Remtec, Inc.
Norwood, MA 02062
Oct 23, 2009 Suited for applications in aerospace, military, and high-end industrial markets, DC and RF Hermetic SMT Packages permit power dissipation levels of 100 W and current capacity up to 75 A. Circuit designers can select multi-chip modules, BGA construction, SMT leadless and leaded I/O connections, and high-voltage insulation. Based on Plated Copper on Thick Film technology, ceramic SMT packages offer alternative to co-fired ceramic packages as well as metal-based, glass-to-metal hermetic enclosures.

CPS Technologies Corp.
Norton, MA 02766
Sep 05, 2008 Compliant with RoHS, AlSiC metal matrix composite lids are available in large format for SiP devices used in workstations, servers, video processing, data communications products, and Internet routers. AlSiC cast products can incorporate functional design features such pockets for memory chips, ridges for reinforcement, bosses for alignment, and cavities or pedestals for die. Surface supports laser marking, paint, ink, and screen printing, as well as plating anodization.

Avago Technologies
San Jose, CA 95131
Jul 10, 2008 WaferCap CSP allows high frequency RF devices to be batch packaged using semiconductor processing techniques, offering potential to reach 100 GHz frequency range in SMT package. By eliminating wire bonds, devices can fit in variety of positions for wide range of RF architectures, and can be can be directly soldered onto board using standard techniques. WaferCap packaged parts measure 1.0 x 0.5 with height of 0.25 mm, reducing thickness of assembly.

Corning Cable Systems
Hickory, NC 28603-0489
Jan 23, 2007 While providing interconnect or cross-connect capabilities between outside plant, riser, or distribution cables and optoelectronics, Pretium(TM) Wall-Mountable Connector Housings can also secure Plug & Play(TM) System modules to facilitate network deployment. Products can be mounted in main cross-connects or telecommunications rooms and are available with 2, 4, 6, or 12 panels. Metal cabinet contains jumper routing guides, jumper strain-relief point, and optional field-installable lock kit.

Hitaltech UK
Poulton-le-Fylde FY6 8JX  United Kingdom
Jan 09, 2007 Modulbox & Modulbox XT range of DIN 43880 rail mountable enclosures have design that allows inserts to be developed for all 4 sides of enclosure, enabling customers to specify their own unique design. Type A enclosure has 2-step shape, Type B has 2 steps on 1 side of box and high side on the other, and Type C has high sides on both sides of box.

Schreiner Label Tech, Inc.
Southfield, MI 48034
Dec 12, 2006 Designed to replace plastic housing closures, SmartCap Systems protect electronics from dirt and moisture as well as static electricity and EMI. Customizable film can be applied using pressure-sensitive adhesive or by using laser or ultrasonic welding. Complying with highest IP protection classes, closures allow for integration of additional functions such as security features, and can be printed on using thermal transfer ribbon, eliminating need for labels.

Phoenix Contact
Harrisburg, PA 17111 0100
Nov 28, 2006 Allowing vertical, horizontal, or lengthwise PCB mounting, Building Case (BC) housings are suited for industries dealing with limited panel depth or similar space constraints. DIN 43380-compliant, products feature 16-position DIN-rail connector that provides parallel and serial communications as well as power bussing. Offered with clear, hinged cover or captive, snap-in cover, housings are compatible with various types of terminal blocks and standard data connections.

STMicroelectronics
Carrollton, TX 75006
Sep 14, 2006 Designed for mobile phone applications, Package-on-Package (PoP) memory solution is available in 12 x 12 mm (128 balls) and 14 x 14 mm (152 balls) sizes, with 0.65 mm ball pitch. Bottom PoP package features array of metallic balls on underside and array of footprints (lands) on top surface to receive mating Top BGA package. Technique allows devices to be assembled in vertical stacks consisting of logic device with memory BGA package soldered on top.

TT electronics IRC Wirewound and Film Technologies Division
Boone, NC 28607
Aug 30, 2006 CHC Series high-speed digital termination ball grid array (BGA) package is designed to prevent signal theft in consumer electronics devices. BGA termination network is constructed with no exposed conductors, and all termination balls and circuitry lay on bottom of device to eliminate any possibility of top side probing. Termination network is constructed with TaNFilm® process, which produces tantalum nitride thin film resistive elements immune to corrosion in humid environments.

Remtec, Inc.
Norwood, MA 02062
Jun 20, 2006 Available in several configurations utilizing Plated Copper on Thick Film (PCTF®) technology, leadless ceramic SMT hermetic packages can be fabricated in sizes from .15-.75 in.² and come in fully hermetic (to 10-8) version. Wraparound interconnections and thermally conductive plugged vias are suited for ground and signal connections. Being plugged via holes with resistance under 1 milliohm results in RF losses below .1 dB at 4 GHz, and SMT enclosures can operate from DC to 32 GHz.

Bud Industries, Inc.
Willoughby, OH 44094
May 30, 2006 Measuring 6.10 x 4.60 x 1.37 in., Utilibox Style A Enclosures feature internal dimensions of 5.84 x 4.34 x 1.17 in. They come in flanged and unflanged styles, weighing 6.3 oz and 5.9 oz, respectively. Bodies and covers are UL94-5VA rated ABS with textured surfaces for mar resistance. All enclosures have PCB mounting bosses and are available with or without molded-in wall mounting brackets.

National Semiconductor Corp.
Santa Clara, CA 95051-0695
Feb 22, 2006 Building on micro SMD, micro SMDxt integrated circuit package enables design of products with bump counts of 42-100 bumps at 0.5 mm pitch without any underfill. Package height of 0.65 mm enables integration into thin-profile consumer products. Epoxy back coating protects against silicon damage during manufacturing, while self-aligning solder bumps facilitate surface mount assembly and rework.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Dec 19, 2005 Optimized for lead-free manufacturing, package integrates Hysol® GR828H mold compound with Hysol QM1519 die attach adhesive for wire sweep properties and adhesive strength, respectively. Green solution, designed for 16- and 14-lead, Pb-free SOIC packages, uses Cu/Ni/Au leadframe. It achieves MRT reliability for MSL L1 up to 260°C, with no delamination at die top or at pad. High temperature storage is tolerated for up to 3,000 hr @ 210°C.

Bud Industries, Inc.
Willoughby, OH 44094
Aug 26, 2005 With NEMA 4X/IP65 ratings, AN-Series aluminum die-cast box features hinged cover that facilitates access to components without risking environmental exposure. External mounting brackets allow box to be mounted on wall or panel without removing gasketed cover. Available in 3.95 x 3.04 x 1.98 in. and 4.54 x 3.92 x 2.23 in. sizes, enclosure offers EMC protection, comes in black powder coat finish, and can be machined and modified to requirements.

Stanley Vidmar
Allentown, PA 18105 1151
May 16, 2005 Measuring 59 in. high, Inert Gas Housing Cabinet consists of bank of drawers behind locking front door. When door is closed, neoprene gasket provides airtight seal. To prevent oxidation, user can lower humidity by pumping nitrogen gas or dry air into cabinet. Optional static dissipative finish minimizes danger of static build-up, which can damage electronic components. Cabinet is suited for Class 10,000 cleanrooms and meets MIL-STD-883A standard.

Bud Industries, Inc.
Willoughby, OH 44094
Apr 16, 2004 Extra Deep Cabinets have perforated side panels and rear door. Econoglas front door permits maximum airflow. Cable access ports in top and bottom of cabinets enable overhead cabling or raised data room floors. Internal grounding studs are located in top and bottom of rack. Two pairs of fully adjustable, L-Shaped panel mounting rails, with mounting holes on EIA universal spacing, have provisions for vertical cable management. Cabinets can attach together for construction of equipment bays.

Texas Instruments, Inc., Semiconductors
Dallas, TX 75243
Oct 13, 2003 NanoStarâ„¢ wafer chip-scale packaging (WCSP) has no molding compound, lead frame, wire bonds, or leads. Using surface-mount technology assembly procedures, packaging can be mounted to PCB without additional under fill. Available power management ICs include RF LDO regulator; DC/DC buck converter; dual operational amplifier; audio power amplifier; and digital-to-analog converter with serial interface. WCSP products are available in lead and lead-free ball options.

Fairchild Semiconductor
South Portland, ME 04106
Jun 30, 2003 Utilizing encapsulated chip-on-substrate approach, MicroPak 8 consists of one 8-terminal chip scale leadless package for 1-, 2-, and 3-bit logic and switch functions. TinyLogic® MicroPak 8 package maintains 0.5 mm terminal pitch while its 0.2 x 0.3 mm land grid array contact pads ensure joint integrity under harsh environmental stresses. Currently offered is the UHS logic family which includes triple buffers, dual 3-state buffers, dual gates, flip flops, dual analog, and bus switches.

Thunderline-Z
Hampstead, NH 03841
Apr 02, 2003 Direct Bond-HF Modules utilize glass-to-metal sealing and Kovar housings. They maintain signal performance throughout all high frequency conductors without moding due to resistance. Modules are suitable for switches and multifunction chassis assemblies utilized in radar, early warning and countermeasure systems. Temperature performances exceed commercial and military standards and hermeticity is offered at up to 1xE^(-9) cc/sec@1atm.

Tracewell Systems, Inc.
Westerville, OH 43081-8846
Dec 04, 2002 Model S33-1U provides push/pull cooling scheme that handles boards dissipating up to 70 W/slot. Equipped with local and remote monitoring capabilities, unit supports ongoing system performance and diagnostics. Airflow is distributed evenly via 7 fans, each providing 15 CFM. Unit incorporates 250 W power supply and houses 2-slot CPCI backplane that supports hot swap and System Management Bus capability. Overall chassis measurement is 13.7 x 10.0 x 1.74 in.