Ironwood Electronics, Inc.    St. Paul, MN 55121
May 22, 2012 Designed to JEDEC STD, Model SBT-QFN-4015 features contact design with outside spring and flat stamped plungers for burn-in and test applications. Contactor provides current capacity of 4 A, self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and 0.097 pF capacitance. Operating from -55 to +180°C, socket includes IC guide for precise QFD edge alignment, and swivel lid with shoulder screw to facilitate IC change out.

RF Industries    San Diego, CA 92126 4202
Apr 24, 2012 P2RFA-4031-01 kit features three 3.5 mm adapters with 50 ohm impedance and made of non-magnetic 303 stainless steel with beryllium copper contacts supported with bead configuration. They are designed to operate up to 34 GHz with a VSWR rating of 1.05+.006 f (f-GHz) max and have same electrical length. Coaxial connectors and adapters inter-mate with SMA and 2.9 mm connectors and are used primarily on test equipment. Kit includes male-to-male, female-to-female, and male-to-female adapters.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Mar 26, 2012 Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG BGA chip or other compatible chip using 20 lbf.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Feb 16, 2012 Designed for 7 x 7 mm package size, Model DG-QFN56B-01 operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. Socket is constructed with shoulder screw, swivel lid, and diamond particle interconnect contactor capable of 100,000 insertions. Mounted on target PCB with no soldering, device operates from -70 to +200°C and dissipates 12 W with lid mounted heat sink and fan. Contact resistance is typically 3 mW per pin.

TE Connectivity Ltd.    Berwyn, PA 19312
Jan 31, 2012 Providing mechanical and electrical connection of LED onto heat sink, Type NL2 Socket features poke-in wire termination method for 18-22 AWG solid, 18-20 AWG pre-bonded, and 18 AWG stranded wires. One-piece connector assembly has UV-resistant housing, molded polarity indicator, and cleared area designated for reflector mounting that accepts custom or commercially available optics. Applications include retail lighting, commercial down lights, and high bay lighting.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Jan 20, 2012 Used to socket 16 x 16 x 0.8 mm BGA packages on any application board, SM-BGA-9006 operates at bandwidths up to 40 GHz with less than 1 dB insertion loss. It dissipates few watts with compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with elastomer contactor, socket features shoulder screw and swivel lid that incorporates quick insertion method to accelerate IC changeout.

Aries Electronics, Inc.    Bristol, PA 19007-6810
Dec 26, 2011 Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with pitch of 0.4 mm or greater as well as mixed pitch environments.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Nov 15, 2011 Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while floating compression mechanism accommodates package manufacturing variations.

Klus LLC    Vero Beach, FL 32960
Nov 03, 2011 By acting as connector between light source and application area, LED extrusion maximizes uses available for LED light strips (LED profiles or LED aluminum channels). Waterproof extrusions, available diverse shapes and sizes, eliminate obstacles related to LED light strip mounting by standardizing mounting techniques of LED ribbon light. They can be custom designed to suit specific commercial and residential applications.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Oct 14, 2011 Designed for 42.5 x 42.5 mm package size, Model SG-BGA-6348 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Socket dissipates 35 W with active heat sinking and features contact resistance of 20 mW per pin, 0.01 pF capacitance to ground, and current capacity of 2 A per pin. Mounted on target PCB with no soldering, socket is constructed with screw mounting and has temperature range of -35 to +100°C.

TE Connectivity Ltd.    Berwyn, PA 19312
Oct 03, 2011 Validated to Intel® design guides, SMT LGA 2011 socket is designed for Intel® Core(TM) i7 and Xeon 5 CPUs. Contacts include solder balls for surface mounting onto PCB, and hex-ball array promotes housing strength while minimizing occupied space. Integrated lever mechanism generates Z-axis compression load, and bolster plate limits PCB bowing during compression. Product is available with either 15 or 30 µin. gold contact plating.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Oct 03, 2011 Mounted using supplied hardware on target PCB without any soldering, SG-MLF-7059 is designed for 3.5 x 2.1 x 0.65 mm package and operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Socket connects all pins with 10 GHz bandwidth on all connections, and contact resistance is 20 milliohms/pin. Additional specifications include 0.15 nH pin self inductance, 0.025 nH mutual inductance, 0.01 pF capacitance to ground, 2 A/pin current capacity.

Sullins Electronics Corp.    San Marcos, CA 92079-0189
Sep 07, 2011 Featuring 0.039 in. centerline, dual-row SBH51 Series Male Box Headers and corresponding SFM210 Series Female Header Mates minimize risk of mismating in high-density board-to-board applications where optimal signal performance is required. Units come in 3-60 positions and have current rating of 1 A per contact. Provided in plate through hole, and with/without guideposts in surface mount terminations, UL94V-0 connectors feature extended temperature range of -40 to +125°C.

Mill-Max Mfg. Corp.    Oyster Bay, NY 11771
Aug 09, 2011 Single-row, right-angle sockets and headers can be combined with vertical .070 in. pitch connectors for various interconnect configurations. Right-angle header and socket pair suit board edge daisy chain applications or mix-and-match with vertical sockets and headers for perpendicular mating of boards. With 871 series, sockets accept device leads as well as mate with 870 header series. Sockets allow for versatility in orientation of display and imaging chips built on Shrink DIP platform.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Jul 29, 2011 Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which incorporates quick insertion method for accelerated ICs change-out.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Jul 01, 2011 Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to be tested in socket is BGA, 52.5 x 52.5 mm, 1 mm pitch, 2097 position, 51 x 51 ball array.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Jun 01, 2011 Addressing requirements for testing Amkor 24-lead QFN, CBT-QFN-7005 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Contactor properties include 0.88 nH self inductance, less than 1 dB @ 15.7 GHz insertion loss, 0.097 pF capacitance, and 4 A @ 80°C temperature rise current capacity. Operating from -55 to +180°C, socket offers wave spring with swivel compression plate for vertical force without distorting device position.

TE Connectivity Ltd.    Berwyn, PA 19312
May 19, 2011 Type BR socket is one-piece connector assembly that features poke-in wire termination method for 18-22 AWG solid wires, 18-20 AWG pre-bonded wires, and 18 AWG stranded wires. Included standoff posts position unit onto heat sink and four M3 or #4 screws are required to secure and complete assembly. Housing material is UV-resistant for outdoor use, and RoHS-compliant unit also features wire strain reliefs to prevent inadvertent wire pull out after assembly.

Ironwood Electronics, Inc.    St. Paul, MN 55121
May 16, 2011 Model SM-BGA-9000 for 23 x 23 mm, 0.8 mm pitch BGA packages operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. It dissipates 4.5 W with heat sink compression screw and can be customized up to 100 W with modified fin design and adding axial flow fan. Operating in temperatures from -55 to +150°C, unit offers contact resistance of 15 mW/pin as well as current capacity of 4 A/pin. Socket, constructed with shoulder screw and swivel lid, mounts on PCB with no soldering.

Ironwood Electronics, Inc.    St. Paul, MN 55121
Apr 26, 2011 Model CBT-BGA-7007 features 0.5 mm pitch stamped spring pins with 26 g actuation force/ball, and 0.4 mm pitch etched spring pins with 34 g actuation force/ball, both which have cycle life of 500,000 insertions. Socket also features floating guide for precise ball-to-pin alignment. Operating in temperatures from -55 to +180°C, it is designed to test 12 x 12 mm, 0.4 mm BGA package in bottom socket and 12 x 12 mm, 0.5 mm pitch memory BGA in top socket. Unit mounts to PCB without soldering.