Microsemi Corp.    Scottsdale, AZ 85251
Oct 24, 2011 Suited for power transistors and diodes, U4 package is 70% percent smaller than U3 and offers Defense Logistics Agency (DLA) qualification for range of products. Devices assembled as vehicles for this package qualification included medium-power NPN and PNP bipolar transistors. With typical power rating of 5-15 W @ Tc=25C, package is constructed with aluminum nitride ceramic that optimizes heat dissipation to accommodate products such as power supplies, converters, and regulators.

EIC Solutions, Inc.    Warminster, PA 18974-1157
Apr 14, 2011 Available with integrated 200, 400, 800, or 1,500 BTU thermoelectric air conditioner, wall-mount Protector(TM) Series safely and securely house fire panels used by contractors and builders in apartment complexes and industrial parks. Electrical equipment enclosures, also suitable for pole or floor mounting, are available in various materials as well as with locking latches, view windows, surge protectors, insulation, and visual or audible temperature alarms.

Bud Industries, Inc.    Willoughby, OH 44094
Feb 24, 2011 Featuring double-channel sealing system that results in IP67 protection, die cast ANS Series uses continuous EMI/RFI gasket around entire perimeter of box and second gasket, made of one-piece silicone, that seals out dust and moisture. Screws outside sealing area ensure uniformly tight seal, while manufacture from No. ADC-12 aluminum using 0.098 in. thick wall construction provides strength and rigidity. Available sizes (18) range from 2.83 x 2.64 x 1.53 in. to 9.45 x 6.30 x 3.35 in.

EoPlex Technologies, Inc.    Redwood City, CA 94063
Oct 19, 2010 Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications, including cell phones, laptops, mp3 players, GPS, cameras, and wireless devices.

Express Manufacturing, Inc.    Santa Ana, CA 92704
Oct 05, 2010 To meet compact design demands of portable and desktop medical devices, Package on Package (PoP) assembly packaging technology vertically stacks discrete controller and memory Ball Grid Array (BGA) components. This allows multi-chip packages to be integrated for space conservation on PCB and simplifies assembly processes using single flow/reflow, which eliminates thermal stress during assembly. Dedicated assembly flow is designed based on thermal coefficient characteristics of components.

Harting KGaA      Germany
Sep 09, 2010 Fastened with 4 screws, Han® 3 A Angled Bulkhead-Mount Housing is suitable for mechanical engineering where connectors are exposed to extreme forces generated by high velocities. Sealing system ensures direct contact between connector housing and mounting surface for optimum EMC performance. Suitable for mounting from front or rear side of control cabinet panels, Han® 3 A Split Hood Housing can be sealed on termination side with screwed gland so that entire interface features IP 65/67 rating.

Thunderline-Z    Hampstead, NH 03841
Jun 04, 2010 Rugged 1.2 sq in., 28-pin SMT hi-rel package features 9 mil mini Bell pins that are laser welded into Kovar housing with pin spacing of 0.135 in. Able to withstand extreme temperature fluctuations over long period of time, high-frequency package can be used in space and other hi-rel environments.

Stratedge    San Diego, CA 92123
Jun 04, 2010 Meeting MIL-STD hermetic requirements, SM series leadless SMT packages are suited for LEDs, MEMS, and optical devices used in aerospace, avionics, automotive, and telecom industry applications. Metal plug in base allows direct ground path for enhanced electrical performance, and outlines match industry standards for direct replacement of traditional quad flat package designs. With rated performance from DC to 30+ GHz, packages include 5 x 5 mm version with 28 I/Os.

STMicroelectronics    Lexington, MA 02421
Mar 16, 2010 Intended high-frequency, high-power applications, STAC plastic air-cavity packages feature junction-to-case thermal resistance (RTH) of 0.28°C/W that promotes heat removal from die during normal operation. This allows transistors to deliver increased gain and greater output power while also promoting reliability. Two versions are available, matching dimensions of industry-standard solder-down (flangeless) or bolt-down ceramic packages, to enable direct replacement in existing designs.

Semlab Limited    Leicestershire LE17 4JB  United Kingdom
Mar 02, 2010 Providing packaging alternative for high-reliability space-qualified SMT diodes, DLCC (diode leadless chip carrier) Series comes in fully hermetic SMT ceramic package and is suited for military, aerospace, avionics, and high-temperature applications. Design fits standard solder footprint of existing MELF-type devices and features thermal vias that aid heat transfer to solder pads. Also, castellated terminations ensure solder meniscus between PCB and device is visible for inspection.

Remtec, Inc.    Norwood, MA 02062
Oct 23, 2009 Suited for applications in aerospace, military, and high-end industrial markets, DC and RF Hermetic SMT Packages permit power dissipation levels of 100 W and current capacity up to 75 A. Circuit designers can select multi-chip modules, BGA construction, SMT leadless and leaded I/O connections, and high-voltage insulation. Based on Plated Copper on Thick Film technology, ceramic SMT packages offer alternative to co-fired ceramic packages as well as metal-based, glass-to-metal hermetic enclosures.

CPS Technologies Corp.    Norton, MA 02766
Sep 05, 2008 Compliant with RoHS, AlSiC metal matrix composite lids are available in large format for SiP devices used in workstations, servers, video processing, data communications products, and Internet routers. AlSiC cast products can incorporate functional design features such pockets for memory chips, ridges for reinforcement, bosses for alignment, and cavities or pedestals for die. Surface supports laser marking, paint, ink, and screen printing, as well as plating anodization.

Avago Technologies    San Jose, CA 95131
Jul 10, 2008 WaferCap CSP allows high frequency RF devices to be batch packaged using semiconductor processing techniques, offering potential to reach 100 GHz frequency range in SMT package. By eliminating wire bonds, devices can fit in variety of positions for wide range of RF architectures, and can be can be directly soldered onto board using standard techniques. WaferCap packaged parts measure 1.0 x 0.5 with height of 0.25 mm, reducing thickness of assembly.

Corning Cable Systems    Hickory, NC 28603-0489
Jan 23, 2007 While providing interconnect or cross-connect capabilities between outside plant, riser, or distribution cables and optoelectronics, Pretium(TM) Wall-Mountable Connector Housings can also secure Plug & Play(TM) System modules to facilitate network deployment. Products can be mounted in main cross-connects or telecommunications rooms and are available with 2, 4, 6, or 12 panels. Metal cabinet contains jumper routing guides, jumper strain-relief point, and optional field-installable lock kit.

Hitaltech UK    Poulton-le-Fylde FY6 8JX  United Kingdom
Jan 09, 2007 Modulbox & Modulbox XT range of DIN 43880 rail mountable enclosures have design that allows inserts to be developed for all 4 sides of enclosure, enabling customers to specify their own unique design. Type A enclosure has 2-step shape, Type B has 2 steps on 1 side of box and high side on the other, and Type C has high sides on both sides of box.

Schreiner ProTech, a business unit of Schreiner Group LP    Blauvelt, NY 10913
Dec 12, 2006 Designed to replace plastic housing closures, SmartCap Systems protect electronics from dirt and moisture as well as static electricity and EMI. Customizable film can be applied using pressure-sensitive adhesive or by using laser or ultrasonic welding. Complying with highest IP protection classes, closures allow for integration of additional functions such as security features, and can be printed on using thermal transfer ribbon, eliminating need for labels.

Phoenix Contact    Harrisburg, PA 17111 0100
Nov 28, 2006 Allowing vertical, horizontal, or lengthwise PCB mounting, Building Case (BC) housings are suited for industries dealing with limited panel depth or similar space constraints. DIN 43380-compliant, products feature 16-position DIN-rail connector that provides parallel and serial communications as well as power bussing. Offered with clear, hinged cover or captive, snap-in cover, housings are compatible with various types of terminal blocks and standard data connections.

STMicroelectronics    Lexington, MA 02421
Sep 14, 2006 Designed for mobile phone applications, Package-on-Package (PoP) memory solution is available in 12 x 12 mm (128 balls) and 14 x 14 mm (152 balls) sizes, with 0.65 mm ball pitch. Bottom PoP package features array of metallic balls on underside and array of footprints (lands) on top surface to receive mating Top BGA package. Technique allows devices to be assembled in vertical stacks consisting of logic device with memory BGA package soldered on top.

TT electronics IRC Wirewound and Film Technologies Division    Boone, NC 28607
Aug 30, 2006 CHC Series high-speed digital termination ball grid array (BGA) package is designed to prevent signal theft in consumer electronics devices. BGA termination network is constructed with no exposed conductors, and all termination balls and circuitry lay on bottom of device to eliminate any possibility of top side probing. Termination network is constructed with TaNFilm® process, which produces tantalum nitride thin film resistive elements immune to corrosion in humid environments.

Remtec, Inc.    Norwood, MA 02062
Jun 20, 2006 Available in several configurations utilizing Plated Copper on Thick Film (PCTF®) technology, leadless ceramic SMT hermetic packages can be fabricated in sizes from .15-.75 in.² and come in fully hermetic (to 10-8) version. Wraparound interconnections and thermally conductive plugged vias are suited for ground and signal connections. Being plugged via holes with resistance under 1 milliohm results in RF losses below .1 dB at 4 GHz, and SMT enclosures can operate from DC to 32 GHz.