ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business
 Journals
Industry Market Trends ®
Fluid & Gas Flow Journal
Machining Journal
Procurement Journal
Tech Trends Journal
 Industry News
Latest New Product News
Association & Government News
 Product News
Adhesives and Sealants
Agricultural and Farming Products
Architectural and Civil Engineering Products
Automatic ID
Chemical Processing and Waste Management
Cleaning Products and Equipment
Communication Systems and Equipment
Computer Hardware and Peripherals
Construction Equipment and Supplies
Controls and Controllers
Display and Presentation Equipment
Electrical Equipment and Systems
Electronic Components and Devices
Explosives, Armaments and Weaponry
Fasteners and Hardware
Fluid and Gas Flow Equipment
Food Processing and Preparation
Green & Clean
Health, Medical and Dental Supplies and Equipment
HVAC
Labels, Tags, Signage and Equipment
Laboratory and Research Supplies and Equipment
Lubricants
Machinery and Machining Tools
Material Handling and Storage
Materials and Material Processing
Mechanical Components and Assemblies
Mechanical Power Transmission
Mining, Oil Drilling & Refining
Mounting and Attaching Products
Non-Industrial Products
Optics and Photonics
Packaging Products & Equipment
Paints and Coatings
Plant Furnishings and Accessories
Portable Tools
Printing and Duplicating Equipment
Retail and Sales Equipment
Robotics
Safety and Security Equipment
Sensors, Monitors and Transducers
Services
Software
Test and Measuring Instruments
Textile Industry Products
Thermal and Heating Equipment
Timers and Clocks
Transportation Industry Products
Vision Systems
Waste Handling Equipment
Welding Equipment and Supplies
 Press Releases
Products in the News
Company News
Mergers & Acquisitions
People in the News
Literature & Websites
 Resources
News Delivery Options
SME
Browse Categories
Browse Companies
Mobile Edition
PR Resources
Licensing
Advertising
Call for Contributors, Guest Writers and Submissions
How to Write an effective Press Release
Trade Associations
Electronic Components & Devices -> Electronic Components -> Device Sockets


Device Sockets







(Showing headlines 1 - 20)   more ....

Swivel Lid QFN Socket operates at bandwidths up to 40 GHz.

Ironwood Electronics, Inc    St. Paul, MN 55121
Apr 16, 2014 Used to socket 13 x 19 mm, mixed pitch QFN package on application board, SM-QFN-9019 connects all pins with 40 GHz bandwidth on all connections and offers <1 dB insertion loss. Contact resistance is 15 mΩ typ per pin, and insertion method accelerates IC changeout. Mounted on target PCB without any soldering, design dissipates few watts with compression screw and can be customized up to 100 W. Pin self inductance is 0.10 nH, mutual inductance is 0.007 nH, and capacitance to ground is 0.069 pF.

Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.

Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.

Ironwood Electronics, Inc    St. Paul, MN 55121
Mar 18, 2014 Operating from -55 to +180°C, CBT-BGA-7501 is configured to test 2.4 x 2.4 mm BGA package with 0.4 mm pitch, 36-position, 6 x 6 ball array configuration. Spring pin contactor, stamped with 14.3 g actuation force per ball, has cycle life of 125,000 insertions, self inductance of 0.98 nH, and insertion loss < 1 dB at 31.7 GHz. Current capacity of each contactor is 1.8 A @ 30°C temperature rise. Using supplied hardware on target PCB, socket mounts without any soldering.

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

Ironwood Electronics, Inc    St. Paul, MN 55121
Feb 26, 2014 RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter. Both BGA socket and adapter are constructed with polyimide and FR-4 body.

Swivel Lid Spring Pin BGA Socket supports geometric processors.

Swivel Lid Spring Pin BGA Socket supports geometric processors.

Ironwood Electronics, Inc    St. Paul, MN 55121
Feb 17, 2014 Designed for testing 10 x 8 mm, 0.5 mm pitch, 223-position, 15 x 19 ball array packages, Model SBT-BGA-7019 features stamped spring pin contactor with 31 g actuation force per ball and cycle life of 125,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 30°C temperature rise. Mounted using supplied hardware on PCB with no soldering, socket features temperature range of -55 to +180°C.

Elastomer Socket accommodates 0.5 mm pitch QFN package.

Ironwood Electronics, Inc    St. Paul, MN 55121
Feb 06, 2014 Designed for 8 x 8 x 0.8 mm package size, Model SG-MLF-7079 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and pin self inductance is 0.15 nH. Mounted using supplied hardware on target PCB with no soldering, socket operates from -35 to +100°C, with current capacity of 2 A per pin and capacitance to ground of 0.01 pF.

Elastomer SOIC Socket offers 2 A/pin current capacity.

Ironwood Electronics, Inc    St. Paul, MN 55121
Jan 10, 2014 Operating at bandwidths up to 10 GHz with less than 1 dB insertion loss, SG-SOIC-3005 accommodates 0.5 mm pitch, 10-pin SOIC with 3 x 3 x 1 mm package with 5 mm lead tip to tip and exposed pad on bottom. Swivel lid with compression screw facilitates and accelerates IC changeout, while floating compression plate forces down QFP leads onto elastomer. Contact resistance is 20 mΩ per I/O (typ), pin self inductance is 0.15 nH, and mutual inductance is 0.025 nH. Capacitance to ground is 0.01 pF.

Spring Pin Socket tests DFN6 electronic filters.

Ironwood Electronics, Inc    St. Paul, MN 55121
Nov 21, 2013 Designed for testing 3.1 x 3.45 mm DFN6 devices, Model CBT-QFN-7033 utilizes stamped spring pin contactor with 34 g actuation force per ball and cycle life of 10,000 insertions. Contactor features self inductance of 0.9 nH, insertion loss of less than 1 dB at 9.1 GHz, capacitance of 0.03 pF, and 2.2 A current capacity. Operating from -55 to +155°C, socket has clamshell lid and accommodates two DFN devices. Swivel compression plate enables vertical force without distorting device position.

BGA Socket Adapter serves 8 Mb Flash memory applications.

Ironwood Electronics, Inc    St. Paul, MN 55121
Nov 06, 2013 Giga-snaP™ BGA socket adapter pair – SF-BGA48U-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin adapter – allows 0.8 mm pitch, 8 x 6 mm body, 8 x 6 array Flash memory to be socketed in CMOS applications. BGA adapter, to which target 48 ball flash memory chip or other compatible chip is attached, plugs into female BGA socket on board. Electrical path of adapters has physical length of 4.5 mm, promoting high frequency signal transmission.

Magnetic Mount LED Light features L6-20 twist lock plug.

Larson Electronics, LLC    Kemp, TX 75143
Oct 07, 2013 Equipped with CREE XLamp XPG® LEDs, Model LEDP5W-30-M-1227-20L6 produces 14,790 lumen output with beam spread of 20° or 40°. Unit has IP68-rated waterproof housing and aluminum frame with two 200 lb grip magnetic pads for mounting. Light can be adjusted vertically within frame by loosening lock nuts on each side of lamp. Running natively on 10–32 Vdc, fixture is paired with waterproof step down transformer featuring L6-20 twist lock plug for connection to heavy duty 120-277 Vac receptacles.

Double Row SMT Socket Strip has low profile design.

Mill-Max Mfg. Corp.    Oyster Bay, NY 11771
Sep 16, 2013 Used for socketing leaded IC devices on SMT boards as well as for low-profile board stacking applications, 406 Series socket strip features dual-row, .100 in. pitch connector. Profile is 0.146 in. from board surface, and board-to-board height is 0.300 in. when mated with Mill-Max 429 Series SMT header. Pin base is 0.029 in. dia, and secure mating is provided via 4-finger contacts inside each receptacle. Co-planarity of 0.005 in. is achieved for up to 20 positions.

Elastomer Socket accepts 50-pin Quad Flat No Lead package.

Ironwood Electronics, Inc    St. Paul, MN 55121
Aug 15, 2013 Accommodating 0.4 mm pitch, 50-pin QFN package, SG-MLF-7078 operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Contact resistance is 20 mΩ (typ) per pin, and footprint allows inductors, resistors, and decoupling capacitors to be placed close to device for impedance tuning. Designed for 5.5 x 7 x 0.8 mm package size, socket connects all pins with 10 GHz bandwidth on all connections and mounts using supplied hardware on target PCB without any soldering.

LGA Socket supports 2.54 mm pitch devices.

LGA Socket supports 2.54 mm pitch devices.

Ironwood Electronics, Inc    St. Paul, MN 55121
Jul 17, 2013 Designed to JEDEC STD. MO-220, Model CBT-LGA-5002 operates from -55 to 180°C and features IC guide for LGA edge alignment. Contactor consists of stamped spring pin with 19 g actuation force per pin and cycle life of 500,000 insertions. Unit has current capacity of 4 A, self inductance of 0.93 nH, insertion loss of less than 1 dB at 21.9 GHz, and capacitance of 0.097 pF. Mounted using supplied hardware on target PCB with no soldering, socket is suited for Burn-in and Test applications.

Lever Lid BGA Socket connects all pins with 40 GHz bandwidth.

Ironwood Electronics, Inc    St. Paul, MN 55121
Jun 05, 2013 Accommodating 35 x 35 mm, 1 mm pitch BGA packages, SM-BGA-9032 operates at bandwidths up to 40 GHz with less than 1 dB insertion loss. Mounting on target PCB is accomplished without soldering, and construction features lever-actuated clamshell lid that incorporates quick insertion method. Constructed with elastomer contactor, socket operates from -55 to +150°C and is designed for low wattage dissipation with compression screw. Pin self inductance is 0.10 nH, and mutual inductance is 0.007 nH.

BGA Socket mounts on any PCB without soldering or hardware.

Ironwood Electronics, Inc    St. Paul, MN 55121
May 31, 2013 Designed for 9 x 13 mm BGA 78-pin DDR3 package with 0.8 mm pitch, SG-BGA-6374 mounts without any holes in target PCB or soldering. Placement/epoxy system enables mounting on any existing PCB, and socket operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Connecting all pins with 8 GHz bandwidth on all connections, socket is constructed with elastomer contactor and dissipates up to several watts without extra heat sinking (up to 100 W with custom heat sink).

LGA Socket for Hand Test/Burn-In operates from -55 to +180°C.

Ironwood Electronics, Inc    St. Paul, MN 55121
May 16, 2013 Used to test LGA package with 25 x 21 mm body and 0.5 mm pitch, CBT-LGA-5000 features IC guide that promotes precise LGA edge alignment, clamshell lid, and compression screw for applying down force. Contactor is stamped spring pin with 31 g actuation force per pin and cycle life of 500,000 insertions. Properties include contactor self inductance of 0.88 nH, insertion loss of <1 dB at 15.7 GHz, and capacitance of 0.097 pF. Current capacity of each contactor is 4 A.

QFP Test and Burn-In Socket offers movable ground pin option.

QFP Test and Burn-In Socket offers movable ground pin option.

Yamaichi Electronics USA, Inc.    San Jose, CA 95134
May 10, 2013 Matching QFP type IC packages with exposed pads, double shoulder contact IC500 Open Top series with movable ground pin option and no lead foot touching can be equipped with crown shaped or flat head ground pins to accommodate application requirements. Ground pin design allows center pin to actuate in conjunction with movement of push cover; 2-step actuation ensures socket remains auto-load capable and reliable for all future test and burn-in applications.

BGA Socket accommodates 253-pin packages with 0.5 mm pitch.

Ironwood Electronics, Inc    St. Paul, MN 55121
Apr 10, 2013 Designed for 0.5 mm pitch BGA 253 pin DDR4 with 8 x 13.5 mm package size, CG-BGA-5019 operates at up to 10 GHz with less than 1 dB insertion loss. Footprint lets inductors, resistors, and decoupling capacitors be placed within close proximity to device for impedance tuning. Along with double latch lid with integrated compression mechanism, features include elastomer contactor construction, 20 mΩ typ contact resistance (per pin), 0.11 nH pin self inductance, and 0.028 nH mutual inductance.

BGA Socket withstands extreme temperatures.

Ironwood Electronics, Inc    St. Paul, MN 55121
Mar 21, 2013 With temperature range of -55 to +155°C, Model CBT-BGA-7011 is designed for testing 3 x 3 mm, 0.4 mm pitch, 36-position, 6 x 6 ball array. Stamped spring pin contactor, providing current capacity of 2.2 A at 30°C temperature rise, features self inductance of 0.9 nH, insertion loss of less than 1 dB at 9.1 GHz, and capacitance of 0.03 pF. Mounted on target PCB using supplied hardware with no soldering required, socket includes floating guide for precise ball to pin alignment.

SMT Interconnect Headers  feature .030 in. diameter pins.

SMT Interconnect Headers feature .030 in. diameter pins.

Mill-Max Mfg. Corp.    Oyster Bay, NY 11771
Mar 13, 2013 With gold-plated pins assembled in high-temperature thermoplastic, single row Series 349-10-1XX-00-560000 and double row Series 449-10-2XX-00-560000 plug into mating socket strips which come in through-hole, right-angle, and SMT configurations. Header and socket combinations are rated 4.5 A/pin for 10°C temperature rise above ambient. To promote optimal solder joints, headers have .008 in. floating pin design that compensates for peaks and valleys found in uneven solder paste application.

CCGA IC Socket does not incur significant performance loss.

Ironwood Electronics, Inc    St. Paul, MN 55121
Mar 13, 2013 Accommodating 1 mm pitch, 1,272-pin CCGA ICs, SG-CGA-7002 is designed for 37.5 x 37.5 mm package size and has compact footprint (2.5 mm more on each side). Socket operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB without any soldering, socket has swivel lid that incorporates insertion method which accelerates IC changeout.




(Showing headlines 1 - 20)   more ....



 Latest Products in the News


HBC-radiomatic  - April 18, 2014
quadrix Ex: High-Quality Handheld Radio Control Now Certified According to NEC 500 / 505

Gems Sensors Inc.  - April 17, 2014
Simplifying the Search for the Perfect Fluid Sensor

Matrix Packaging Machinery  - April 17, 2014
Matrix Brings Its Robust Cheese Bagging Machine and Pre-Made Pouch Filler/Sealer to the International Cheese Technology Expo, April 23-24 in Milwaukee

Murata Machinery USA/Machine Tool Div.  - April 16, 2014
Murata Machinery USA's Fiber Laser Takes Laser Processing to the Cutting Edge of Technology

Schaffner EMC, Inc.  - April 16, 2014
"iF Product Design Award" 2014 for Schaffner IEC Inlet Filters

American Empire Manufacturing  - April 16, 2014
American Empire Manufacturing Enhances Contract Filling Capabilities, Adds ISO 8/Class 100K Clean Room

Cal Quality Electronics, Inc.  - April 16, 2014
Cal Quality Electronics Contracts with Boeing to Support the Combat Survivor Evader Locater (CSEL) Program

Saint-Gobain Performance Plastics, Omniseal  - April 16, 2014
Saint-Gobain Seals' Rulon® 1439 Material Certified as USP Class VI Compliant, Further Meeting Needs of Medical Device and Pharmaceutical Processing

Nora Lighting  - April 16, 2014
REVO, First Motorized Track Head, Available from Nora Lighting

MJS Packaging  - April 16, 2014
MJS Packaging Customizes Jar for Household Products


More Products in the News...

Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2014 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy