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(Showing headlines 2181 - 2200)   << 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 ...
Fixed Frequency Synthesizer features low phase noise.

Fixed Frequency Synthesizer features low phase noise.

Z-Communications, Inc.    San Diego, CA 92126
Apr 08, 2010 Operating at 1,770 MHz, Model SFS1770A-LF features typical phase noise of -95 dBc/Hz at 10 kHz offset and typical sideband spurs of -70 dBc. Unit delivers output power of 6 dBm with VCO supply of 5 Vdc while drawing 35 mA, and phase locked loop voltage of 3 Vdc while drawing 9 mA over temperature range of -40 to 85°C. Housed in PLL-V12N package measuring 0.60 x 0.60 x 0.13 in., RoHS-compliant device features typical 2nd harmonic suppression of -15 dBc.

Fixed Frequency Synthesizer operates at 2,030 MHz.

Fixed Frequency Synthesizer operates at 2,030 MHz.

Z-Communications, Inc.    San Diego, CA 92126
Apr 08, 2010 Suited for fixed wireless and microwave radio applications, Model SFS2030A-LF features typical phase noise of -95 dBc/Hz at 10 kHz offset and typical sideband spurs of -70 dBc. Unit delivers output power of 6 dBm with VCO supply of 5 Vdc while drawing 35 mA, and phase locked loop voltage of 3 Vdc while drawing 9 mA over temperature range of -40 to 85°C. Housed in PLL-V12N package measuring 0.60 x 0.60 x 0.13 in., RoHS-compliant device features typical 2nd harmonic suppression of -20 dBc.

SMT Multilayer Ceramic Capacitors meet JEITA RCX-2326 standard.

Murata Electronics North America, Inc.    Smyrna, GA 30080
Apr 08, 2010 With design that ensures capacitance of 100 µF under actual operating conditions, GW series is available in 3 options: 2.0 x 4.0 x 1.8 mm length width (LW) reverse 2-terminal construction, 4.0 x 2.0 x 1.5 mm 3-terminal construction, and 3.2 x 2.5 x 1.8 mm 2-terminal construction. Capacitance, impedance, and component count suits decoupling capacitor applications in power supply circuits of low-voltage driven devices, ICs, CPUs, large scale integration (LSI), and FPGAs.

Motherboard Chipset provides HD computing experience.

Advanced Micro Devices, Inc.    Sunnyvale, CA 94085
Apr 08, 2010 Serving as Foundation for 2010 Client Platforms, AMD 890GX Chipset features ATI Radeon(TM) HD 4290 Graphics, which are designed to decode and play back Blu-ray(TM) and other HD content with support for MPEG2, VC-1, and H.264 formats. Support for SATA 3.0 Gbps hard drive interface helps speed application performance and access to information, HD video, and photos. Chipset also includes support for Gigabit Ethernet, HyperTransport(TM) 3.0 technology, and PCI Express® Generation 2.0.

Timing Devices extend battery life for portable electronics.

Integrated Device Technology, Inc.    Santa Clara, CA 95054
Apr 08, 2010 VersaClock® LP programmable clock generators reduce power consumption and optimize board layout in battery-operated consumer applications. They reduce power requirement to 4-8 mW for single clock output and also reduce power usage during power down (20 µW) and sleep mode with 32 kHz clock active (200 µW). Each of 5 models features 4 internal PLLs, individually programmable and able to generate 4 unique frequencies from 5 kHz to 120 MHz.

8-Bit Microcontrollers operate up to 150°C with no limitations.

Infineon Technologies AG Dep. CIC MC      Germany
Apr 08, 2010 Based on 8051 processor core, 8-bit XC800 150°C Microcontrollers integrate 4-32 KB flash memory, oscillator, voltage regulator, EEPROM, and supervisory circuits. Various peripherals include Capture/Compare Unit for PWM generation, ADC for measurement and hardware synchronization to PWM, and MultiCAN modules with up to 2 CAN nodes. Tested in accordance with AEC-Q100 Grade 0, MCUs are suited for automotive applications in engine compartment and industrial solutions in harsh environments.

LED Driver IC supports dimming for residential applications.

Infineon Technologies AG Dep. CIC MC      Germany
Apr 08, 2010 Supporting 40/60/100 W incandescent bulb replacement, Model ICL8001G enables up to 90% efficiency and achieves power factor exceeding 98%. Off-line driver IC features integrated power factor correction and operates with many phase cut dimmers, maintaining greater than 80% efficiency over complete dimming range. Other features include isolated driver output for thermal management, digital soft-start, and integrated start-up cell for instant on.

Mobile Phone Platform supports dual-SIM technology.

Infineon Technologies AG Dep. CIC MC      Germany
Apr 08, 2010 Based on X-GOLD(TM) 213 EDGE baseband chip, XMM(TM) 2138 combines Comneon protocol stack, OptiMedia framework, and Red Arrow MMI. Platform supports touch screen, WQVGA display for mobile browsing, Bluetooth for file sharing, and WLAN for Internet access. Chip optimizes audio and video performance with integrated FM radio and computing power of ARM11 core. In addition, XMM 2138 supports both standby and active dual-SIM phones, making both SIM available on network to receive calls or messages.

MCU/Transceiver Chips offer choice of memory variants.

NEC Electronics    Santa Clara, CA 95050
Apr 08, 2010 Housed in 8 x 8 mm, 56-pin QFN package, IO-Link Solutions combine All Flash(TM) 78K0R 16-bit MCU and IO-Link transceiver with integrated IO-Link slave protocol stack in single chip. MCUs come in 4 flash memory sizes of 32, 64, 96, and 128 KB. By adopting IO-Link MCU/Transceiver solutions, IO-Link system designers can implement communications and control of sensors/actuators to realize IO-Link slave applications.

High-Side IPDs suit automotive lighting applications.

NEC Electronics    Santa Clara, CA 95050
Apr 08, 2010 Suited for handling critical vehicle loads, intelligent power devices (IPDs) combine embedded power MOSFET for switching and control chip for protection features in one 5-pin TO-252 package. Model µPD166017, with on-state resistance of 6 mX, can drive high-current lamps and heating elements and has analog current sense coupled to diagnostic function. While µPD166019 exhibits reduced parasitic noises, optimized drive performance of µPD166020/21 minimizes PWM losses.

Liquid Level Switch suits hard-to-reach, hazardous areas.

Liquid Level Switch suits hard-to-reach, hazardous areas.

Emerson Process Management    Austin, TX 78754
Apr 07, 2010 Rosemount® 2160 vibrating fork liquid level switch is unaffected by flow, bubbles, turbulence, foam, vibration, solids content, coating, liquid properties, and product variations. Operating in temperatures from -94° to +500°F, product wirelessly communicates switch output state, diagnostics, and PlantWeb alerts and operates in WirelessHART mesh network. For optimal mounting, unit installs horizontally or vertically and features omnidirectional aerial and rotatable housing.

Voltage Reference Circuit operates with less than 1 µA.

Voltage Reference Circuit operates with less than 1 µA.

Linear Technology Corp.    Milpitas, CA 95035
Apr 07, 2010 Operating on 850 nA of supply current with output drive capability of 5 mA, Model LT6656 has initial error of less than 0.05% and guaranteed temperature drift of less than 10 ppm/şC. Bipolar device can withstand reverse battery conditions, accept input voltages up to 18 V, and operate from voltages as low as 3 mV above output voltage. Housed in ThinSOT(TM) package, IC is specified for operation from -40 to 85°C and is suitable for portable, wireless, and remote devices.

Miniature Charge Amplifiers are used with piezoelectric transducers.

Miniature Charge Amplifiers are used with piezoelectric transducers.

Columbia Research Labs., Inc.    Woodlyn, PA 19094
Apr 07, 2010 Housed in aluminum case measuring 1.575 x 1 x 1 in. and weighing 50 g, Series 5820 charge amplifiers are suited for use with all piezoelectric transducers to form various airborne vibration and shock data acquisition systems. Units are available in 7 standard charge conversion ranges, each offering a 10.1 tandem gain adjustment capability. Models provide dual signal outputs, one biased around +2.50 Vdc and one unbiased capacitance coupled.

Metal Cored Electrode suits high-temperature piping systems.

Metal Cored Electrode suits high-temperature piping systems.

Select-Arc, Inc.    Fort Loramie, OH 45845-0259
Apr 07, 2010 Available in 0.045 and 1/16 in. dia, SelectAlloy 16-8-2-C is designed for welding 16-8-2, 316, and 347 grades of stainless steel in high temperature piping systems. It is composed of 15.5% chromium, 8.5% nickel, and 1.5% molybdenum and operates with smooth, spray arc transfer, producing no spatter. Due to its ductility properties, wire is suited for welding cat crackers, furnace parts, and components used in petrochemical, chemical processing, and power generation industries.

PCB Connector eliminates need for board-to-board connectors.

PCB Connector eliminates need for board-to-board connectors.

ITT Interconnect Solutions    Santa Ana, CA 92705
Apr 06, 2010 Providing direct interface into box, APD Direct PCB Connector is connected to PCB internally, rather than with crimped cable connection. Plastic connector is sealed to IP67 and IP69K specifications for protection against dust and temporary immersion. Available in 6, 7, 19, 37, or 51-way versions with max operating voltage of 48 V, unit is equipped with 4-way configuration for sensor applications. It has machined contacts with press-in contour and up to 4 color and mechanical codings.

Stereo Headphone Amplifier conserves portable device power.

Stereo Headphone Amplifier conserves portable device power.

STMicroelectronics    Lexington, MA 02421
Apr 06, 2010 While connected to 2 supplies, TS4621 Class-G amplifier IC draws power from higher-voltage rail only and specifically for periods when peak audio power levels are required. It is supplied in 1.65 x 1.65 mm CSP that enables positioning near headphone connector for optimal audio performance. While switch-on/switch-off circuitry eliminates pop and click noise, I˛C interface enables digital volume control from -60 to +4 dB. IC draws 2.1 mA/channel active current at 100 µW audio output.

HDMI Companion Chip targets controllers in portable devices.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Apr 06, 2010 Available in WCSP package measuring 1.6 x 2.8 mm with 0.4 mm pitch, Model TPD12S015 incorporates 8 low-capacitance ESD clamps, I2C level shifters, and DC/DC converter. Internal boost converter generates 5 V from 2.3-5.5 V battery voltage, eliminating need for on-board supply, while matched HDMI Class-C pin-mapping eliminates board design layout skew. Unit allows HDMI 1.3 data rates and provides IEC61000-4-2, Level 4 ESD protection.

Pushbutton Controller Chips suit battery-powered products.

STMicroelectronics    Lexington, MA 02421
Apr 06, 2010 Model STM6600 and STM6601 smart pushbutton on/off controller chips block device power-up if battery is excessively discharged. Chips can also prevent power-up if fault is detected in power supply. Connecting directly to power button, ICs use smart-reset, which requires 2 pushbuttons to be held down for minimum period before reset occurs, eliminating need to hide reset button. Units have active power consumption of 6 µA and zero-power shut-down mode consuming less than 1 µA.

Single-Chip STB IC suits entry-level cable zapping boxes.

STMicroelectronics    Lexington, MA 02421
Apr 06, 2010 Supplied in 15 x 15 mm package, STi5197L fosters accelerated development of entry-level cable TV zapper STBs intended for Chinese and Asian markets. IC demodulates, decodes, and processes cable signals and also offers USB and Ethernet interfaces. Support for DVB-C, including ITU-T J83 Annexes A/B/C, as well as all smart-card-based security systems is standard, and integrated audio subsystem provides digital and analog outputs as well as support for MP3 and Dolby Digital 5.1 decoding.

Vector Signal Generator tests base station receivers in real-time.

Rohde & Schwarz GmbH & Co      Germany
Apr 06, 2010 Equipped with SMU-K69 closed-loop BS test option, Model SMU200A supports real-time processing of feedback information in LTE base station receiver tests. Option enables signal generator to process Hybrid Automatic Repeat Request feedback as well as uplink timing adjustment commands from base station, then adapt LTE signal dynamically in line with 3GPP TS 36.141 test specification.




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