Ironwood Electronics, Inc.
St. Paul, MN 55121
Oct 20, 2009 Consisting of solder balls on bottom side and round pads on topside, Model SF-BGA199B-B-05 accommodates 0.65 mm pitch, 12 x 16 mm body, 18 x 22 array Samsung MCP KMYFE0C0CM-D300 memory ICs. If target circuit board already exists or mounting holes cannot be drilled into target board, then BGA SMT adapter can be used with Ironwood GHz socket. Constructed with high temperature FR-4, adapter assures match with target PCB's CTE and prevents failures that may occur with CTE mismatch.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Oct 16, 2009 Designed to adapt smaller pitch devices to larger footprints, Switch-A-Pitch Adapters eliminate need for laser-drilled microvias on motherboards while enabling use of standard line and trace spacing down to 0.003 in. Adapters have tops with BGA landing pads on 0.50 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch. Operating up to 221°F for FR4 or up to 266°F for lead-free, adapters feature non-solder mask defined pads finished with electroless nickel immersion gold.

Molex Inc.
Lisle, IL 60532-1682
Sep 02, 2009 Picoflex® SMT Header incorporates positive retention latches to provide reliable wire-to-board connection with retention force necessary for rugged applications and high-vibration environments. Along with standard interface design, features include high-profile polarizing peg that eliminates possibility of header/receptacle mismating and polyphthalamide (PPA) housing material that enables header to tolerate reflow temperatures to +260°C.

Samtec, Inc.
New Albany, IN 47151 1147
Aug 24, 2009 Right Angle SEARAY(TM) Open Pin Field Sockets (SEAF-RA Series) have .050 x .050 in. grid array for maximum grounding and routing flexibility and are optimized to reduce skew and impedance mismatch. They feature Edge Rate(TM) contacts, which are designed for optimal signal integrity, reduced broadside coupling and crosstalk, and high cycles. Sockets are available in 4-row (up to 200 contacts) and 6-row (up to 300 contacts) configurations.

Hartmann Electronic
Springfield, OH 45505
Jul 24, 2009 CompactPCI Test Adapters feature plug-in connections on 3 sides, optimizing access, and enable measurement and testing of CompactPCI assemblies in 3U and 6U Eurocard format. Modern BRIDGE design permits up to 3 CompactPCI cards and 1 standard PCI card to be inserted into 1 CompactPCI slot via test adapter. Unit can be used with CompactPCI boards up to 220 mm depth. It also offers Windows support and detects PCI devices via standard PCI BIOS with BIOS extension.

Fujitsu Components America, Inc.
Sunnyvale, CA 94089
Jul 15, 2009 RoHS-compliant, vertical surface-mount DDR2 DIMM socket connector, FCN-078J series uses precision stamping and molding technology to achieve 0.1 mm coplanarity before and after reflow. Available with footprint of 22.7 x 140 mm, 240-position unit has operating temperature range between -55 to +85°C, voltage rating of AC 25 V and maximum current rating of 0.5 A/contact. Suitable applications include blade servers, switches, routers, telecom racks, and test and measurement equipment.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Jun 23, 2009 Designed for Burn-in and Test applications, SBT-BGA-7003 is stamped spring pin with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor has self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and temperature range of -55 to +180°C. Socket also features floating guide for precise ball to pin alignment, while current capacity of each contactor is 4 A at 80°C temperature rise.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Jun 08, 2009 Giga-snaP(TM) BGA SMT adapter pair consists of SF-BGA316C-B-62F female sockets with machined pins epoxy over-molded into assembly that matches male pin LS-BGA316C-61. Soldered to PCB using standard soldering methods without warping, SF-BGA316C-B-62F allows 0.8 mm pitch, 17 x 17 mm body, 20 x 20 array Analog Device ADSP-BF539/ADSP-BF539F ICs to be socketed and operate in demanding automotive applications. Both adapters are constructed with high temperature FR-4 bodies.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 18, 2009 Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on 0.30-0.35 mm pitch, 16 g/contact on 0.40-0.45 mm pitch, and 25 g/contact on pitches of 0.50 mm or larger.

Ironwood Electronics, Inc.
St. Paul, MN 55121
May 15, 2009 Suited for 15 x 15 mm package size, SG-BGA-6286 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Product can can handle up to 100 W with custom heat sink, and contact resistance is 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features operating temperature range between -40°C to +100°C, pin self inductance of 0.15 µH, and current capacity of 2 A/pin.

Mill-Max Mfg. Corp.
Oyster Bay, NY 11771
Apr 15, 2009 Assembled with precision screw machine receptacles and packaged in high temperature thermoplastic insulators, series 110...10-00X (2-5) relay sockets can be exposed to reflow temperatures. They are available in 4, 6, 8, 14, and 16 pin configurations and use MM#1001 receptacles assembled with hi-rel, 4 finger #30 contact rated at 3 A. Available in RoHS and non-RoHS plating configurations, sockets are provided bulk in tubes and can be modified to meet application-specific requirements.

California Micro Devices
Milpitas, CA 95035
Mar 30, 2009 Intended for use in ultra high brightness (UHB) LED lighting applications, LuxGuard products include silicon submounts that provide integrated ESD protection at levels exceeding 15 kV HBM (Human Body Model) while also helping cushion LED from stress due to thermal expansion coefficient differences between LED and lead frame. TVS diodes, available for customers who utilize ceramic submounts, mount next to LED die within LED fixture and deliver ESD ratings between 8 and 15 kV HBM.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 27, 2009 Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40 to +100°C. It is manufactured with high-performance/low-inductance elastomer contactor.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 04, 2009 Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100°C, pin self inductance of 0.11 nH and mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and 5 A/pin current capacity.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Feb 24, 2009 Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100°C, pin self-inductance of 0.11 nH, mutual inductance of 0.028 nH, 0.028 pF of capacitance to ground, and current capacity of 5 A/pin.

Molex Inc.
Lisle, IL 60532-1682
Feb 23, 2009 Providing single and multi-pocket PCB solutions, Stac64(TM) Connection System is based on 0.64 mm terminal and includes 8-, 12-, 16-, and 20-circuit connections in vertical and right-angle headers. Ten-circuit version, supporting power applications for 1.50 and 2.80 mm terminal systems, is also available in vertical and right-angle configurations. Stackable system is based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications.

Sullins Electronics Corp.
San Marcos, CA 92079-0189
Feb 16, 2009 Engineered for board-to-board or board-to-cable connections, dual-row SBH Series Fully Shrouded Box Headers come in 1.27 x 1.27, 1.27 x 2.54, 2, and 2.54 mm versions, with straight or right angle dip solder terminations. Units have current ratings of 1-3 A max per contact and are available in 3-50 positions. Provided in corresponding contact positions with box headers, SFH Series Female Mates may be ordered with polarizing keys to ensure proper mating alignment.

Mill-Max Mfg. Corp.
Oyster Bay, NY 11771
Feb 03, 2009 Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize high-temperature thermoplastic suitable for wave-soldering and reflow soldering.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 15, 2009 CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact on 0.80 mm pitch or larger. Operating temperature is from -67 to +302°F.

3M Co., Electronic Products Div.
Austin, TX 78726
Jan 07, 2009 Series 95X Board-to-Board Stacking Connectors and Box Headers offer 10 µin. gold solutions for high-volume applications with less-stringent requirements for number of mating cycles, no exposure to temperature extremes or hostile atmosphere, and relatively short service life. Qualified in accordance with European requirements for IEC Performance Class 3 items, 2 mm products meet requirements of EU and China RoHS legislations and are compatible with lead-free processing up to 260°C.