Ironwood Electronics, Inc.
St. Paul, MN 55121
May 15, 2009 Suited for 15 x 15 mm package size, SG-BGA-6286 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Product can can handle up to 100 W with custom heat sink, and contact resistance is 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features operating temperature range between -40°C to +100°C, pin self inductance of 0.15 µH, and current capacity of 2 A/pin.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 27, 2009 Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40 to +100°C. It is manufactured with high-performance/low-inductance elastomer contactor.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 04, 2009 Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100°C, pin self inductance of 0.11 nH and mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and 5 A/pin current capacity.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Feb 24, 2009 Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100°C, pin self-inductance of 0.11 nH, mutual inductance of 0.028 nH, 0.028 pF of capacitance to ground, and current capacity of 5 A/pin.

Mill-Max Mfg. Corp.
Oyster Bay, NY 11771
Feb 03, 2009 Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize high-temperature thermoplastic suitable for wave-soldering and reflow soldering.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 15, 2009 CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact on 0.80 mm pitch or larger. Operating temperature is from -67 to +302°F.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Sep 30, 2008 Designed for 0.5 mm pitch QFN 24 pin IC's, DG-QFN24C-01 socket comes in 4 x 4 mm package with less than 1 dB of insertion loss. Constructed with low inductance diamond particle interconnect contactor, it can dissipate up to several watts without extra heat sinking and handle up to 100 W with custom heat sink. Unit features operating temperature range of -70 to +200°C and contact resistance of 3 mW per pin. Contactor is capable of 100,000 insertions.

Samtec, Inc.
New Albany, IN 47151 1147
Sep 03, 2008 Suited for military and industrial applications, SBS Series SiliconBlade Socket can be used with SiliconDrive II USB Blade. Rugged, lightweight, and vertical unit includes Edge Rate contact system which offers Signal Integrity with high impedance control, reduced broadside coupling, and vibration dampening features. Deep polarizing guide rails add mechanical support and assure proper USB Blade insertion, while polarizing posts ensure proper socket placement.

Molex Inc.
Lisle, IL 60532-1682
May 23, 2008 Minimizing component count, LED Sockets permit automated high-speed pick-and-placement of LEDs and resistors. Units include heat sink and can connect with standard Edison-base, GU 24-base, or custom interfaces. Compatible with reflow solder, sockets run directly from 110 V, eliminating need for driver, transformer, or inductor.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Apr 01, 2008 Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH pin self-inductance, and 0.028 nH mutual inductance. Current capacity is 5 A/pin.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 10, 2008 Available with 2 mounting options, Model SG-SOIC-3000 GHz Socket provides signal integrity, and requires about 2.5 mm extra space around chip than actual chip size. Compact ZIF socket features 0.5 or 0.75 mm signal path, -35 to 100°C operating temperature, elastomeric interconnect technology, less than 1 dB signal noise at 6.5 or 10 GHz, and contact resistance of 23 mW per lead. SOIC leads are precisely guided in socket.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Dec 06, 2007 Designed for ST Micro 35 mm and 27 mm package sizes, Models SG-BGA-6245 and SG-BGA-6246 operate at bandwidths up to 8 GHz with less than 1 dB of insertion loss, dissipate up to 4.5 W at 40°C, can handle up to 100 W with heat sink, and have 23 mW/pin of contact resistance. Constructed with low inductance elastomer, they feature temperature range of -35 to +100°C, 10.15 nH pin inductance, and 0.10 pF of capacitance to ground.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Oct 15, 2007 Accommodating 12 mm BGA body size IC packages with 28 x 28 array and 515 balls, Model SG-BGA-7096 can operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss, and can dissipate up to 100 W with custom heat sink. Socket requires only space on board for 2 mounting screw areas and 2.5 mm clearance around chip. Unit features typical contact resistance of 23 mW per pin, 10.15 nH pin inductance, and 0.10 pF capacitance. It operates over temperature range of -35 to +100°C.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Feb 06, 2007 Designed for 0.5 mm pitch devices, Models SG-MLF-7012 and SG-MLF-7014 operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss. They dissipate up to several Watts without extra heat sinking and can handle up to 100 W with custom heat sink. Operating from -35 to +85°C, sockets feature pin inductance of 10.15 nH, contact resistance of 23 mW per pin, and capacitance to ground of 0.10 pF.

Advanced Interconnections Corp.
West Warwick, RI 02893
Jan 26, 2007 Available in 0.65 mm pitch BGA and LGA footprints, hybrid socket adapters utilize both male and female pins in interstitial pattern, and feature screw-machined terminals with multi-finger contacts in compact SMT socket. Units feature standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHS compliant applications. Alignment pins protect pin field and aid in hand placement, with optional stand-offs available.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Sep 13, 2006 With 10 GHz bandwidth, Model SG-QFE-7000 accommodates 128-pin, 14 mm, 0.4 mm pitch TI Power Pad ICs without performance loss. Unit dissipates up to several watts without extra heatsinking and can handle up to 100 W with custom heatsink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, sockets feature temperature range of -35 to +85°C, pin inductance of 10.15 nH, and capacitance to ground of 0.10 pF.

Advantest America Corp.
Santa Clara, CA 95054
Mar 09, 2006 Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8, 1, and 1.27 mm pitches.

Keystone Electronics Corp.
Astoria, NY 11105
Mar 11, 2005 Low-profile, TO-3 Power Transistor Sockets aid in installation of JEDEC-TO-3 MPM Power Transistors by eliminating need to use insulated bushings. Design incorporates collector strip terminal with 6–20 formed threads at either end of socket to facilitate mounting. Additional design elements include nylon tops to accommodate .030, .045, and .090 in. chassis thicknesses and electro-plated, spring brass contacts that accept .040 and .060 in. pins.

FCI Electronics
Etters, PA 17319 9769
Dec 01, 2004 Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook on bottom of graphics card.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 30, 2002 Correct-A-Chip® allows SSOP devices to be used on boards designed for older SOWIC packages without board rework or redesign. It is offered in 20- and 28-pin versions. SSOP 0.65 mm pitch package can be hand soldered or attached by standard SMT soldering on adapter's top side. Pins are hardened brass alloy with tin-lead plating. Operating temperature range is -67 to 257°F.