Interstate Specialty Products    Sutton, MA 01590
Mar 17, 2011 With tolerances to ±0.005 in., depending upon material, Rotary Die Cut Parts can be kiss cut, provided with zoned adhesives, adhesive lamination, multiple laminations, and other custom requirements. Products are supplied on rolls for machine or manual application processes and come in wide range of rigid, flexible, and foam materials. Produced in mid- to high-production volumes, parts typically include gaskets, seals, conductors, insulators, EMI/RFI shields, filters, and membranes.

Bud Industries, Inc.    Willoughby, OH 44094
Feb 24, 2011 Featuring double-channel sealing system that results in IP67 protection, die cast ANS Series uses continuous EMI/RFI gasket around entire perimeter of box and second gasket, made of one-piece silicone, that seals out dust and moisture. Screws outside sealing area ensure uniformly tight seal, while manufacture from No. ADC-12 aluminum using 0.098 in. thick wall construction provides strength and rigidity. Available sizes (18) range from 2.83 x 2.64 x 1.53 in. to 9.45 x 6.30 x 3.35 in.

Elma Electronic Inc.    Fremont, CA 94538
Dec 13, 2010 Available in 51 sizes with 2U-7U profiles and widths of 42, 63, and 84 HP, Type 15 StyleBox offers recessed front-card mounting, which helps EMC by allowing solid or perforated panel to fully enclose plug-in boards. Extra space in front of box also protects electrical or optical connectors. With push-on extrusions, enclosure enables installation of PCBs, panels, and hardware. Modular unit allows Eurocard-based mounting for VME, VME64x, or CompactPCI architectures.

Laird Technologies    Chesterfield, MO 63017
Nov 16, 2010 Incorporating functionality of 2-piece shield without need for separate frame and cover, ReCovr(TM) features locking mechanism that allows for removal of shield cover when access to board-level components is required. Unit includes rigid corner board-level shield technology, which aids in part and PCB firmness. Rated to survive standard drop, shock, and no-rattle tests, shield is available with ventilation holes, side cutouts, embossing, and marking.

Laird Technologies    Chesterfield, MO 63017
Sep 20, 2010 Designed to resist solder joint fracture, Board-Level Shield comes in single-piece, 2-piece, and multi-compartmental models. Elimination of drawn flange minimizes space needed on PCB for shielding trace width by potentially ~0.3 mm. Partially drawn corner is located near top portion of shield, resulting in torsional rigidity with no drawn lip and no draft. For parts over 2 mm, corner is both drawn and formed with interlocking multi-radius corner, providing optimum EMI shielding.

Elma Electronic Inc.    Fremont, CA 94538
Jul 23, 2010 Featuring stacked formation with 38U on bottom and 12U on top, Mobile Cabinet Enclosure is designed with double-walled extrusions, reinforced corner members, cross-bracing, and stiffeners to handle rugged applications. Unit is equipped with EMC shielding and has passed MIL-STD-810F for shock and vibration. Enclosure is also designed and tested to withstand earthquake Seismic Zone 4 event as defined in GR-63-CORE without displaying any permanent set or deformation.

ICS Electronics Corp.    Pleasanton, CA 94588
Jul 06, 2010 Designed for 96- and 160-pin connectors, C-size VXI4 Module Shield Kits have clam shell type design that surrounds PCB with RFI-proof shields. Kits include circuit side and component side shields, blank front panel with ejectors, and necessary hardware to assemble VXI module. Modules feature side air slots that provide for cooling while limiting RFI emissions to 2 GHz and kits are available in single-slot as well as dual- and triple-slot wide versions.

Dontech, Inc.    Doylestown, PA 18901
Jun 03, 2010 Optical Fine Wire (OFW) conductive optical grids are constructed of woven and conductively plated, fine-wire stainless steel and copper, while MEM100 series Micro EMI-Mesh grids are designed with etched and blackened copper. Both provide EMI/RFI shielding of electronic displays, instrumentation, and enclosures. They are typically embedded in glass or plastic substrates such as acrylic, polycarbonate or polyester, or triacetate. Grid counts typically range from 50-255 openings/in.

Dwyer Instruments, Inc.    Michigan City, IN 46361
May 19, 2010 Designed to protect outside air humidity transmitters from rain and radiated heat, RHRS Radiation Shield features integral pipe mounting bracket for ¾ to 1 ½ in. iron pipe, which can be removed for surface mounting applications. Curved shape and color of plates enables airflow to move across sensor to keep radiated temperatures from rooftops and surrounding surfaces from affecting humidity readings.

Photofabrication Engineering Inc.    Milford, MA 01757
Feb 10, 2010 Designed to protect components from radio frequency/electromagnetic interference and environmental hazards, EMI/RF shields also provide electrical grounding. Standard forming tools are available to create covers that attach onto fence yet can be removed and replaced. Shielding options for circuit board applications include 1- or 2-piece construction and choice of brass, tin, tin-lead, nickel, copper, and cold-rolled steel base materials, all of which can be provided with solderable plating.

Autosplice    San Diego, CA 92121
Jul 07, 2009 Manufactured to ultra thin dimensions, ChipShield® provides EMI/RFI shielding during manufacturing of chip packages and can replace existing technology with little to no change to existing chip fab process. It is offered in tape and reel and can be adapted to most pick and place equipment for installation directly onto chip. Custom configurations can be created to meet requirements for rapidly changing products.

Select Fabricators, Inc.    Canandaigua, NY 14424
May 14, 2009 Designed to end-user requirements, EMI shielding curtains are made of flexible, conductive, Copper/Nickel/Silver fabric and can be permanently or temporarily affixed using easy-open curtain track, conductive hook and loop, and/or grommets. Effectiveness for single-layer curtain is rated at or above 60 dB attenuation from 14 MHz to 10 GHz. For double-layer curtains, range is at or above 70 dB attenuation from 1 MHz to 10 GHz and at or above 90 dB attenuation from 26 MHz to 10 GHz.

Pulse Engineering, Inc.    San Diego, CA 92128
Mar 04, 2009 Designed for use in high-end Ethernet networking equipment, SFP032-L SFP cage can handle data transmission speeds up to 5 Gb, and withstand temperatures of -40 to +85°C. Measuring 25.5 x 63.25 x 114.25 mm, SFP Transceiver MultiSource Agreement (MSA) standard product has two-piece structure to prevent deforming during press fitting. Compatible with a wide variety of commercial transceivers, RoHS compliant unit has holes to allow air circulation and heat transfer.

Bulgin Components PLc    Barking Essex IG11 0AZ  United Kingdom
Feb 23, 2009 For complete EMI shielding, Ethernet Buccaneer Connector System uses PX0888 metal backshell, which fits around connector to provide 360° bond to panel, closing any potential EMI/RFI windows. Screening can fixes to rear of panel using existing connector panel nut, and cover provides continuity between connector screen and can. Since accessory maintains screening directly to panel, it eliminates potential EMC issues when using plastic connector in electrically noisy environments.

3M Co., Electronic Products Div.    Austin, TX 78726
Jan 06, 2009 Suited for smart cards, e-passports, ID cards, banking/credit cards, and transportation cards, 3M ToughShield Protective Sleeves block radio frequencies to help eleiminate data theft or skimming. Inner copper-coated conductive polyester layer is bonded to outside layer of 3M TufQUIN inorganic hybrid insulating paper. This material is tear- and water-resistant and also withstands wear. After 2,000 cycles of abrasion resistance testing, it retains 99% of its shielding effectiveness.

Laird Technologies    Chesterfield, MO 63017
Nov 26, 2008 Featuring monolithic assembly and 0.6 x 0.3 x 0.3 mm dimensions, LI0201 series offers impedance versus frequency characteristics with minimal DCR for EMI noise suppression on high-frequency or broadband digital signal lines. Design conserves mounting space, making beads suited for dense, compact circuit board construction in portable/handheld electronic devices. They can be placed close to EMI source or receptor of external interface or internal signal interconnection.

Elma Electronic Inc.    Fremont, CA 94538
Aug 25, 2008 Supplied in 1U height and 240 mm or 360 mm depth, SlimKit 19 in. EMC Enclosure provides EMC performance without separate gaskets. Covers of chassis have EMC tabs that provide protection, while sidewalls have punched and formed EMC spoons that provide extra EMI/RFI suppression. As enclosure has EMC built into sheet metal, fewer screws are required.

Altech Corp.    Flemington, NJ 08822
Aug 04, 2008 Rated up to IP65, small- to medium-size enclosures protect control and measuring equipment against dust, water, and corrosion in harsh operating environments. TK Series includes 13 enclosures in several cover heights with overall sizes ranging from 50 x 52 to 360 x 254 mm, Series has gray/tinted transparent covers, low base, and multiple fixing points. With overall sizes ranging from 130 x 94 to 361 x 254 mm, EK Series houses IEC components, such as DIN rail mount circuit breakers.

Bud Industries, Inc.    Willoughby, OH 44094
Jun 26, 2008 Manufactured from ADC-12 die-cast aluminum alloy, ANS Series boxes feature 0.098 in. thick walls for use in heavy-duty applications. They include dual-channel gasketing, with 1-piece molded outer silicone gasket for sealing and second gasket made of wire-mesh with sponge rubber. Captive cover assembly screws are located outside sealing area. Boxes have recessed area on cover surface available in natural finish or smooth black powder-coat finish.

RF Micro Devices, Inc.    Greensboro, NC 27409-9421
Feb 14, 2008 Able to reduce height and volume requirements for RF sections, MicroShield(TM) Integrated RF Shielding reduces emissions related to EMI and RFI while minimizing susceptibility to external fields. It can integrate RF shielding directly into RFIC or module, while integral board placement insensitivity enables handset manufacturers to place complex RF modules in plug-and-play fashion that is adaptable to board design and layout changes.