Electron Beam Source

Machinery & Machining Tools, Electrical Equipment & Systems, Laboratory and Research Supplies & Equipment

Ion Beam Milling System is offered with VCT docking port.

December 2, 2014

Leica EM TIC 3X is available with docking port that enables transfer at vacuum/cryo conditions with Leica EM VCT100 system. Room-temperature or cryo sections can be taken up directly from ion beam milling system, loaded into vacuum cryo transfer (VCT) system, and transferred to next preparation step. System provides users with surface preparation of hard, soft, porous, heat-sensitive, brittle and/or heterogeneous material for microstructure analysis by means of SEM and AFM. Read More

Electrical Equipment & Systems

Power Supplies serve electron-beam coating applications.

April 8, 2014

Comprising 3, 6, and 12 kW variants, rack-mount EVA Series thin film deposition power supplies are tolerant to transient and continuous arcing and utilize rugged IGBT Switch Mode design to limit stored energy and provide optimal regulation and ripple specifications. Arc intervention parameters can be optimized via GUI; adjustable values include arc quench, re-ramp, count, and arc rate limiters. Separate 1U rack-mount filament power controller and external filament transformer are optional.
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Electrical Equipment & Systems, Communication Systems & Equipment, Services

Ion Implanters are suited for advanced 3D devices.

February 18, 2014

Purion M™ mid current implanter, Purion H™ high current implanter, and Purion XE™ high energy implanter are designed for advanced 3D devices. Systems include Purion Contamination Shield™ for lowest particles, undetectable metals, and no energy contamination; Purion Vector™ Dose and Angle Control system for precise and repeatable dopant placement; as well as Purion 500wph endstation cross-platform architecture that promotes productivity and manufacturing flexibility. Read More

Electrical Equipment & Systems, Laboratory and Research Supplies & Equipment

High Current Implanter delivers precise dopant placement.

December 10, 2013

Supporting manufacture of sub 16 nm planar and 3-D devices, Purion H Single Wafer Implanter features scanned spot beam technology with precision implant angle and dose control to optimize device performance and yield. Process control technology minimizes all forms of contaminants to ensure absolute beam purity. Cross-platform architecture is designed to drive manufacturing flexibility and lower total cost of fab operations. Read More

Machinery & Machining Tools, Electrical Equipment & Systems, Waste Handling Equipment

Sterilizing System utilizes electron beam.

November 14, 2013

Suitable for sterilizing sensitive materials and complex products, SmartDose™ provides controls for simultaneous variable dose distribution, simultaneous dual beam redundancy, uninterrupted temperature controls, and intelligent tooling. Applications include allograft tissue, biomaterials, advanced polymers, drugs/biologics, and hydrogels as well as Teflon, implantables, bioabsorbables, bioresorbables, and combination devices. Read More

Electrical Equipment & Systems, Mechanical Power Transmission, Laboratory and Research Supplies & Equipment

Single Wafer High Energy Implanter offers precision, throughput.

May 9, 2013

Incorporating single wafer LINAC technology, Purion XE ion implanter enables high-yield manufacture of sub-16 nm planar and 3D devices. System incorporates 500+ wafers/hr end station and advanced filtration systems. Latter optimize beam purity, while angle control system and constant focal length scanning deliver precise and repeatable dopant placement. Scanned spot beam architecture enables control of damage engineering as well as other advanced processes. Read More

Electrical Equipment & Systems, Test & Measuring Instruments

Plasma Focused Ion Beam System targets advanced IC packaging.

June 15, 2011

Vion(TM) plasma focused ion beam system is used in advanced integrated circuit (IC) packaging applications that use larger scale structures to connect multiple chips in tightly integrated packages. System quickly delivers site-specific cross-sectional analysis to accelerate failure analysis of bumps, wire bonds, through silicon vias (TSVs), and stacked die; as well as site specific removal of package and other materials to enable failure analysis and fault isolation on buried die. Read More

Test & Measuring Instruments, Optics & Photonics, Laboratory and Research Supplies & Equipment, Electrical Equipment & Systems

Field Emission Electron Probe Microanalyzer has high resolution.

May 24, 2011

Intended for range of micro and nanoanalytical applications, SXFiveFE offers full automation for long-term unattended operation and features combination of field emission electron column and CAMECA spectrometers. Field emission source and electron column result in versatile microanalyzer with capabilities for quantitative microanalysis and x-ray imaging at sub-micron spatial resolution. Configurations include SXFive with W and LaB6 sources and SXFiveFE with FE source. Read More