Tool Coating Machines

Machinery & Machining Tools

Ion Source Package facilitates sputter cleaning.

May 29, 2015

Developed for scientists and engineers in analytical labs, universities, research institutions, and government agencies, IG2 Ion Source Package comprises Model 04-165 ion source and Model 32-165 ion source controller. Ion source generates ions with acceleration energies up to 2 keV, and kinetic energy of ions erodes topmost atomic layers of materials in vacuum. Displaying anode current, digital panel meter on front of controller helps set and maintain reproducible ion currents. Read More

Machinery & Machining Tools, Electronic Components & Devices

Cutting Consumables work with non-Hypertherm systems.

October 23, 2014

Designed for use with ESAB PT-36 torches, Centricut Consumables replace ESAB XR consumables. Patented SilverLine electrode technology features hybrid copper/silver weld joint that delivers performance equal to solid silver electrode. By cutting operating temperature of electrode, CoolFlow nozzle technologies maximize hafnium pit depth and slow wear rate to extend electrode life. Read More

Machinery & Machining Tools

Plasma System suits semiconductor and electronics packaging.

September 3, 2014

Equipped with 5.5 liter plasma chamber, FlexTRAK-S™ supports variable-size form factors including boats, carriers, Jedec/Auer® boats, strips, and laminates. System can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as standalone for island-based production environments. Offering direct, downstream, and ion-free plasma treatment modes, system features SMART Tune™ Management System for closed-loop plasma control. Read More

Machinery & Machining Tools, Cleaning Products & Equipment

Plasma Treatment System supports circuit board fabrication.

April 29, 2014

Providing 15-cell chamber in 1.7 x 1.7 m footprint, MaxVIA-Plus™ treats HDI, flexible, and rigid panels for desmear, etchback, and landing pad cleaning operations. PCBs are vertically loaded using easy-loading cart, which minimizes idle time. With unique vacuum and gas flow technology, optimized electrode designs, and temperature management, plasma system delivers highly uniform PCB treatment. Read More

Machinery & Machining Tools

Plasma Surface Treatment System improves bonding properties.

April 14, 2014

Tantec Plasma Surface Treatment Systems are used by medical device manufacturers for pretreatment of needle hubs to ensure adhesion. One solution, intended for 11 lines of needle hub production, features 2 plasma nozzles (for each line) that treat needle hubs before placing needle. Plasma nozzles treat 20 needle hubs per 1.4 sec. By chemically roughing surface, plasma treatment improves bonding and prevents leakage; treated hubs achieve tensile strengths up to 75 N. Read More

Machinery & Machining Tools

Plasma Treatment System handles strip-type electronic components.

April 9, 2014

Designed for plasma treatment prior to die attach, wire bond, mold encapsulation, and underfill, FlexTRAK-CDS™ removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing. Plasma chamber treats up to 10 strips per plasma cycle, and integrated handling system accommodates range of strip sizes. Processing can be done from most types of magazines and carriers. Read More

Machinery & Machining Tools

PVD System aids 300 mm power device manufacturing.

September 9, 2013

With options that include modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers, Sigma fxP addresses challenges faced while scaling power physical vapor deposition (PVD) processes up to 300 mm wafer size. System deposits thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. It also carries thin wafer handling hardware and uses film deposition stress control to maximize throughput with minimal wafer bow. Read More

Machinery & Machining Tools

Plasma System Consumables promote cut quality, equipment life.

April 4, 2013

Intended for PerCut 210M and 450M torches found on Kjellberg HiFocus systems, Centricut consumables, at 280 A, optimize cut quality throughout their life due in part to SilverLine electrode and CoolFlow nozzle technologies. SilverLine technology features hybrid copper/silver weld joint that delivers performance equal to solid silver electrode. CoolFlow technology optimizes cooling to help maintain size and shape of nozzle orifice for extended life. Read More

Machinery & Machining Tools

Plasma Systems provide PCB corrosion protection.

October 23, 2012

Combining vacuum and gas flow technology, optimized RF energy delivery methods, and temperature management, SPF 1000 and SPF 1500 deliver volume production capability for applying Semblant Plasma Finish, which protects PCBs against creep corrosion and environmental pollutants. SPF protects any metal finish and preserves solderability with true metal to metal bonds. SPF 1500 is designed for medium-to-high volume production, while SPF 1000 is intended for lower throughput or high-mix production. Read More

Material Handling & Storage, Machinery & Machining Tools

Self-Contained Vacuum Plasma System treats flex PCB materials.

September 13, 2012

Featuring dual-rack chamber that accommodates up to eighteen 20 x 24 in. panels in one cycle, FlexVIA™ Plasma System treats inner surface layer of flexible PCB prior to lamination for maximum adhesion and reliability. Both sides of flex material surface area are treated in one-step process, enabling rate of 80–120 units per hour. Negating need for temperature control, blower, or fluorine gases, system utilizes gas plasma solutions, such as Ar and O2, and is controlled via touchscreen GUI. Read More

Machinery & Machining Tools

Plasma Treatment System automates microelectronics processing.

July 16, 2012

FasTRAK(TM) Vacuum Plasma System features robotic movement that eliminates operator handling of lead-frame microelectronic strips or magazines. System accommodates up to 10 strips per batch. Measuring 1.65 m wide x 1.5 m deep, it includes plasma chamber that can be configured for direct or ion-free plasma modes. Also included is material tracking software application and internal camera to count number of strips and track their progress throughout treatment process. Read More

Welding Equipment & Supplies, Machinery & Machining Tools

Welding Consumables are engineered for extended life.

August 10, 2011

Intended for those who use Kjellberg Fine Focus 800 Plus system or HiFocus 280i/360i/440i systems and cut mild steel using either PB-S80 or PerCut 370.2 torch, Centricut consumables are engineered for optimal longevity, cut quality, and process reliability. Properties allow users to maintain cutting speeds required for their applications, and mild steel consumables are precision manufactured to tight tolerances so that cutting systems produce consistent, reliable performance. Read More

Material Handling & Storage, Machinery & Machining Tools

Modular E-Coating System has footprint of only 2,000 sq. ft.

November 18, 2010

Designed for component suppliers and metal stamping companies, customizable mikroKote can fit against wall, around corner, or on mezzanine level. With standard capacity of 2 mil sq ft of coating per 8 hr shift, and 2 min cycle time in 13-stage process, component supplier can have e-coated parts in 2 hr. Unit includes optional wastewater treatment system. Read More

Material Handling & Storage, Machinery & Machining Tools

Inline Flux Jetting System provides edge definition of 0.5-1 mm.

July 13, 2010

In conjunction with DJ-2200 DispenseJet® valve with coaxial air technology, Spectrum® S-930N Series enables thin flux coatings as low as 5 microns. Selective flux jetting minimizes flux residue and overspray, while Fluidmove® for Windows® XP software controls amount of flux jetted to accommodate flip chips of varying bump heights. With small footprint of 23.6 x 52.0 in., fully enclosed, vented system includes safety interlocks and emergency stop. Read More

Machinery & Machining Tools

Copper Barrier-Seed PVD System is intended for TSV packaging.

March 12, 2010

For copper barrier-seed applications, INOVA® NExT PVD system features Hollow Cathode Magnetron (HCM) IONX source technology. Copper barrier-seed physical vapor deposition (PVD) process, intended for through-silicon-via (TSV) packaging market, delivers optimal sidewall and bottom coverage and enables void-free copper fill during subsequent TSV electroplating step. TSVs enable 3D packaging, where multiple chips are stacked on top of each other into one 3D module. Read More

Machinery & Machining Tools

PVD System deposits copper barrier for memory chips.

September 3, 2008

Applied Endura® Extensa(TM) PVD1 is used for depositing critical barrier films for copper interconnects in sub-55 nm memory chips. Its titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with optimal step coverage and less than 3% film thickness non-uniformity across wafer. Dual-magnet PVD source with flux-shaping side electromagnets enables defectivity below 10 particles at greater than/equal to 0.12 µm. Read More

Chemical Processing & Waste Management, Machinery & Machining Tools

Electroplating System suits utility-scale solar equipment.

July 9, 2008

Operating at continuous speeds up to 30 fpm, METFAB Solar Pipe Electroplating System electroplates metallic coating from 10-100 µin. to the surface of solar thermal power pipes and tubes to optimize heat absorption. Designed for processing tube and pipe from 1-3 in. OD and sheet up to 12 in. wide, it can apply specialty metallic coatings onto wide range of steels and alloys. Customizable aqueous process system includes all controls, electronics, hardware, and tanks. Read More

Machinery & Machining Tools

Sputtering Targets produce high-purity SiC films.

June 2, 2008

Manufactured by chemical vapor deposition process, Silicon Carbide Sputtering Targets consist of homogenous, monolithic material with no particles. High density and lack of porosity results in negligible outgassing of target and makes it suitable for use in ultra-high vacuum conditions. Ranging in size from 3-20 in. diameter, targets are 99.9995% pure, enabling production of highly pure, uniform SiC films that ensure absence of etch residue from reactive ion etch processes. Read More

Machinery & Machining Tools

Rotatable Targets assist thin film solar cell manufacturers.

January 21, 2008

High-density (99%+) CIG rotatable sputtering targets aid thin film solar manufacturers with casting of ternary alloy CuInGa (CIG). Density of material promotes control and material utilization. With 70% material utilization on rotatable and 25% on planar, spent targets can be reclaimed and re-cast to make new target. Process also works with materials such as In, InSn, Sn, Zn, Al, and SAC. Read More

Machinery & Machining Tools

Consumable Kit facilitates 4 types of plasma cutting.

December 31, 2007

Intended for owners of Powermax1000®, 1250, or 1650 plasma systems, Consumable Kit includes shielded consumables for everyday drag cutting that involves following line or template. It also comes with unshielded consumables for cutting in tight places, gouging consumables for tough metal removal jobs, and FineCut consumables for precise cuts on thinner plate. Reference guide explains how to get best cut quality and consumable life when cutting with handheld torch. Read More