Device Sockets

Electronic Components & Devices

Epoxy Mount BGA Socket does not require soldering to PCB.

September 1, 2015

Accommodating 13 x 13 mm, 177-pin BGA device with 0.8 mm pitch, SG-BGA-6434 operates at bandwidths up to 27 GHz with <1 dB insertion loss. Aluminum structure dissipates up to several watts, and placement/epoxy system enables mounting without any holes in target PCB, soldering, or mounting hardware/screws. Constructed with elastomer contactor, socket features 20 mΩ typ per pin contact resistance, 2 A/pin current capacity, and 0.11 nH pin self inductance and 0.028 nH mutual inductance. Read More

Electronic Components & Devices

BGA Clamshell Socket operates at bandwidths up to 75GHz.

August 6, 2015

Constructed with elastomer contactor, GT-BGA-2029 sockets 1 mm pitch, 34 x 34 array, 35 x 35 mm 1156BGA package and operates at bandwidths up to 75 GHz with <1 dB insertion loss. Nominal design dissipates few watts using compression screw, and customization for up to 100 W is possible. Mounted on target PCB without any soldering, socket offers contact resistance of 30 mΩ/pin typ. Also, clamshell lid incorporates quick insertion method for IC changeout. Read More

Electronic Components & Devices

BGA Socket operates at bandwidths up to 27 GHz.

July 21, 2015

Accommodating 42.5 x 42.5 mm ICs with 1 mm pitch, Model SG-BGA-6433 operates up to 27 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 60 W using heatsink compression screw with axial flow fan. Mounted on PCB with no soldering, socket is constructed with shoulder screw and swivel lid which incorporates quick insertion method. Device features contact resistance of 20 mΩ per pin, capacitance to ground of  0.01 pF, and current capacity of 2 A per pin. Read More

Electronic Components & Devices, Test & Measuring Instruments

Probe Adapters enable 3rd-party probe and current sensor use.

July 14, 2015

Permitting connection of select Tektronix TekProbe interface level II probes to any ProBus-equipped Teledyne LeCroy oscilloscope, TPA10 TekProbe® Probe Adapter automatically detects which probe is attached, supplies all necessary power and offset control to probe, and communicates probe signal to oscilloscope. CA10 Current Sensor Adapter is programmable and customizable to work with third-party current measurement devices that output voltage or current signals proportional to measured current. Read More

Mounting & Attaching Products, Electronic Components & Devices

BGA Socket Adapter allows reliable socketing of ICs.

June 9, 2015

With LS-BGA1924A-05 Adapter, users can convert compression mount BGA socket which needs mounting holes into conventional through-hole soldering options. Unit consists of machined Phosphorous Bronze pins pressed into FR4 wafer. Top side of adapter has gold plated pads to receive socket interconnect and bottom side has 0.008 in. diameter pin tails. Adapter can be soldered to any through-hole pattern using conventional soldering methods or plugged into mating female receptacle. Read More

Electronic Components & Devices

BGA Socket operates at bandwidths up to 75 GHz.

May 12, 2015

Designed for 2.64 x 3.94 mm package size with 6 x 9 array and 0.4 mm pitch, Model GT-BGA-2024 operates up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate few watts using compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Contact resistance is typically 30 mΩ per pin. Operating from -55 to +160°C, socket is constructed with clamshell lid and is mounted on PCB with no soldering. Read More

Electronic Components & Devices

Clamshell Spring Pin QFN Socket aids power transistors testing.

April 27, 2015

Addressing requirements for testing power transistor, CBT-QFN-7043 accommodates 6.512 x 4.961 mm QFN package with 1 mm pitch, 9 positions, and ground pad. Stamped spring pin contactor, featuring 19 g actuation force per ball and cycle life of 125,000 insertions, offers 0.93 nH self inductance, insertion loss of <1 dB at 23 GHz, and current capacity of 4 A @ 80°C temperature rise. Socket mounts using supplied hardware on target PCB without any soldering.
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Mounting & Attaching Products, Electronic Components & Devices

BGA Socket Adapter supports 500-pin 0.65 mm pitch package.

April 13, 2015

Giga-snaP™ BGA Socket Adapter pairs SFS-BGA500C-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin adapter. SFS-BGA500C-52 allows 0.65 mm pitch, 14 x 17 mm body, 20 x 25 array 500 ball BGA package to be placed in socket and operated without compromising performance in high-speed applications. Both socket and adapter are constructed with high-temperature polyimide and FR-4 body, assuring match with target PCBs and preventing failures due to CTE mismatch. Read More

Electronic Components & Devices

BGA Socket supports 27 GHz bandwidth.

March 18, 2015

Designed for 1 mm pitch, 52.5 x 52.5 mm, 2577-pin BGA ICs, Model SG-BGA-6422 operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. Unit dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Constructed with shoulder screw and swivel lid, socket is mounted on PCB with no soldering and features temperature range of -35 to +100°C. Read More

Electronic Components & Devices

Clamshell BGA Socket features heat sink lid.

February 27, 2015

Designed for 25 x 25 mm package size, Model GT-BGA-2019 operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 7 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with low inductance elastomer contactor, socket features typical contact resistance of 30 mΩ per pin and is mounted on target PCB with no soldering. Read More

Electronic Components & Devices

Clamshell Spring Pin QFN Socket accommodates 10TDFN package.

February 11, 2015

Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of <1 dB @ 31.7 GHz, and current capacity of 1.5 A @ 20°C temperature rise. Socket features include lockable double latch socket lid and guide for precise device-to-pin alignment. Read More

Electronic Components & Devices, Test & Measuring Instruments

Burn-in Test Socket accommodates QFN74 with exposed pad.

February 2, 2015

Operating from -55 to +155°C, CBT-QFN-7038 has clamshell lid and features stamped spring pin contactor with 15 g actuation force per ball and cycle life of 10,000+ insertions. Self inductance of contactor is 0.98 nH, insertion loss is <1 dB at 10 GHz, capacitance is 0.03 pF, and current capacity of each contactor is 2.2 A. Configuration of package to be tested is 4.5 x 12.5 mm QFN with 0.4 mm pitch, 74 peripheral positions, and additional 6x3 array of pins for center ground pad. Read More

Electronic Components & Devices

Elastomer Socket accommodates QFN34 package.

January 20, 2015

Designed for 6 x 4.5 mm QFN package with 0.4 mm pitch, Model SG-MLF-7084 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Socket is mounted using supplied hardware on target PCB with no soldering. Operating from -35 to +100°C, socket features pin self inductance of 0.118 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.229 pF. Read More

Electronic Components & Devices

Stamped Spring Pin Test Socket accommodates BGA243 packages.

December 30, 2014

Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 has stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is <1 dB at 15.7 GHz, and capacitance is 0.097 pF. Socket temperature range is -55 to +180°C. Along with integrated compression plate for vertical force without distorting device position, features include clamshell lid that facilitates operation.
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Electronic Components & Devices

BGA Socket accommodates hybrid memory cube.

December 15, 2014

Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C. Read More

Communication Systems & Equipment, Electronic Components & Devices, Mounting & Attaching Products

BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.

December 4, 2014

Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target PCBs and preventing failures that occur with CTE mismatch. Read More

Electronic Components & Devices

DDR4 DIMM Socket reduces intermittent signal issues.

November 24, 2014

Providing reliable contact, JEDEC-compliant FCN-07 series improves intermatability between DDR4 memory card and PCB socket. Split-beam contact structure provides two points of contact on inserted memory card to ensure there are no intermittent signals due to dust particles, flux, or vibration during system start-up or life of project. With 2.4 mm (max) module seating plane, these 141 x 6.50 x 21.3 mm card-edge memory module sockets come in SMT and through-hole termination types. Read More

Electrical Equipment & Systems, Electronic Components & Devices

LED Design Components suit space-critical applications.

October 27, 2014

Single-pole PTSM terminal block features push-in termination technology. Its 2.5 centerline and slim profile suit LED installations and allow single-wire connection in compact footprint. Designed for surface mounting, PTSM vertical header moves wires off PCB for vertical space utilization and increases options when connecting LEDs. PTSM through-board header removes connector mass from top of PCB and relocates it underneath, allowing for pluggable connections to come from rear of device. Read More

Electronic Components & Devices

BGA Heat Sink Lid Socket operates at bandwidths up to 75 GHz.

October 22, 2014

Constructed with elastomer contactor, GT-BGA-6008 sockets 27 x 27 mm, 0.8 mm pitch BGA package and operates up to 75 GHz with <1 dB insertion loss. Design dissipates 4.5 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and addition of axial flow fan. Socket mounts on target PCB without any soldering, swivel lid incorporates quick insertion method to accelerate IC changeout, and contact resistance is 20 mΩ/pin typ. Read More

Electronic Components & Devices

QFN IC Socket connects all pins with 40 GHz bandwidth.

October 10, 2014

Operating at bandwidths up to 40 GHz with <1 dB insertion loss, SMP-QFN-8008 is constructed with elastomer contactor and designed to socket 10 x 10 mm, 0.5 mm pitch QFN packages on any application board. Socket mounts on target PCB without any soldering and uses mechanical hardware for mounting, while double latch lid incorporates insertion method that accelerates IC changeout. Features include 15 mΩ typ contact resistance per pin, 0.10 nH pin self inductance, and 0.007 nH mutual inductance. Read More