually every major manufacturer is Sonobond's SeamMaster High Profile Ultrasonic Sewing Machine. "One of the... Read More

Materials & Material Processing

Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps

October 25, 2013

SWITZERLAND – Tresky, a worldwide leading manufacturer of micro-assembly systems, announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show. While the show was successful from start to finish, the product highlight included the automatic die bonding system T-6000, which generated much... Read More

Machinery & Machining Tools, Materials & Material Processing, Textile Industry Products, Welding Equipment & Supplies

Sonobond Ultrasonics' Equipment Assembles High Efficiency and Specialty Filtration Products for Great Lakes Filters

September 16, 2013

Attendees at FILTRATION 2013 (Chicago, November 12-14) Will See Machinery that Produces Strong, Perforation-Free Seams Four Times Faster than Sewing and Ten Times Faster than Adhesive Machines WEST CHESTER, Pennsylvania – When Great Lakes Filters, in Hillsdale, Mich., needed an assembly method to produce a liquid filter bag that could hold up to hydraulic pressing without splitting or... Read More

Materials & Material Processing

Dow Corning Joins EV Group's Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

September 11, 2013

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's... Read More

Cleaning Products & Equipment, Electronic Components & Devices, Material Handling & Storage, Materials & Material Processing, Test & Measuring Instruments

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

July 16, 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCO – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for... Read More

Materials & Material Processing

Debonding Processes promote manufacturing flexibility.

July 9, 2013

LowTemp&trade; debonding platform features 3 room-temperature wafer debonding processes and extended material supply chain. Two debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems &ndash; UV laser debonding and multilayer adhesive debonding &ndash; in addition to ZoneBOND® technology, which has been implemented into production across compound semiconductor and advanced packaging markets. Read More

Adhesives & Sealants, Machinery & Machining Tools, Materials & Material Processing

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

June 26, 2013

SWITZERLAND – Tresky, a worldwide leading manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC. The T-6000 Die Bonder is an all-purpose... Read More

Machinery & Machining Tools, Materials & Material Processing, Packaging Equipment, Services, Welding Equipment & Supplies

Sonobond's Free, No-Obligation Ultrasonic Bonding Viability Test Helps Companies Find Practical, Cost-Effective Solutions for Their Textile and Filtration-Assembly Applications

March 1, 2013

Sample ultrasonic bonds are made using materials supplied by prospective customers.  Sonobond then recommends the appropriate ultrasonic bonding equipment to match each firm’s specific needs and requirements. WEST CHESTER, PA - Janet Devine, President of Sonobond Ultrasonics, announced today that the company's free Ultrasonic Bonding Viability Test is proving to be very important to firms... Read More

Machinery & Machining Tools, Materials & Material Processing, Textile Industry Products, Welding Equipment & Supplies

Sonobond Offers a Variety of Ultrasonic Equipment for Manufacturing Applications in the Defense and Aerospace Fields

February 6, 2013

Two Sonobond Machines-the Dual Head SpliceRite(TM) and the SeamMaster(TM) High Profile Textile Bonder-will be Exhibited in Booth #4195 at the AeroCon Show in Anaheim, California on February 12-14, 2013.<4444>WEST CHESTER, Pennsylvania- Sonobond Ultrasonics announced today that it will be exhibiting at the AeroCon Aerospace & Defense Show next month in Anaheim. In making the announcement,... Read More

Machinery & Machining Tools, Material Handling & Storage, Materials & Material Processing

Syneo and Vante to Display Fully Automated Catheter Tipping System

January 31, 2013

West Palm Beach, FL - Syneo, the medical device solutions company, and Vante, the leader in catheter tipping equipment, will be displaying the first fully automated system for catheter tipping, the ATS, at the MD&M West tradeshow in Anaheim, California.  The ATS couples Vante's Saffire ® RF tipping technology with the Syneo Accu-Feed tube feeding system. The end result is a fully automated... Read More

Materials & Material Processing

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

January 8, 2013

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA.<4444>The semi-automated configuration of the FINEPLACER® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual... Read More