Vishay Intertechnology, Inc.    Malvern, PA 19355 2143
Dec 22, 2006 RoHS-compliant, shielded inductors measure 0.405 x 0.453 x 0.158 in. and suit VRM and DC/DC converter applications in various end products. For applications requiring frequency range up to 1 MHz, IHLP-4040DZ-11 has inductance range of 0.19-100 H, saturation current from 2.25-46 A, and typ DCR from 0.70-249.0 mW. For applications requiring frequency range up to 5 MHz, IHLP-4040DZ-01 has inductance range of 0.19-10 H, saturation current from 12.0-90 A, and typ DCR from 0.875-33.20 mW.

Performance Motion Devices, Inc.    Lincoln, MA 01773
Dec 22, 2006 Monitoring both targeted and actual position, single-axis, single-IC Magellan 55110 detects motion errors that can result in stall condition. Driven by host microprocessor using 8 or 16-bit parallel bus, CANbus 2.0B, or asynchronous serial port, device offers programmable PID filter with velocity and acceleration feedforward, 32-bit position error, and 50 µsec loop time. Selectable profile modes include S-curve, trapezoidal, velocity contouring, and electronic gearing.

NEC Electronics    Santa Clara, CA 95050
Dec 22, 2006 Model NL2432HC17-04B 2.7 in. transreflective display module features reflective ratio of 35% and brightness level of 100 cd/m² in transmissive mode. With contrast ratios of 150:1 in transmissive mode and 15:1 in reflective mode, NL2432HC22-41B 3.5 in. display has luminence level of 200 cd/m² and reflective ratio of 15%. Both amorphous silicon TFT LCD modules have mode for using backlight system as spectral source and one for using ambient light.

NEC Corporation    Tokyo 108-8001  Japan
Dec 22, 2006 Featuring 100 nm pitch (50 nm for both metal-width and spacings), 32 nm-node Cu multi-layer interconnect offers parasitic capacitance of 83 fF/mm. Density-modulated low-k film technology, based on plasma copolymerization technique, enables continuous alteration of dielectric constant and mechanical strength of low-k films during growth by changing supply ratio of 2 types of precursors. This achieves sequential and selective formation of porous and rigid low-k films.

Sipex Corp.    Miliptas, CA 95035-1701
Dec 22, 2006 Capable of driving low forward voltage LEDs from 33 mA to 1 A, SP7618 enables range of LED lighting applications with zero external components and minimal design time. It can drive LED directly from single cell Li-Ion or 3 alkaline batteries in series without additional boost regulator. Product can also dynamically change current level and PWM width simultaneously. Also available, SP7619 and SP7619A Flash Drivers let user select from 2 pre-set current levels.

Fairchild Semiconductor Corp.    South Portland, ME 04106
Dec 22, 2006 Utilizing variable on-time control method, critical conduction mode PFC Models FAN7529 and FAN7530 achieve THD performance of less than 10% at 25% load, 265 Vac. Units meet stand-by power regulations by reducing input voltage sensing loss to 100 mW. Open feedback protection and 65 µA disable function make Vcc shut-down circuitry unnecessary. Additional features include 150 µs internal start-up timer, MOSFET over-current protection, and under-voltage lockout with 3.5 V hysteresis.

Jacket Micro Devices, Inc.    Atlanta, GA 30308
Dec 22, 2006 Model M30001 WiMAX front-end module contains all active and passive components required to interface WiMAX transceivers directly to antenna. Meeting need for extended range and data rates of WiMAX devices, module delivers 24 dBm output power at 4% error vector magnitude. Device is available in 7 x 7 x 1.2 mm QFN package for use in mobile phone, laptop, and consumer electronics applications.

Broadcom Corp.    San Jose, CA 95110
Dec 21, 2006 Designed in 65 nm process geometry, Model BCM3563 is compatible with NTSC analog standard, ATSC digital standard, and digital cable TV standard. It supports picture-in-picture processing and integrates video processing functions for noise reduction, sharpness, dynamic contrast, and color control. Dual motion adaptive per pixel de-interlacing and 3D comb filters produce side-by-side displays of interlaced video. SoC includes direct PC input support with auto phase and mode detection.

Linear Technology Corp.    Milpitas, CA 95035
Dec 20, 2006 Adding only 50 mV logic low offset voltage between input and output, which enables multiple buffer cascading, LTC4307 suits AdvancedTCA and µTCA-based servers and networking equipment. Unit features recovery circuitry to detect and clear stuck busses, and provides capacitive isolation between backplane and I2C busses even if power supplies are at different levels. Device prevents SDA and SCL corruption during live board insertion and removal from backplane.

Vishay Intertechnology, Inc.    Malvern, PA 19355 2143
Dec 20, 2006 Noninductive, noncapacitive Z201 utilizes Z-Foil technology, combining ambient temperature variations (TCR) of ±0.05 ppm/°C (0 to +60°C) and applied power changes (PCR) of ±5 ppm at rated power with ESD rating above 25,000 V. Featuring rise time of 1.0 ns without ringing, resistor offers load-life stability of ±0.005%, resistance range of 10 W to 100 kW, and power rating of 0.3 W at 125°C. Current noise is under -40 dB and thermal EMF is 0.1 V °C max (0.05 typ).

Agere Systems    Allentown, PA 18109-3286
Dec 20, 2006 Consisting of silicon chips, software, and development kit, TrueNTRY(TM) X122 enables variety of capabilities for entry-level phones, including CD-quality music, camera/camcorder functions, and Internet access. By providing dedicated applications processor separate from communications engine, X122 boosts overall processing speed. Platform supports advanced audio processing including dynamic noise suppression, echo cancellation, and full-duplex speakerphone.

Optima Electronic Packaging Systems    Lawrenceville, GA 30043
Dec 19, 2006 Featuring modular design with stacked arrangement of open card cages, fan trays, and heat exchangers, MicroTCA 19 in. Cabinet is designed according to ETSI 300-119-3 with 44 U x 750 mm x 300 mm dimensions. It accommodates 10 MicroTCA single-width subracks, accepting 120 full-size modules or 240 compact modules plus power modules dissipating total of 6 kW in closed loop heat exchanger concept. Typical shelf temperature rise is 15°C while heat exchangers provide temperature drop of 15°C.

Aries Electronics, Inc.    Bristol, PA 19007-6810
Dec 19, 2006 Featuring 1-20 pin PLCC clock chip on top and 1-16 pin DIP clock chip on bottom, Correct-A-Chip(TM) Adapter converts PLCC-packaged type clock chip to DIP footprint without changing PCB layout. Body of adapter is .062 in. thick, glass-filled IS-410 material with 1 oz of copper traces on both sides. Male pins are brass alloy 360 with 10 µin. min gold plating per MIL-G-45204 over 100 µin. min nickel plating per SAE-AMS-QQ-N-290. Socket version pins are phosphor bronze alloy per QQ-V-750.

Fairchild Semiconductor Corp.    South Portland, ME 04106
Dec 19, 2006 Measuring 0.55 x 1.6 x 2.1 mm, dual-supply Micro-Pak(TM)-packaged Model FXL2TD245 is configurable for uni-directional and independent bi-directional voltage translation between 2 logic levels. It includes built-in power-off protection and provides outputs that switch to 3-stage if either supply voltage is equal to ground. With voltage range of 1.1-3.6 V, unit is suited for cell phones, PDAs, gaming devices, and other portable applications, as well as consumer and industrial applications.

STMicroelectronics    Lexington, MA 02421
Dec 19, 2006 Offered in DPAK/IPAK and TO-220FP packages, STD11NM60N reduces conduction losses and optimizes efficiency of lighting applications by achieving RDS ON-resistance of 450 mOhm, max. Diode dv/dt capability and avalanche performance allow users to keep operating temperatures within typical working range. Built on MDmesh(TM) technology, 600 V device features energy-optimized driver circuit that enables MOSFET to drive higher currents at 2 V voltage gate threshold.

LEM Holding SA    Plan-les-Ouates CH-1228  Switzerland
Dec 19, 2006 Self-powered TT series features ferrite core material, with magnetic permeability, insensitive to aging and temperature changes. While TT 50-SD (50 A range) measures 1.43 x 1.69 x 1.24 in. and has .31 in. dia sensing aperture for non-contact measurement, TT 100-SD (100 A range) measures 1.75 x 2.00 x 1.44 in. and has .63 in. dia sensing aperture. Absolute accuracy is better than 1%, linearity is better than 0.1%, and phase shift is 1.5° ±1° between measured voltage and current.

Linear Technology Corp.    Milpitas, CA 95035
Dec 18, 2006 Designed to provide uniform LED brightness, Model LT3003 drives 3 separate strings of LEDs with 3% accurate current matching and up to 350 mA continuous current per LED string. True Color PWM Dimming(TM) enables dimming ratios up to 3,000:1 with logic level signal at PWM pin for all modes without need of external level shifting circuitry. Housed in 10-lead, thermally enhanced, MSOP-10 package, unit features input voltage of 3-40 V, and can operate in boost, buck, and buck-boost modes.

TE Connectivity Ltd.    Berwyn, PA 19312
Dec 18, 2006 Based upon .250 x .032 FASTON tabs and built on 5 mm centerlines per European RAST 5 standard, FASTON RAST 5 Headers are fully shrouded and available with 2-8 contact positions. Tabs are tin-plated or sliver-plated brass and shroud housing is UL 94 V-0. Available in vertical and right angle configurations, headers are press-fit into PCB before soldering. Units mate with any RAST 5-compliant female receptacle or individual quick connects of appropriate position and size.

QUALCOMM, Inc.    San Diego, CA 92121
Dec 18, 2006 Offering backward compatibility to 802.11 a/b/g and Draft 1.0 of 802.11n, Model AGN400(TM) enables development of PC OEM products that connect with all devices supporting any form of 802.11 standards. Featuring True MIMO Gen-N technology, chipset also supports interface buses for OEM products in retail, PC OEM, enterprise, consumer electronics, and service provider market segments.

Quickfilter Technologies, Inc.    Allen, TX 75002
Dec 18, 2006 Designed as plug-in target board for TI eZ430-F2013 MSP430 USB Stick Development Tool, MSP-Mojo enables implementation of digital filtering through embedded QF1D512 SavFIRe(TM) single-channel chip. By connecting to MSP430-eZ430, designers can use existing development tools, download code, and verify system-level performance. It features MSP430F2013 MCU, input jack, and expansion header for connection to target system, application breadboard, or QF1D512-DK Development Kit.