Electronic Components

Sensors, Monitors & Transducers, Electronic Components & Devices

Inductor Sensor Interface IC serves automotive/industrial markets.

August 4, 2015

Based on inductive sensing technology, contactless LX3301A utilizes LVDT architecture implementations on PCBs. LVDT principles promote immunity to noise and interference. In addition to embedded 32-bit processing engine with 12 kB program memory, features include 2 sensor input channels with integrated demodulator, internal oscillator with 1–5 MHz range, dual 13-bit ADC with sample rates to 2 kHz, and user-programmable 16 x 16 bit non-volatile configuration memory. Read More

Machinery & Machining Tools, Welding Equipment & Supplies, Electronic Components & Devices

FCAW-G Electrode is designed for shipbuilding.

August 4, 2015

With minimal spatter and fume generation rates, UltraCore® HD Marine gas-shielded, flux-cored wire electrode enables flat bead shape when welding at high deposition rates in all positions. Consumable meets such shipbuilding standards as ABS, DNV, LR, and BV and comes in 15 lb spool package that facilitates handling and fosters mobility. Along with deposition rates up to 12 lb/hr out-of-position, features include arc stability with 100% CO2 shielding gas. Read More

Electronic Components & Devices, Controls & Controllers

USB Type-C Power Delivery Controller IC has all-in-one design.

July 30, 2015

Providing full power path, TPS65982 operates as single- or dual-role port and enables various host and device power implementations. It can be combined with 5.4-Gbps HD3SS460 USB Type-C cross-point switch, which enables USB connectors on either end of cable to be flipped up/down, delivers up to 100 W, and supports alternate modes to distribute video over DisplayPort. For USB Type-C systems requiring up to 15 W, TUSB320 series provides USB Type-C configuration channel logic and port control. Read More

Electronic Components & Devices

USB IP Solutions integrate Type-C functionality.

July 30, 2015

Based on DesignWare USB PHY architectures in 28 nm and 14/16 nm FinFET silicon, DesignWare® USB-C PHYs support USB Type-C™ (USB-C™) connectivity specification. Design reduces BOM by eliminating need for discrete multiplexers and crossbar switch components. While DesignWare USB-C 3.1 PHY offers 10 Gbps and 5 Gbps data transfer rates and consumes <55 mW power at 10 Gbps speeds, DesignWare USB-C 3.0 PHY supports all USB 3.0 and 2.0 speed modes in one GDSII design that facilitates integration. Read More

Electronic Components & Devices

Snap-in Power Aluminum Electrolytic Capacitors have 500 V rating.

July 30, 2015

Supplied in blue sleeve-insulated, cylindrical aluminum case in 23 sizes from 22 x 25 mm to 35 x 60 mm, 157 PUM-SI series conserves board space in power supplies, industrial motor controls, and solar PV inverters by allowing designers to utilize one component instead of two 250 V capacitors. These polarized aluminum electrolytic capacitors with non-solid electrolyte are RoHS compliant and feature max operating temperature of +85°C at 500 V. Keyed polarity snap-in version is also available. Read More

Electronic Components & Devices, Computer Hardware & Peripherals, Test & Measuring Instruments

Signal Interface Systems support VPX or PCIe.

July 30, 2015

Combining Flexor line of FMC modules and Virtex-7 FPGA FMC carriers, FlexorSet™ integrated FMC sub-systems are preconfigured with optimized IP and fully supported with software development tools. FlexorSet Model 5973-317 is available for 3U VPX, while Model 7070-317 is for PCIe. Flexor Model 3316 8-Channel A/D FMC is installed on either of two Flexor FMC carriers containing 8-channel digital down converter IP, which is matched to eight 250 MHz, 16-bit A/Ds on FMC. Read More

Electronic Components & Devices, Sensors, Monitors & Transducers

Digital 16-bit Color Sensor IC provides serial output.

July 28, 2015

Equipped with I²C bus interface, BH1745NUC offers sensitivity, dynamic range, and IRcut characteristics suitable for use in obtaining illuminance and color temperature of ambient light for adjusting LCD backlight. This digital 16-bit serial output color sensor IC leverages original IR removal technology and computing methods to achieve optimal infrared cutoff characteristics and thereby reduce effects of IR rays. Read More

Electronic Components & Devices, Mechanical Components & Assemblies

Security, Compression Processors enhance data center operations.

July 27, 2015

Targeting enterprise and virtualized cloud data centers, NITROX V security processors and adapters integrate up to 288 purpose-built security cores with optimized compression engines and virtualization hardware with PCIe Gen 3 and Interlaken interfaces. Products deliver SSL performance with 120K RSA Ops/Sec and 300K P256 ECC Ops/sec and bulk encryption performance of 100 Gbps for diverse protocols, flexibility to support emerging algorithms and protocols, and various I/O options. Read More

Electronic Components & Devices

Monolithic Ceramic Capacitors operate above 100 µF.

July 27, 2015

In addition to 1206 size models with 150 µF and 220 µF capacitance and rated voltage of 6.3 V, GRM Series includes 1210 size model with 330 µF capacitance and rated voltage of 4 V. All have M (±20%) deviation rating and X5R temperature characteristics such that capacitance change is no more than ±15% within temperature range of -55 to +85°C. Applications include decoupling on low voltage rails for programmable logic and processors used in servers, network and data communications infrastructure. Read More

Electronic Components & Devices

MLCCs deliver space-level reliability in 7 SMD packages.

July 27, 2015

Qualified to MIL-PRF-123 for aerospace and military applications, surface-mount Multilayer Ceramic Chip Capacitors are available with BP and BX dielectrics in 7 body sizes ranging from 0805–2225. Devices with BP dielectric offer low capacitance down to 1.0 pF, temperature coefficient of capacitance of 0 ppm/°C ±30 ppm/°C from -55 to +125°C, and aging rate of 0% max per decade. BX devices provide higher capacitance to 470 nF, TCC of ±15% from -55 to +125°C, and aging rate of 1% max per decade. Read More

Electronic Components & Devices

Radial Leaded MLCCs offer 630 Vdc rating.

July 27, 2015

Available in both COG and X7R dielectric, High Voltage Goldmax Radial Leaded Multilayer Ceramic Capacitors are rated for use in temperatures from -55 to +125°C. Units feature advanced ceramic technology and wire lead termination system, which ensures mechanical robustness in harsh and high vibration environments. Weld- or crimp-mounted, non-polar capacitors are suited for power supplies, automotive keyless entry, temperature sensors, LED lighting, and electric motors. Read More

Electronic Components & Devices

High Current Shunt Resistors have chassis mount design.

July 24, 2015

Able to handle currents up to 350 A, HCC8420 high current chassis mount shunt resistors are rated at 15 W and have resistance value of 0.1 mΩ and TCR of 100 ppm/°C. Custom configurations to value and sensing tabs may be available. Areas of use include frequency converters, power modules, and battery management for hybrid power sources. Read More

Electronic Components & Devices, Test & Measuring Instruments

Analog-to-Digital Converters integrate fault detection.

July 23, 2015

Housed in 9.7 x 6.4 mm TSSOP, Models ADS1262/ADS1263 provide 32-bit resolution and low noise of 7 nV(RMS) at 2.5 SPS, enabling measurement of small signals, which is essential for bridge applications where typical full-scale signals are 10 mV or less. ADS1262 integrates programmable gain amplifier, 2.5 V reference, oscillator, level shifter, temperature sensor, dual-excitation current sources, and 8 GPIO pins. ADS1263 adds auxiliary 24-bit delta-sigma ADC. Max output data rate is 38 kSPS for both. Read More

Controls & Controllers, Electronic Components & Devices

AEC-Q100-Compliant LDO targets automotive applications.

July 22, 2015

Supplied in 6-pin, 2 x 2 mm DFN package, MAQ5300 can be used in space-constrained and high-reliability applications subject to harsh environments and temperatures. Features include dropout of 100 mV at 300 mA, 300 mA guaranteed output current, and several fixed output voltage options: 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, and 3.3 V. Initial precise output voltage accuracy is +2%, and shutdown quiescent current is 0.1 µA. Thermal shutdown and current limit protections are standard. Read More

Electronic Components & Devices

Microcontrollers feature core-independent peripherals (CIPs).

July 22, 2015

Offered in 14- to 20-pin packages with up to 28 KB of Flash, PIC16F1579 Series features CIPs that enable functions for LED lighting and motor control. Eight-bit PIC MCUs have four 16-bit PWMs, each with independent timers for flexible output and signal generation. PIC16F18877 Series, offered in 8- to 40-pin packages with up to 56 KB of Flash, includes CIPs for consumer electronics, IoT, and safety-critical systems. Integrated ADC with computation performs input and sensor interface functions. Read More

Electronic Components & Devices, Electrical Equipment & Systems

PCB Terminal Blocks have modular, interlocking design.

July 22, 2015

Horizontal wire entry models CMM5-2 and CMM5-3 and vertical wire entry models CZZ5-2 and CZZ5-3 are UL recognized at 24–14 AWG, 16 A at 300 V Available in 2- and 3-position configurations, these white, 5 mm pitch, interlocking modular PCB terminal blocks accommodate new builds as well as maintenance and repair applications. Interlocking is accomplished by sliding tab on one side of terminal block into groove of another one to create endless number of wire positions. Read More

Electronic Components & Devices, Vision Systems

IR Emitting Diodes come in SMD top-view package.

July 22, 2015

Based on GaAIAs surface emitter chip technology, 850 nm VSMY12850 and 940 nm VSMY12940 offer radiant intensity to 16 mW/sr at 70 mA driving current, switching time of 10 ns, and forward voltage of 1.6 V. SurfLight™ devices are housed in 3.2 x 1.6 x 1.1 mm clear PCB-based packages with inner lenses for surface mounting. Suitable for high pulse current operation to 1 A at 100 µs, RoHS-compliant devices feature ±40° angle of half intensity and operating temperature of -40 to +85°C. Read More

Adhesives & Sealants, Green & Clean, Electronic Components & Devices

Conductive Adhesive is used for stringing solar modules.

July 22, 2015

Intended for stringing applications in crystalline silicon and thin-film solar modules, EMS 561-403 Snap Cure Conductive Adhesive is designed to electrically interconnect solar cells using ribbons. Stress-absorbing adhesive withstands thermal cycling effects and exhibits conductive stability to cell and ribbon metallization during damp heat exposure. Ability to cure within seconds at 180°C or above accelerates fixturing of cells in stringer. Read More

Electrical Equipment & Systems, Electronic Components & Devices

Compact Isolation Transformer can be used in sealed environments.

July 21, 2015

Offering full load operating efficiencies of 97%–99%, isolation transformers come in 250+ models that collectively cover 120–600 V input range and offer secondary voltages of 120, 208, 240, or 277 V. Design fosters safety and reliability with minimized leakage current to ground, while efficiency promotes cool operation and allows transformers to be installed in sealed environments without any external cooling. Areas of use include commercial and industrial applications.
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Electronic Components & Devices

Microcontrollers leverage ARM Cortex-M7 processor.

July 21, 2015

With architecture combining ARM® Cortex® M7 core and peripherals, STM32F7 MCUs help designers enhance application performance, add functions, extend battery life, and ensure security while minimizing external component use. MCU delivers 1,082 CoreMark/462 DMIPS executing from embedded Flash with ST ART Accelerator™ at 216 MHz. Due to L1 cache (I/D 4KB+4KB), external memory can be used without any performance penalty. Read More