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Machinery & Machining Tools -> Tool Coating Machines


Tool Coating Machines




(Showing headlines 1 - 20)   more ....
Plasma Surface Treatment System improves bonding properties.

Plasma Surface Treatment System improves bonding properties.

Tantec, Inc.    Schaumburg, IL 60193
Apr 14, 2014 Tantec Plasma Surface Treatment Systems are used by medical device manufacturers for pretreatment of needle hubs to ensure adhesion. One solution, intended for 11 lines of needle hub production, features 2 plasma nozzles (for each line) that treat needle hubs before placing needle. Plasma nozzles treat 20 needle hubs per 1.4 sec. By chemically roughing surface, plasma treatment improves bonding and prevents leakage; treated hubs achieve tensile strengths up to 75 N.

Plasma Treatment System handles strip-type electronic components.

Plasma Treatment System handles strip-type electronic components.

Nordson Plasma Systems Group    Concord, CA 94520
Apr 09, 2014 Designed for plasma treatment prior to die attach, wire bond, mold encapsulation, and underfill, FlexTRAK-CDS™ removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing. Plasma chamber treats up to 10 strips per plasma cycle, and integrated handling system accommodates range of strip sizes. Processing can be done from most types of magazines and carriers.

PVD System aids 300 mm power device manufacturing.

SPTS Technologies Limited    Newport   United Kingdom
Sep 09, 2013 With options that include modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers, Sigma fxP addresses challenges faced while scaling power physical vapor deposition (PVD) processes up to 300 mm wafer size. System deposits thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. It also carries thin wafer handling hardware and uses film deposition stress control to maximize throughput with minimal wafer bow.

Plasma System Consumables promote cut quality, equipment life.

Hypertherm, Inc.    Hanover, NH 03755 0010
Apr 04, 2013 Intended for PerCut 210M and 450M torches found on Kjellberg HiFocus systems, Centricut consumables, at 280 A, optimize cut quality throughout their life due in part to SilverLine electrode and CoolFlow nozzle technologies. SilverLine technology features hybrid copper/silver weld joint that delivers performance equal to solid silver electrode. CoolFlow technology optimizes cooling to help maintain size and shape of nozzle orifice for extended life.

Plasma Systems provide PCB corrosion protection.

Semblant, Inc    Chandler, AZ 85286
Oct 23, 2012 Combining vacuum and gas flow technology, optimized RF energy delivery methods, and temperature management, SPF 1000 and SPF 1500 deliver volume production capability for applying Semblant Plasma Finish, which protects PCBs against creep corrosion and environmental pollutants. SPF protects any metal finish and preserves solderability with true metal to metal bonds. SPF 1500 is designed for medium-to-high volume production, while SPF 1000 is intended for lower throughput or high-mix production.

Self-Contained Vacuum Plasma System treats flex PCB materials.

Self-Contained Vacuum Plasma System treats flex PCB materials.

Nordson Plasma Systems Group    Concord, CA 94520
Sep 13, 2012 Featuring dual-rack chamber that accommodates up to eighteen 20 x 24 in. panels in one cycle, FlexVIA™ Plasma System treats inner surface layer of flexible PCB prior to lamination for maximum adhesion and reliability. Both sides of flex material surface area are treated in one-step process, enabling rate of 80–120 units per hour. Negating need for temperature control, blower, or fluorine gases, system utilizes gas plasma solutions, such as Ar and O2, and is controlled via touchscreen GUI.

Plasma Treatment System automates microelectronics processing.

Plasma Treatment System automates microelectronics processing.

Nordson Corp.    Westlake, OH 44145
Jul 16, 2012 FasTRAK(TM) Vacuum Plasma System features robotic movement that eliminates operator handling of lead-frame microelectronic strips or magazines. System accommodates up to 10 strips per batch. Measuring 1.65 m wide x 1.5 m deep, it includes plasma chamber that can be configured for direct or ion-free plasma modes. Also included is material tracking software application and internal camera to count number of strips and track their progress throughout treatment process.

Welding Consumables are engineered for extended life.

Hypertherm, Inc.    Hanover, NH 03755 0010
Aug 10, 2011 Intended for those who use Kjellberg Fine Focus 800 Plus system or HiFocus 280i/360i/440i systems and cut mild steel using either PB-S80 or PerCut 370.2 torch, Centricut consumables are engineered for optimal longevity, cut quality, and process reliability. Properties allow users to maintain cutting speeds required for their applications, and mild steel consumables are precision manufactured to tight tolerances so that cutting systems produce consistent, reliable performance.

Modular E-Coating System has footprint of only 2,000 sq. ft.

MetoKote Corp.    Lima, OH 45801
Nov 18, 2010 Designed for component suppliers and metal stamping companies, customizable mikroKote can fit against wall, around corner, or on mezzanine level. With standard capacity of 2 mil sq ft of coating per 8 hr shift, and 2 min cycle time in 13-stage process, component supplier can have e-coated parts in 2 hr. Unit includes optional wastewater treatment system.

Inline Flux Jetting System provides edge definition of 0.5-1 mm.

Asymtek    Carlsbad, CA 92008
Jul 13, 2010 In conjunction with DJ-2200 DispenseJet® valve with coaxial air technology, Spectrum® S-930N Series enables thin flux coatings as low as 5 microns. Selective flux jetting minimizes flux residue and overspray, while Fluidmove® for Windows® XP software controls amount of flux jetted to accommodate flip chips of varying bump heights. With small footprint of 23.6 x 52.0 in., fully enclosed, vented system includes safety interlocks and emergency stop.

Copper Barrier-Seed PVD System is intended for TSV packaging.

Copper Barrier-Seed PVD System is intended for TSV packaging.

Novellus Systems, Inc.    San Jose, CA 95134
Mar 12, 2010 For copper barrier-seed applications, INOVA® NExT PVD system features Hollow Cathode Magnetron (HCM) IONX source technology. Copper barrier-seed physical vapor deposition (PVD) process, intended for through-silicon-via (TSV) packaging market, delivers optimal sidewall and bottom coverage and enables void-free copper fill during subsequent TSV electroplating step. TSVs enable 3D packaging, where multiple chips are stacked on top of each other into one 3D module.

PVD System deposits copper barrier for memory chips.

Applied Materials, Inc.    Santa Clara, CA 95054
Sep 03, 2008 Applied Endura® Extensa(TM) PVD1 is used for depositing critical barrier films for copper interconnects in sub-55 nm memory chips. Its titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with optimal step coverage and less than 3% film thickness non-uniformity across wafer. Dual-magnet PVD source with flux-shaping side electromagnets enables defectivity below 10 particles at greater than/equal to 0.12 µm.

Electroplating System suits utility-scale solar equipment.

Electroplating System suits utility-scale solar equipment.

METFAB Technologies, Inc.    Warwick, RI 02888
Jul 09, 2008 Operating at continuous speeds up to 30 fpm, METFAB Solar Pipe Electroplating System electroplates metallic coating from 10-100 µin. to the surface of solar thermal power pipes and tubes to optimize heat absorption. Designed for processing tube and pipe from 1-3 in. OD and sheet up to 12 in. wide, it can apply specialty metallic coatings onto wide range of steels and alloys. Customizable aqueous process system includes all controls, electronics, hardware, and tanks.

Sputtering Targets produce high-purity SiC films.

Sputtering Targets produce high-purity SiC films.

Morgan Advanced Ceramics    New Bedford, MA 02745
Jun 02, 2008 Manufactured by chemical vapor deposition process, Silicon Carbide Sputtering Targets consist of homogenous, monolithic material with no particles. High density and lack of porosity results in negligible outgassing of target and makes it suitable for use in ultra-high vacuum conditions. Ranging in size from 3-20 in. diameter, targets are 99.9995% pure, enabling production of highly pure, uniform SiC films that ensure absence of etch residue from reactive ion etch processes.

Rotatable Targets assist thin film solar cell manufacturers.

Sputtering Materials, Inc    Reno, NV 89523
Jan 21, 2008 High-density (99%+) CIG rotatable sputtering targets aid thin film solar manufacturers with casting of ternary alloy CuInGa (CIG). Density of material promotes control and material utilization. With 70% material utilization on rotatable and 25% on planar, spent targets can be reclaimed and re-cast to make new target. Process also works with materials such as In, InSn, Sn, Zn, Al, and SAC.

Consumable Kit facilitates 4 types of plasma cutting.

Hypertherm, Inc.    Hanover, NH 03755 0010
Dec 31, 2007 Intended for owners of Powermax1000®, 1250, or 1650 plasma systems, Consumable Kit includes shielded consumables for everyday drag cutting that involves following line or template. It also comes with unshielded consumables for cutting in tight places, gouging consumables for tough metal removal jobs, and FineCut consumables for precise cuts on thinner plate. Reference guide explains how to get best cut quality and consumable life when cutting with handheld torch.

RF Plasma Generators offer power levels up to 1,250 W.

RF Plasma Generators offer power levels up to 1,250 W.

T & C Power Conversions    Rochester, NY 14610
Sep 26, 2007 Housed in half rack package, XX Series can be controlled manually or via computer-controlled, rear panel analog or digital interfaces. RF stability of output power circuitry gives user control accuracies down to 1 W scales. Featuring ac inputs with Power Factor Correction, generators meet Safety Standards EN/UL 61010-1. Multiple units can be installed side by side in any enclosure or 19 in. equipment rack.

Evaporation Baskets promote line-of-sight coating.

Evaporation Baskets promote line-of-sight coating.

Ceramic Coating, Inc.    Beverly, MA 01915
Aug 14, 2007 Available in 6 sizes with wire diameters from .020-.050 in., Alumina Coated Evaporation Baskets are internally heated crucibles that permit vacuum evaporation of several metals simultaneously, and maintain molten metals evaporants as induction propelled spinning ball within cavity. Units completely evaporate most materials such as gold, nickel, palladium, and silver without loss to chamber. Inside depths range from .225-.975 in. and top IDs range from .150-.900 in.

Metallization System provides copper seed re-sputter.

Novellus Systems, Inc.    San Jose, CA 95134
Jul 31, 2007 Featuring advanced physical vapor deposition technology and ion-induced atomic layer deposition, 300 mm INOVA NExT with HCM IONX(TM) enables thin film barrier and copper seed deposition scalability for 32 nm node. System provides optimized metallic film overhang, step coverage, and film quality for tantalum barrier and copper seed processes. Differentiated source technology can be applied to other thin film metal applications, including titanium and aluminum.

Oxygen Consumables optmize cut time for mild steel.

Hypertherm, Inc.    Hanover, NH 03755 0010
Jun 14, 2007 Featuring power level of 50 A, cutting consumables are designed to optimize edge quality and speed of HyPerformance Plasma® systems when cutting mild steel with thickness between 22 gauge and 5/16 in. Consumables are available for HyPerformance Plasma HPR130 and HPR260 systems as well as HyDefinition® HD3070 and HD4070 systems retrofitted with HyPerformance Plasma torch.




(Showing headlines 1 - 20)   more ....



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