Materials & Material Processing

Materials & Material Processing, Electronic Components & Devices

LED Packaging is custom tailored to requirements.

November 24, 2014

Designed to specific customer requirements, LED Substrates and Submounts utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50 µm wide gaps. Direct eutectic die-attach eliminates need for wire bonds. Read More

Electronic Components & Devices, Software, Materials & Material Processing, Test & Measuring Instruments

Rapid Prototyping Kit digitizes wideband RF signals.

November 21, 2014

With AD-FMCDAQ2-EBZ Kit, digital and analog designers can prototype JEDEC JESD204B SerDes GSPS data converter-to-FPGA interface on major FPGA platforms, including Xilinx’s UltraScale FPGA and Zynq All Programmable SoC devices for radar, instrumentation, wireless radio, and other DAQ applications. FMC form factor enables users to verify hardware and processing algorithms and rapidly move from prototype to production, minimizing risk associated with designing wideband RF signal processing systems. Read More

Chemical Processing & Waste Management, Materials & Material Processing, Printing & Duplicating Equipment

Electrically Conductive Silicone targets printed electronics.

November 20, 2014

Designed with less than .003 Ω/cm resistance, EXP-06335 is printable via screen, flexo, or slot die. Heat cure, one part material is packaged in any size container and has stable shelf life of 6 months at room temperature. Flexible and electrically conductive, product adheres to most common circuit board materials, PU, silicone, and metal substrates. It does not require use of primers, buffers, conformal coatings, or silicone gels. Read More

Materials & Material Processing

Parts Washer handles over 20,000 lb.

November 19, 2014

Configurable for variety of parts and capacities from camshafts to locomotive engine blocks, Lean-Jet® RB-FLEX+ uses triple action batch cleaning process. System combines agitation, spray impingement, hydraulic purging through immersion and rotation, and heated blow-off drying. Equipped with Siemens programmable controller, washer is available with options such as clamp and flush, precision probes, and manifolds or ultrasonics if more focused cleaning is required. Read More

Material Handling & Storage, Materials & Material Processing, Packaging Equipment

Barrier Films suit thermoformable, heat-sealable packaging.

November 19, 2014

High-barrier, Barex®-alternative packaging structures feature materials targeting pharmaceutical, medical, cosmetic, food, and other applications. Thermoformable blister/tray film structures offer such options as PE, PP, and Aclar® polychlorotrifluoroethylene inner and outer layers coupled with either ethylene vinyl alcohol copolymer (EVOH) and/or cyclic olefin copolymer (COC). Heat-sealable pouch/lidding flexible materials are offered in various paper/foil/plastic and EVOH combinations. Read More

Electronic Components & Devices, Electrical Equipment & Systems, Materials & Material Processing

Circuit Protection Diode protects 2 CAN bus lines.

November 18, 2014

Providing >25 kV ESD protection, PESD2CAN is suited for assembly line automation, access control systems, and machinery. Component is compatible with IEC standards 61000-4-2 (ESD): air 15 kV, contact 8 kV; with 61000-4-4 (EFT): 40 A, 5/50 ns; and with 61000-4-5 (surge): 4 A, 8/20 µs. Provided in molded JEDEC SOT-23 package, RoHS-compliant diode operates from -55 to 150°C and features 200 W of peak pulse power per line. Read More

Materials & Material Processing, Packaging Equipment

Desiccant Capsules offer 360 degree moisture protection. .

November 18, 2014

Available in 1, 2, and 2.5 g sizes, AdCap® combines advantages of conventional desiccant capsules and canisters and complies with global requirements for drug and patient safety. Capsules offer choice of filling materials, including silica gel, molecular sieve, and blends. High squeeze stability prevents desiccants from leaking, even under high pressure. Capsules not only adsorb moisture through cardboard disc on top, but also through grid structure on side of capsule. Read More

Materials & Material Processing

Matched RFID Materials simplify printed electronics assembly.

November 17, 2014

Engineered to eliminate problems with printed electronics assembly, RFID-GO™ System includes BCE-37611 conductive inks, ANA-17710 die attach adhesives, and PNU-90250 dielectric inks. Since materials are developed as system, they can provide lower or higher resistance values, homogenous speed of cure, and one-pass printing for dielectric strength. Assemblers no longer have to worry about corrosion, poor bonding, incompatibility, or cure profiles that are at odds with each other. Read More