Ironwood Electronics, Inc.
St. Paul, MN 55121
Sep 30, 2008 Designed for 0.5 mm pitch QFN 24 pin IC's, DG-QFN24C-01 socket comes in 4 x 4 mm package with less than 1 dB of insertion loss. Constructed with low inductance diamond particle interconnect contactor, it can dissipate up to several watts without extra heat sinking and handle up to 100 W with custom heat sink. Unit features operating temperature range of -70 to +200°C and contact resistance of 3 mW per pin. Contactor is capable of 100,000 insertions.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 12, 2008 RF test sockets, for use with PCBs, and CSP/BGA test and burn-in sockets, for use with burn-in-boards (BIB), feature solderless, gold over nickel-plated pressure mount compression spring probes that are mounted with 4 SS screws, which allows for height variations in device thickness. Units also include 4-point spring probe crown to insure scrub on solder ball oxides. Signal path during test is 0.977 in. and units operate from -67 to +302°F and accommodate up to 500,000 cycles.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Sep 12, 2008 Designed for 11 x 11 mm, 0.65 mm pitch, 15 x 15 array 225 balls, ASE 225 LTFBGA SS-BGA225G-01 is 10 GHz high endurance socket that can be used for hand test and burn-in applications. With 16 g actuation force per ball and -40 to +150°C temperature range, spring pin contactor has self inductance of 1.3 nH, insertion loss of less than 0.25 dB at 4.5 GHz (less than 3dB at 10GHz), capacitance of 0.53 pF, and 2.5 A current capacity.

Samtec, Inc.
New Albany, IN 47151 1147
Sep 03, 2008 Suited for military and industrial applications, SBS Series SiliconBlade Socket can be used with SiliconDrive II USB Blade. Rugged, lightweight, and vertical unit includes Edge Rate contact system which offers Signal Integrity with high impedance control, reduced broadside coupling, and vibration dampening features. Deep polarizing guide rails add mechanical support and assure proper USB Blade insertion, while polarizing posts ensure proper socket placement.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 28, 2008 Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that provides proper force against device and allows for height variations in device thickness.

3M Co., Electronic Products Div.
Austin, TX 78726
Jul 28, 2008 Measuring 2 x 2 mm, 3M family of latch/eject headers feature 13-pin count options from 6-50 positions. Connector bodies have cut-out to accommodate mating connectors with centre bump polarization and are made from PCT resins, allowing for high-temperature processing in lead-free environments up to 260°C in compliance with JEDEC J-STD-020C standard. Family offers RoHS compliant straight and right-angle plated pins, and through-hole tails for boards up to 31.75 mm thickness.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Jul 08, 2008 Designed for processor with POP memory socketed on top, Model SG-BGA-7116 operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. It features typical contact resistance of 100 mW per pin, 5 A per pin current capacity, -40 to +100°C temperature range, and self and mutual inductance of 0.11 and 0.028 nH, respectively. Unit is constructed with high performance and low inductance elastomer on both socketing levels with gold plated, barbed pad.

Sullins Electronics Corp.
San Marcos, CA 92079-0189
Jun 30, 2008 Offered in plated through hole and SMT versions, male and female 0.050 in. headers are available with one or 2 rows of up to 50 contacts each. RoHS-compliant products, ordered with straight or right-angle dip-solder terminations, are also available in specifiable pin lengths and insulator height options. While female versions are supplied with high-temperature liquid crystal polymer insulators, male parts feature Nylon 9T insulators. Both have current rating of 1 A per contact.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Jun 06, 2008 Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, SG-BGA-6252 is designed for 9 x 11 mm, 0.8 mm pitch, 60 pin BGA package while SG-BGA-6253 is designed for 9 x 13 mm, 0.8 mm pitch, 84 pin BGA package. BGA sockets dissipate up to several watts without extra heat sinking and can dissipate greater amount with custom heat sink. They feature contact resistance of 25 mW per contact, temperature range of -35 to +100°C, and pin inductance of 0.28 nH.

Molex Inc.
Lisle, IL 60532-1682
May 23, 2008 Minimizing component count, LED Sockets permit automated high-speed pick-and-placement of LEDs and resistors. Units include heat sink and can connect with standard Edison-base, GU 24-base, or custom interfaces. Compatible with reflow solder, sockets run directly from 110 V, eliminating need for driver, transformer, or inductor.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Apr 01, 2008 Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH pin self-inductance, and 0.028 nH mutual inductance. Current capacity is 5 A/pin.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 10, 2008 Available with 2 mounting options, Model SG-SOIC-3000 GHz Socket provides signal integrity, and requires about 2.5 mm extra space around chip than actual chip size. Compact ZIF socket features 0.5 or 0.75 mm signal path, -35 to 100°C operating temperature, elastomeric interconnect technology, less than 1 dB signal noise at 6.5 or 10 GHz, and contact resistance of 23 mW per lead. SOIC leads are precisely guided in socket.

FCI
Etters, PA 17319
Feb 06, 2008 Designed to mate with ribbon cable receptacles, 2 mm Minitek(TM) features 2 side latches, which hold receptacle securely in place and can be used to eject it whenever required. Low-profile unit is suited for demanding environments and applications with high vibration. Polarization option is available.

Molex Inc.
Lisle, IL 60532-1682
Dec 18, 2007 Suited for mid-range power applications where power density and current capacity is of concern, Mini-Fit RTC(TM) (RoHS Temperature Capable) Headers feature LCP housing capable of withstanding SMT solder-reflow temperatures to 260°C. Products feature press-fit PCB pegs and are compatible with Pb-free RoHS reflow processes. Mini-Fit Plus HCS(TM) male pins provide up to 12.0 A per circuit, and Mini-Fit locking thumb latch ensures positive locking of mating connectors.

Schneider Electric
Palatine, IL 60067-7399
Dec 18, 2007 Along with finger-safe terminals that protect operators from live circuits, 782 Series Ice Cube Sockets have option to add plug-in modules to protect relays against power surges. RoHS-compliant sockets provide modular system that meets plug-in relay requirements and are UL-listed when mated to Magnecraft relays. Internal coil bus jumper system connects adjacent sockets and eliminates need to insert stripped jumper wires into coil terminals.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Dec 06, 2007 Designed for ST Micro 35 mm and 27 mm package sizes, Models SG-BGA-6245 and SG-BGA-6246 operate at bandwidths up to 8 GHz with less than 1 dB of insertion loss, dissipate up to 4.5 W at 40°C, can handle up to 100 W with heat sink, and have 23 mW/pin of contact resistance. Constructed with low inductance elastomer, they feature temperature range of -35 to +100°C, 10.15 nH pin inductance, and 0.10 pF of capacitance to ground.

Antares Advanced Test Technologies
Vancouver, WA 98683
Nov 07, 2007 Able to accept QFN packages down to 0.35 mm pitch, 880 Series features compression mount clamshell that allows chipmakers to remove or replace sockets and retain production capacity if they were to be damaged. Specifications include beryllium copper alloy contact, gold contact plating, 20 g contact force, temperature rating of -40 to 155°C, and durability of 30,000 cycles. Socket's wiping-action contact works to create consistent resistance during burn-in, reducing maintenance.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Nov 01, 2007 Constructed of black UL 94V-0 glass filled 4/6 Nylon, Series 680 programmable headers and covers are available with either plain (solid) or top-slot press-on covers. They feature 3/4 hard brass alloy pins, as well as tin pin plating, and offer 50-150 m minimum matte tin per ASTM B545-97 over 50 m nickel plating per SAE-AMS-QQ-N-290. With current rating of 1 A, units have operating temperature of 221°F. Products can be mounted in PCB hole size of 0.032 ± 0.002 in. in dia.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Oct 15, 2007 Designed for 7 mm package, Model SG-BGA-7070 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Unit dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, SG-BGA-7070 features operating temperature of -35 to +85°C, pin inductance of 10.15 nH, and capacitance to ground of 0.10 pF.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Oct 15, 2007 Accommodating 12 mm BGA body size IC packages with 28 x 28 array and 515 balls, Model SG-BGA-7096 can operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss, and can dissipate up to 100 W with custom heat sink. Socket requires only space on board for 2 mounting screw areas and 2.5 mm clearance around chip. Unit features typical contact resistance of 23 mW per pin, 10.15 nH pin inductance, and 0.10 pF capacitance. It operates over temperature range of -35 to +100°C.