Device Sockets

Architectural and Civil Engineering Products, Computer Hardware & Peripherals, Electronic Components & Devices

Lighting Suspension System eliminates power cord.

February 24, 2016

Consisting of dual-conductor coaxial cable, Solimar™ Powered Suspension System is capable of powering any Class 2 LED pendant lighting fixture and strong enough to suspend heavy fixtures with safe working load of 40 lb. Complete system includes Griplock's grippers, providing adjustable installation. Read More

Electronic Components & Devices, Software, Test & Measuring Instruments

Interposer and Analyzer test PCIe External Cable 3.0 ports.

January 21, 2016

Used with Summit™ Protocol Analyzers, PCIe External Cable 3.0 Interposer enables PCIe® bus traffic between system board and storage devices using PCIe External Cable 3.0 cables to be monitored, captured, and recorded. Interposer will support analysis for PCIe host interfaces such as SATA Express and NVM Express at data rates from 2.5–8 GT/s and link widths from x1 to x8. Adapter is also available for testing devices that use SFF-8644 connector with PCIe External Cable 3.0 class cables. Read More

Electrical Equipment & Systems, Electronic Components & Devices, Mounting & Attaching Products

DDR4 DIMM Connector offers press-fit mounting.

November 27, 2015

Measuring 6.50 x 21.3 x 141 mm with 2.4 mm max module seating plane, Model FCN-074B288-G/0P conserves PCB space while optimizing airflow. Unit's 2.35 mm contacts accommodate 1.8 mm thick substrates. Dual-contact structure provides contact reliability with inserted memory module using 2 contacts points per pad. Design resists dust, flux, and vibration to eliminate intermittent signal loss. Operating from -55 to +85°C, connector has current rating of 0.75 A and voltage rating of 29 Vac/Vdc. Read More

Electronic Components & Devices, Mounting & Attaching Products

Press Fit Right Angle Socket Array affords design flexibility.

September 14, 2015

SEARAY™ Open Pin Field Arrays of SEAFP-RA Series include right angle socket with press fit terminations. Suited for micro backplane applications, high-density solution is available in 8- and 10- row designs with up to 500 total I/Os on a .050 in. pitch grid and features Edge Rate® contact system. Design maximizes grounding and routing flexibility while also promoting cycle life and minimizing insertion/extraction forces. Optional guide post holes aid proper alignment. Read More

Electronic Components & Devices

Epoxy Mount BGA Socket does not require soldering to PCB.

September 1, 2015

Accommodating 13 x 13 mm, 177-pin BGA device with 0.8 mm pitch, SG-BGA-6434 operates at bandwidths up to 27 GHz with <1 dB insertion loss. Aluminum structure dissipates up to several watts, and placement/epoxy system enables mounting without any holes in target PCB, soldering, or mounting hardware/screws. Constructed with elastomer contactor, socket features 20 m&Omega; typ per pin contact resistance, 2 A/pin current capacity, and 0.11 nH pin self inductance and 0.028 nH mutual inductance. Read More

Electronic Components & Devices

BGA Clamshell Socket operates at bandwidths up to 75GHz.

August 6, 2015

Constructed with elastomer contactor, GT-BGA-2029 sockets 1 mm pitch, 34 x 34 array, 35 x 35 mm 1156BGA package and operates at bandwidths up to 75 GHz with <1 dB insertion loss. Nominal design dissipates few watts using compression screw, and customization for up to 100 W is possible. Mounted on target PCB without any soldering, socket offers contact resistance of 30 m&Omega;/pin typ. Also, clamshell lid incorporates quick insertion method for IC changeout. Read More

Electronic Components & Devices

BGA Socket operates at bandwidths up to 27 GHz.

July 21, 2015

Accommodating 42.5 x 42.5 mm ICs with 1 mm pitch, Model SG-BGA-6433 operates up to 27 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 60 W using heatsink compression screw with axial flow fan. Mounted on PCB with no soldering, socket is constructed with shoulder screw and swivel lid which incorporates quick insertion method. Device features contact resistance of 20 m&Omega; per pin, capacitance to ground of  0.01 pF, and current capacity of 2 A per pin. Read More

Electronic Components & Devices, Test & Measuring Instruments

Probe Adapters enable 3rd-party probe and current sensor use.

July 14, 2015

Permitting connection of select Tektronix TekProbe interface level II probes to any ProBus-equipped Teledyne LeCroy oscilloscope, TPA10 TekProbe® Probe Adapter automatically detects which probe is attached, supplies all necessary power and offset control to probe, and communicates probe signal to oscilloscope. CA10 Current Sensor Adapter is programmable and customizable to work with third-party current measurement devices that output voltage or current signals proportional to measured current. Read More

Electronic Components & Devices, Mounting & Attaching Products

BGA Socket Adapter allows reliable socketing of ICs.

June 9, 2015

With LS-BGA1924A-05 Adapter, users can convert compression mount BGA socket which needs mounting holes into conventional through-hole soldering options. Unit consists of machined Phosphorous Bronze pins pressed into FR4 wafer. Top side of adapter has gold plated pads to receive socket interconnect and bottom side has 0.008 in. diameter pin tails. Adapter can be soldered to any through-hole pattern using conventional soldering methods or plugged into mating female receptacle. Read More

Electronic Components & Devices

BGA Socket operates at bandwidths up to 75 GHz.

May 12, 2015

Designed for 2.64 x 3.94 mm package size with 6 x 9 array and 0.4 mm pitch, Model GT-BGA-2024 operates up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate few watts using compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Contact resistance is typically 30 m&Omega; per pin. Operating from -55 to +160°C, socket is constructed with clamshell lid and is mounted on PCB with no soldering. Read More

Electronic Components & Devices

Clamshell Spring Pin QFN Socket aids power transistors testing.

April 27, 2015

Addressing requirements for testing power transistor, CBT-QFN-7043 accommodates 6.512 x 4.961 mm QFN package with 1 mm pitch, 9 positions, and ground pad. Stamped spring pin contactor, featuring 19 g actuation force per ball and cycle life of 125,000 insertions, offers 0.93 nH self inductance, insertion loss of <1 dB at 23 GHz, and current capacity of 4 A @ 80°C temperature rise. Socket mounts using supplied hardware on target PCB without any soldering.<br /> Read More

Electronic Components & Devices, Mounting & Attaching Products

BGA Socket Adapter supports 500-pin 0.65 mm pitch package.

April 13, 2015

Giga-snaP&trade; BGA Socket Adapter pairs SFS-BGA500C-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin adapter. SFS-BGA500C-52 allows 0.65 mm pitch, 14 x 17 mm body, 20 x 25 array 500 ball BGA package to be placed in socket and operated without compromising performance in high-speed applications. Both socket and adapter are constructed with high-temperature polyimide and FR-4 body, assuring match with target PCBs and preventing failures due to CTE mismatch. Read More

Electronic Components & Devices

BGA Socket supports 27 GHz bandwidth.

March 18, 2015

Designed for 1 mm pitch, 52.5 x 52.5 mm, 2577-pin BGA ICs, Model SG-BGA-6422 operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. Unit dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Contact resistance is typically 20 m&Omega; per pin and current capacity is 2 A per pin. Constructed with shoulder screw and swivel lid, socket is mounted on PCB with no soldering and features temperature range of -35 to +100°C. Read More

Electronic Components & Devices

Clamshell BGA Socket features heat sink lid.

February 27, 2015

Designed for 25 x 25 mm package size, Model GT-BGA-2019 operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 7 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with low inductance elastomer contactor, socket features typical contact resistance of 30 m&Omega; per pin and is mounted on target PCB with no soldering. Read More

Electronic Components & Devices

Clamshell Spring Pin QFN Socket accommodates 10TDFN package.

February 11, 2015

Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of <1 dB @ 31.7 GHz, and current capacity of 1.5 A @ 20°C temperature rise. Socket features include lockable double latch socket lid and guide for precise device-to-pin alignment. Read More

Electronic Components & Devices, Test & Measuring Instruments

Burn-in Test Socket accommodates QFN74 with exposed pad.

February 2, 2015

Operating from -55 to +155°C, CBT-QFN-7038 has clamshell lid and features stamped spring pin contactor with 15 g actuation force per ball and cycle life of 10,000+ insertions. Self inductance of contactor is 0.98 nH, insertion loss is <1 dB at 10 GHz, capacitance is 0.03 pF, and current capacity of each contactor is 2.2 A. Configuration of package to be tested is 4.5 x 12.5 mm QFN with 0.4 mm pitch, 74 peripheral positions, and additional 6x3 array of pins for center ground pad. Read More

Electronic Components & Devices

Elastomer Socket accommodates QFN34 package.

January 20, 2015

Designed for 6 x 4.5 mm QFN package with 0.4 mm pitch, Model SG-MLF-7084 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 m&Omega; per pin and current capacity is 2 A per pin. Socket is mounted using supplied hardware on target PCB with no soldering. Operating from -35 to +100°C, socket features pin self inductance of 0.118 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.229 pF. Read More

Electronic Components & Devices

Stamped Spring Pin Test Socket accommodates BGA243 packages.

December 30, 2014

Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 has stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is <1 dB at 15.7 GHz, and capacitance is 0.097 pF. Socket temperature range is -55 to +180°C. Along with integrated compression plate for vertical force without distorting device position, features include clamshell lid that facilitates operation.<br /> Read More

Electronic Components & Devices

BGA Socket accommodates hybrid memory cube.

December 15, 2014

Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 m&Omega; per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C. Read More

Communication Systems & Equipment, Electronic Components & Devices, Mounting & Attaching Products

BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.

December 4, 2014

Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target PCBs and preventing failures that occur with CTE mismatch. Read More