PolyScience Div. Of Preston Industries Inc.
Niles, IL 60714 4588
Sep 12, 2007 Featuring adjustable temperature, pressure, and flow rate alarms, 1.5 ton Refrigerating/Heating Chiller provides heating and cooling for semiconductor fabrication processes. Integral 7,500 or 9,000 W heater controls temperature during vacuum chamber or reaction vessel heating, soaking, and cooling cycles. From 5 to 90°C, with ±0.5°C temperature stability, chiller provides up to 6,328 W of cooling. Its ¾ or 1 hp turbine pump accommodates various process flow and pressure requirements.

OK International
Garden Grove, CA 92841
Aug 22, 2007 Array package rework system, APR-5000-DZ, delivers targeted and controlled heating for BGA and SMT rework of high thermal demand boards, including lead-free and multilayer assemblies up to 12 x 12 in. In addition to top-side convection heater, system incorporates dual convection bottom-side heater. Nozzle design protects components directly adjacent to rework zone and other temperature-sensitive devices. Software facilitates training and provides repeatable process control.

STMicroelectronics
Carrollton, TX 75006
Jul 03, 2007 Design platform for power-optimized system-on-chip solutions features multiple threshold transistors as well as 193 nm immersion lithography, shallow-trench isolation and transistor stressors, and advanced junction engineering. Densities of up to 1,600 Kgates/mm² are available, supporting core supply of 1.1 V with metal pitches of 0.14 micron and from 6-10 metal routing layers. High-performance and low power consumption cell libaries are available.

Edwards Vacuum Technology
Wilmington, MA 01887
Jun 19, 2007 Based on inward-fired combustion technology, HELIOS 6(TM) gas abatement solution has head design with 6 inlets for process gases and one inlet for gas box purges or other ancillary operations. Unit does not require compressed air and can reduce hydrogen concentrations below lower explosive limit (LEL) in flows as high as 200 slm. Applications include high hydrogen flow processes, such as Si and SiGe epitaxy, LPCVD tungsten, and compound semiconductor MOCVD.

OK International
Garden Grove, CA 92841
Jun 19, 2007 Designed for BGA and SMT rework, APR-5000-DZ Array Package Rework System uses dual convection bottom-side heater to accelerate rework and sustain temperature levels required by component and material manufacturer specifications. Solution delivers targeted and controlled heating for rework of high thermal demand boards, including Pb-free and multi-layer assemblies up to 12 x 12 in. Other components include precision alignment control, integrated vision system, strobe light.

OK International
Garden Grove, CA 92841
Feb 09, 2007 Using Thermal Tweezers Nozzles, engineers can remove devices such as multiple vertically stacked ICs without damaging IC packages and without exposing PCB to excessive reflow cycles. Units allow heat to be confined to localized area of stacked solder joints, preventing total PCB from reaching reflow temperatures. Operating at 200°C, nozzles are also suited for use with glob-top encapsulated die, small components, and fine pitch plastic connectors.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Dec 22, 2006 Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Mimot - California, LLC
Irvine, CA 92618 2326
Dec 21, 2006 Featuring cascading modularity, Model MX offers placement rates up to 80,000 c/hr and provides 216 feeder slots per segment. It includes double placement areas in each module, with Multilevel Transport System for absolute line balancing and elimination of local head-downtimes.

Universal Instruments Corp.
Binghamton, NY 13902 0825
Oct 24, 2006 Supporting requirements of high-speed chip placement, 0201-capable 8 mm Gold dual-lane feeders offer PSV reel detection sensor that enhances traceability for absolute line control. Single lane Black 8 mm and 12 mm electric feeders, designed for medium to low-volume midrange applications, ensure traceability with unique feeder ID. All feeders are compatible with Lightning rotary-motion surface-mount component placement head.

Universal Instruments Corp.
Binghamton, NY 13902 0825
Sep 12, 2006 Including PSV sensor that notifies machine and line software when component reels are serviced by operator, High-Performance Gold Feeders support line-level reporting and traceability functionality. They offer continuous splice capability and high speed chip component presentation. Single lane 8 and 12 mm feeders have features for precise and repeatable feeder registration, while 16, 24, and 32 mm high torque mode feeders are designed for large part delivery.

DEK International GmbH
Zurich Ch-8005  Switzerland
Aug 31, 2006 SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms enable processing times of 20 sec and less for individual parts, depending on process.

Asymtek
Carlsbad, CA 92008
Aug 28, 2006 Enabling underfill flow-out in one lane while jetting underfill in opposite lane, Axiom X-1022 Dual-Lane dispensing system optimizes throughput in multi-pass underfill applications. SMEMA compliant, programmable, flat-belt conveyors are independently controlled, allowing different sized parts to be processed in each lane. System is configured with 6 stations of contact or impingement heating to ensure consistent substrate heating at specified ramp rates.

Automation Engineering Incorporated
Wilmington, MA 01887
Aug 11, 2006 CMAT© (Camera Module Assembly and Test) stations enable digital camera OEMs to produce different models on same equipment and production lines with minimal changeover. Automated alignment and test stations assemble lens to camera sensor on PCB in up to 6 degrees of freedom. With support for automated assembly of various digital camera sensors and lens housing designs, stations are built to order for optimal performance. Included software provides variety of quality tests.

Advanced Energy Industries Inc.
Fort Collins, CO 80525
Aug 01, 2006 Designed for RTP, HDP-CVD, epi, ALD, and HDD applications, Model OR4000T provides multi-channel temperature measurement and enables integrated measurements within multiple chambers. Model OR4000E offers same performance with added real-time emissivity compensated temperature measurement and ability to support growth rate monitoring. Single-channel Model OR400T provides non-contact, in-situ temperature measurement and immunity from RF noise.

Universal Instruments Corp.
Binghamton, NY 13902 0825
Jun 15, 2006 Designed for semiconductor and standard surface mount assembly, AdVantis XS(TM) delivers accuracies of ±9 microns at ±3 sigma. Class 1000 clean room compatible system offers capability and functionality required for high-end assembly including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, dispensing, and variety of feeder types.

Clean Air Products Clean Air Systems Div.
Minneapolis, MN 55445 1828
Jun 15, 2006 Satisfying stringent cleanliness requirements of semiconductor process facilities, Series 1414 achieves flexibility by mounting components on support rails. Stations include modular electrical devices and plumbing systems, and are available in white stress-relieved polypropylene, natural polypropylene, fire retardant polypropylene, stainless, and PVC. Based on touch-tone microprocessors, units feature heated tanks with liquid level sensors, high-limit overrides, and GFIs.

KLA-Tencor Corp.
San Jose, CA 95134
Jun 14, 2006 Designed for hard disk drive (HDD) and semiconductor memory markets, MRW3(TM) magnetic metrology system delivers magnetic field repeatability of <0.1 oersted. It measures magnetic properties of HDD recording heads and MRAM on product wafers for production control and early detection of detrimental process issues. Other features include GEM/SECS factory automation, 1,000 hr MTBF, and 200 and 300 mm configurations.

OK International
Garden Grove, CA 92841
May 16, 2006 Rated 300 W, HCT-900 hot air tool is designed for removing and replacing thermally demanding lead-free components from 0201s to 304-pin QFPs. Closed-loop thermocouple feedback regulates output temperatures, and control temperatures can be set from 212 to 293ºF. In addition to low-noise pump (less than 45 dB), product features air pump, cool-down functions, and analog controls. It comes in 3 versions to suit 100, 115, and 230 Vac input voltages.

KLA-Tencor Corp.
San Jose, CA 95134
Mar 22, 2006 Integrated with Archer overlay, eCD CD SEM, and SpectraCD optical CD metrology platforms for 65 nm and below IC production, K-T Analyzer lithography correctable platform provides automated, on-tool analysis of overlay and critical dimension metrology data in real time. System gives engineers immediate feedback on quality of lithography process, enabling them to correct errors, minimize unnecessary wafer rework, and ensure tight process control is maintained.

Able Design, Inc.
Mountain View, CA 94043
Mar 10, 2006 Series M1508 DIMM Stackers are designed to interface with various testers, labelers, and other DIMM handlers. Integrated sensor starts machine up automatically and 2 thumbscrews adjust unit to accommodate different DIMM sizes. Model 1508-2 has built-in ramp for interfacing to DIMM testers that release DIMMs at an angle. Model 1508-1, without ramp, interfaces to label machines that release DIMMs horizontally. Both models stack at rate of 2.5 sec/DIMM.