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Designed to offer curing flexibility, and consistency, BlueWaveÂ® MX-150™ can be used as a bench-top unit or integrated into automated systems such as robotic arms. Available in 365, 385, or 405 nm wavelengths, the intensity of the LED emitter is not affected by long or bent lightguides, as compared to traditional spot-curing systems. Featuring activation options such as a foot pedal, a LCD... Read More
Consisting of dual-conductor coaxial cable, Solimar™ Powered Suspension System is capable of powering any Class 2 LED pendant lighting fixture and strong enough to suspend heavy fixtures with safe working load of 40 lb. Complete system includes Griplock's grippers, providing adjustable installation. Read More
Used with Summit™ Protocol Analyzers, PCIe External Cable 3.0 Interposer enables PCIeÂ® bus traffic between system board and storage devices using PCIe External Cable 3.0 cables to be monitored, captured, and recorded. Interposer will support analysis for PCIe host interfaces such as SATA Express and NVM Express at data rates from 2.5–8 GT/s and link widths from x1 to x8. Adapter is also... Read More
Measuring 6.50 x 21.3 x 141 mm with 2.4 mm max module seating plane, Model FCN-074B288-G/0P conserves PCB space while optimizing airflow. Unit's 2.35 mm contacts accommodate 1.8 mm thick substrates. Dual-contact structure provides contact reliability with inserted memory module using 2 contacts points per pad. Design resists dust, flux, and vibration to eliminate intermittent signal loss.... Read More
SEARAY™ Open Pin Field Arrays of SEAFP-RA Series includeÂ right angle socket with press fit terminations. Suited forÂ micro backplane applications, high-density solution is available in 8- and 10- row designs with up to 500 total I/Os on a .050 in. pitch grid and features Edge RateÂ® contact system. Design maximizes grounding and routing flexibility while also promoting cycle life... Read More
Accommodating 13 x 13 mm, 177-pin BGA device with 0.8 mm pitch, SG-BGA-6434 operates at bandwidths up to 27 GHz with <1 dB insertion loss. Aluminum structureÂ dissipates up to several watts, and placement/epoxy system enables mounting without any holes in target PCB, soldering,Â or mounting hardware/screws. Constructed with elastomer contactor, socket featuresÂ 20 mΩ typ per pin contact... Read More
Constructed with elastomer contactor, GT-BGA-2029 sockets 1 mm pitch, 34 x 34 array, 35 x 35 mm 1156BGA package and operates at bandwidths up to 75 GHz with <1 dB insertion loss. Nominal design dissipates few watts using compression screw, and customization for up to 100 W is possible. Mounted on target PCB without any soldering, socket offers contact resistance of 30 mΩ/pin typ. Also, clamshell... Read More
Accommodating 42.5 x 42.5 mm ICs with 1 mm pitch, Model SG-BGA-6433 operates up to 27 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 60 W using heatsink compression screw with axial flow fan. Mounted on PCB with no soldering, socket is constructed with shoulder screw and swivel lid which incorporates quick insertion method. Device features contact resistance of 20 mΩ... Read More
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Permitting connection of select Tektronix TekProbe interface level II probes to any ProBus-equipped Teledyne LeCroy oscilloscope, TPA10 TekProbeÂ® Probe Adapter automatically detects which probe is attached, supplies all necessary power and offset control to probe, and communicates probe signal to oscilloscope. CA10 Current Sensor Adapter is programmable and customizable to work with... Read More
With LS-BGA1924A-05 Adapter, users can convert compression mount BGA socket which needs mounting holes into conventional through-hole soldering options. Unit consists of machined Phosphorous Bronze pins pressed into FR4 wafer. Top side of adapter has gold plated pads to receive socket interconnect and bottom side has 0.008 in. diameter pin tails. Adapter can be soldered to any through-hole... Read More
Designed for 2.64 x 3.94 mm package size with 6 x 9 array and 0.4 mm pitch, Model GT-BGA-2024 operates up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate few watts using compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Contact resistance is typically 30 mΩ per pin. Operating from -55 to... Read More
Addressing requirements for testing power transistor, CBT-QFN-7043 accommodatesÂ 6.512 x 4.961 mm QFN package withÂ 1 mm pitch, 9 positions, and ground pad. Stamped spring pin contactor, featuringÂ 19 g actuation force per ball and cycle life of 125,000 insertions, offers 0.93 nH self inductance, insertion loss of <1 dB at 23 GHz, and current capacity of 4 A @ 80Â°C temperature rise.... Read More
Giga-snaP™ BGA Socket Adapter pairs SFS-BGA500C-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin adapter. SFS-BGA500C-52 allows 0.65 mm pitch, 14 x 17 mm body, 20 x 25 array 500 ball BGA package to be placed in socket and operated without compromising performance in high-speed applications. Both socket and adapter are constructed with high-temperature... Read More
Designed for 1 mm pitch, 52.5 x 52.5 mm, 2577-pin BGA ICs, Model SG-BGA-6422 operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. Unit dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Constructed with shoulder screw and swivel lid,... Read More
Designed for 25 x 25 mm package size, Model GT-BGA-2019 operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 7 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with low inductance elastomer contactor, socket features typical contact... Read More
Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of <1 dB @ 31.7 GHz, and current capacity of 1.5 A @ 20Â°C temperature rise.... Read More
Operating from -55 to +155Â°C, CBT-QFN-7038 has clamshell lid and features stamped spring pin contactor with 15 g actuation force per ball and cycle life of 10,000+ insertions. Self inductance of contactor is 0.98 nH, insertion loss is <1 dB at 10 GHz, capacitance is 0.03 pF, and current capacity of each contactor is 2.2 A. Configuration of package to be tested isÂ 4.5 x 12.5Â mm QFN... Read More
Designed for 6 x 4.5 mm QFN package with 0.4 mm pitch, Model SG-MLF-7084 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Socket is mounted using supplied hardware on target PCB with no soldering. Operating from -35 to +100Â°C, socket features pin self inductance of 0.118 nH and mutual... Read More
Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 hasÂ stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is <1 dB at 15.7 GHz, and capacitance is 0.097 pF. Socket temperature range is -55 to +180Â°C. Along with integrated compression plate for vertical... Read More
Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA.Â Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current... Read More