Circuits

Circuits

Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers

Represents the First Partnership to Address the Cost, Engineering and Supply Chain Challenges Associated with Silicon Interposers Needed for Next Generation Chip Designs JARFALLA, Sweden and SAN JOSE, Calif. - Silex Microsystems, the world's largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today...

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Miscellaneous Boards

Xilinx and Its Ecosystem Showcase All Programmable and Smarter Vision Systems at NAB 2013

10 demonstrations highlight smart real-time analytics, intelligent transport, and immersive displays for next-generation broadcast systems LAS VEGAS - NAB 2013, booth #N311 - Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem are demonstrating All Programmable and smarter professional broadcast systems, which employ Xilinx-® solutions for video and Smarter Vision applications.  Demonstrations...

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Circuits

Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers

Represents the First Partnership to Address the Cost, Engineering and Supply Chain Challenges Associated with Silicon Interposers Needed for Next Generation Chip Designs JARFALLA, Sweden and SAN JOSE, Calif. - Silex Microsystems, the world's largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today...

Read More »
Miscellaneous Boards

Xilinx and Its Ecosystem Showcase All Programmable and Smarter Vision Systems at NAB 2013

10 demonstrations highlight smart real-time analytics, intelligent transport, and immersive displays for next-generation broadcast systems LAS VEGAS - NAB 2013, booth #N311 - Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem are demonstrating All Programmable and smarter professional broadcast systems, which employ XilinxÂ-® solutions for video and Smarter Vision applications. ...

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Vision and Imaging Sensors / Detectors

AltaSens Introduces Two New Imaging Products

WESTLAKE VILLAGE, Calif.– AltaSens, Inc., a leader in CMOS image sensor development, introduced two new products: the AL30210C image sensor, its latest generation 1/3 CMOS sensor, and the ALWPU, a companion Wide Dynamic Range (WDR) processing unit.-  The WDR ASIC solution was recently on display throughout the four-day China Public Security Expo (CPSE) and attracted a variety of customers...

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Vision and Imaging Sensors / Detectors

AltaSens Introduces Two New Imaging Products

WESTLAKE VILLAGE, Calif.– AltaSens, Inc., a leader in CMOS image sensor development, introduced two new products: the AL30210C image sensor, its latest generation 1/3 CMOS sensor, and the ALWPU, a companion Wide Dynamic Range (WDR) processing unit.Â-  The WDR ASIC solution was recently on display throughout the four-day China Public Security Expo (CPSE) and attracted a variety of customers...

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Video Encoders

ViXS(TM) Announces XCode(TM) Pro 350 - World's First Transcoder Chip to Support 10 bit Ultra HD 4K and High Efficiency Video Codec (HEVC)

Enables Use of Next-Generation Video Format While Significantly Reducing- Bandwidth Consumption TORONTO - ViXS Systems Inc. today announced the new XCode Pro 350, the world's first silicon solution for transcoding 10 bit HEVC content to MPEG-2 and MPEG-4, enabling the media industry to save significant bandwidth for distributing existing content formats as well as the next-generation...

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Video Encoders

ViXS(TM) Announces XCode(TM) Pro 350 - World's First Transcoder Chip to Support 10 bit Ultra HD 4K and High Efficiency Video Codec (HEVC)

Enables Use of Next-Generation Video Format While Significantly ReducingÂ- Bandwidth Consumption TORONTO - ViXS Systems Inc. today announced the new XCode Pro 350, the world's first silicon solution for transcoding 10 bit HEVC content to MPEG-2 and MPEG-4, enabling the media industry to save significant bandwidth for distributing existing content formats as well as the...

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Electronic Converters

Antenna Tuning Circuit supports MIPI Alliance RFFE standard.

Supplied in 0.4 mm pitch, 0.6 mm high chip-scale package,- STHVDAC-304MF3 has 4-channel output for adjusting up to 4 tunable BST capacitors in antenna-matching circuits of multi-band GSM/WCDMA/3G-LTE smartphones. Product comprises high-voltage DAC for generating capacitor-tuning voltages from 2–20 V and is controlled via RF Front End (RFFE)-compliant, 1.8 V interface. Standard features...

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Electronic Converters

Antenna Tuning Circuit supports MIPI Alliance RFFE standard.

Supplied in 0.4 mm pitch, 0.6 mm high chip-scale package,Â- STHVDAC-304MF3 has 4-channel output for adjusting up to 4 tunable BST capacitors in antenna-matching circuits of multi-band GSM/WCDMA/3G-LTE smartphones. Product comprises high-voltage DAC for generating capacitor-tuning voltages from 2–20 V and is controlled via RF Front End (RFFE)-compliant, 1.8 V interface. Standard...

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