Device Sockets

Electronic Components & Devices

Clamshell BGA Socket features heat sink lid.

February 27, 2015

Designed for 25 x 25 mm package size, Model GT-BGA-2019 operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 7 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with low inductance elastomer contactor, socket features typical contact resistance of 30 mΩ per pin and is mounted on target PCB with no soldering. Read More

Electronic Components & Devices

Clamshell Spring Pin QFN Socket accommodates 10TDFN package.

February 11, 2015

Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of <1 dB @ 31.7 GHz, and current capacity of 1.5 A @ 20°C temperature rise. Socket features include lockable double latch socket lid and guide for precise device-to-pin alignment. Read More

Electronic Components & Devices, Test & Measuring Instruments

Burn-in Test Socket accommodates QFN74 with exposed pad.

February 2, 2015

Operating from -55 to +155°C, CBT-QFN-7038 has clamshell lid and features stamped spring pin contactor with 15 g actuation force per ball and cycle life of 10,000+ insertions. Self inductance of contactor is 0.98 nH, insertion loss is <1 dB at 10 GHz, capacitance is 0.03 pF, and current capacity of each contactor is 2.2 A. Configuration of package to be tested is 4.5 x 12.5 mm QFN with 0.4 mm pitch, 74 peripheral positions, and additional 6x3 array of pins for center ground pad. Read More

Electronic Components & Devices

Elastomer Socket accommodates QFN34 package.

January 20, 2015

Designed for 6 x 4.5 mm QFN package with 0.4 mm pitch, Model SG-MLF-7084 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Socket is mounted using supplied hardware on target PCB with no soldering. Operating from -35 to +100°C, socket features pin self inductance of 0.118 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.229 pF. Read More

Electronic Components & Devices

Stamped Spring Pin Test Socket accommodates BGA243 packages.

December 30, 2014

Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 has stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is <1 dB at 15.7 GHz, and capacitance is 0.097 pF. Socket temperature range is -55 to +180°C. Along with integrated compression plate for vertical force without distorting device position, features include clamshell lid that facilitates operation.
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Electronic Components & Devices

BGA Socket accommodates hybrid memory cube.

December 15, 2014

Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C. Read More

Communication Systems & Equipment, Electronic Components & Devices, Mounting & Attaching Products

BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.

December 4, 2014

Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target PCBs and preventing failures that occur with CTE mismatch. Read More

Electronic Components & Devices

DDR4 DIMM Socket reduces intermittent signal issues.

November 24, 2014

Providing reliable contact, JEDEC-compliant FCN-07 series improves intermatability between DDR4 memory card and PCB socket. Split-beam contact structure provides two points of contact on inserted memory card to ensure there are no intermittent signals due to dust particles, flux, or vibration during system start-up or life of project. With 2.4 mm (max) module seating plane, these 141 x 6.50 x 21.3 mm card-edge memory module sockets come in SMT and through-hole termination types. Read More

Electrical Equipment & Systems, Electronic Components & Devices

LED Design Components suit space-critical applications.

October 27, 2014

Single-pole PTSM terminal block features push-in termination technology. Its 2.5 centerline and slim profile suit LED installations and allow single-wire connection in compact footprint. Designed for surface mounting, PTSM vertical header moves wires off PCB for vertical space utilization and increases options when connecting LEDs. PTSM through-board header removes connector mass from top of PCB and relocates it underneath, allowing for pluggable connections to come from rear of device. Read More

Electronic Components & Devices

BGA Heat Sink Lid Socket operates at bandwidths up to 75 GHz.

October 22, 2014

Constructed with elastomer contactor, GT-BGA-6008 sockets 27 x 27 mm, 0.8 mm pitch BGA package and operates up to 75 GHz with <1 dB insertion loss. Design dissipates 4.5 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and addition of axial flow fan. Socket mounts on target PCB without any soldering, swivel lid incorporates quick insertion method to accelerate IC changeout, and contact resistance is 20 mΩ/pin typ. Read More

Electronic Components & Devices

QFN IC Socket connects all pins with 40 GHz bandwidth.

October 10, 2014

Operating at bandwidths up to 40 GHz with <1 dB insertion loss, SMP-QFN-8008 is constructed with elastomer contactor and designed to socket 10 x 10 mm, 0.5 mm pitch QFN packages on any application board. Socket mounts on target PCB without any soldering and uses mechanical hardware for mounting, while double latch lid incorporates insertion method that accelerates IC changeout. Features include 15 mΩ typ contact resistance per pin, 0.10 nH pin self inductance, and 0.007 nH mutual inductance. Read More

Electronic Components & Devices

DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.

September 16, 2014

Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs with BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw and swivel lid. Latter incorporates quick insertion method to accelerate IC changeout. Read More

Electronic Components & Devices

BGA Socket supports 1 mm pitch, 1924 pin BGA ICs.

July 8, 2014

Accommodating 45 x 45 mm and 47.5 x 47.5 mm package sizes, Model SG-BGA-6409 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with shoulder screw and swivel lid, socket is mounted on target PCB with no soldering. Device offers contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C. Read More

Electronic Components & Devices

Swivel Lid QFN Socket operates at bandwidths up to 40 GHz.

April 16, 2014

Used to socket 13 x 19 mm, mixed pitch QFN package on application board, SM-QFN-9019 connects all pins with 40 GHz bandwidth on all connections and offers <1 dB insertion loss. Contact resistance is 15 mΩ typ per pin, and insertion method accelerates IC changeout. Mounted on target PCB without any soldering, design dissipates few watts with compression screw and can be customized up to 100 W. Pin self inductance is 0.10 nH, mutual inductance is 0.007 nH, and capacitance to ground is 0.069 pF. Read More

Electronic Components & Devices

Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.

March 18, 2014

Operating from -55 to +180°C, CBT-BGA-7501 is configured to test 2.4 x 2.4 mm BGA package with 0.4 mm pitch, 36-position, 6 x 6 ball array configuration. Spring pin contactor, stamped with 14.3 g actuation force per ball, has cycle life of 125,000 insertions, self inductance of 0.98 nH, and insertion loss < 1 dB at 31.7 GHz. Current capacity of each contactor is 1.8 A @ 30°C temperature rise. Using supplied hardware on target PCB, socket mounts without any soldering. Read More

Electronic Components & Devices

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

February 26, 2014

RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter. Both BGA socket and adapter are constructed with polyimide and FR-4 body. Read More

Test & Measuring Instruments, Electronic Components & Devices

Swivel Lid Spring Pin BGA Socket supports geometric processors.

February 17, 2014

Designed for testing 10 x 8 mm, 0.5 mm pitch, 223-position, 15 x 19 ball array packages, Model SBT-BGA-7019 features stamped spring pin contactor with 31 g actuation force per ball and cycle life of 125,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 30°C temperature rise. Mounted using supplied hardware on PCB with no soldering, socket features temperature range of -55 to +180°C. Read More

Electronic Components & Devices

Elastomer Socket accommodates 0.5 mm pitch QFN package.

February 6, 2014

Designed for 8 x 8 x 0.8 mm package size, Model SG-MLF-7079 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and pin self inductance is 0.15 nH. Mounted using supplied hardware on target PCB with no soldering, socket operates from -35 to +100°C, with current capacity of 2 A per pin and capacitance to ground of 0.01 pF. Read More

Electronic Components & Devices

Elastomer SOIC Socket offers 2 A/pin current capacity.

January 10, 2014

Operating at bandwidths up to 10 GHz with less than 1 dB insertion loss, SG-SOIC-3005 accommodates 0.5 mm pitch, 10-pin SOIC with 3 x 3 x 1 mm package with 5 mm lead tip to tip and exposed pad on bottom. Swivel lid with compression screw facilitates and accelerates IC changeout, while floating compression plate forces down QFP leads onto elastomer. Contact resistance is 20 mΩ per I/O (typ), pin self inductance is 0.15 nH, and mutual inductance is 0.025 nH. Capacitance to ground is 0.01 pF. Read More

Test & Measuring Instruments, Electronic Components & Devices

Spring Pin Socket tests DFN6 electronic filters.

November 21, 2013

Designed for testing 3.1 x 3.45 mm DFN6 devices, Model CBT-QFN-7033 utilizes stamped spring pin contactor with 34 g actuation force per ball and cycle life of 10,000 insertions. Contactor features self inductance of 0.9 nH, insertion loss of less than 1 dB at 9.1 GHz, capacitance of 0.03 pF, and 2.2 A current capacity. Operating from -55 to +155°C, socket has clamshell lid and accommodates two DFN devices. Swivel compression plate enables vertical force without distorting device position. Read More