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Computer Hardware & Peripherals -> Computer Boards & Cards -> Telephony Boards

Telephony Boards

(Showing headlines 1 - 20)   more ....

Advanced Mezzanine Card suits wireless front end systems.

CommAgility Limited    Leicestershire LE11 3EH  Uruguay
Jul 22, 2014 Based around Xilinx Virtex-7 FPGA, AMC-V7 is suited for LTE wireless front-end systems requiring multiple 10G CPRI links at up to rate option 8. IDT CPS-1848 Serial RapidIO Gen 2 switch supports SRIO V2.1 at up to 20 Gbps per port, while 3 front panel SFP+ optical interfaces provide flexible high-speed links, and are configurable as CPRI, OBSAI, GigE, SRIO, or other standards. In addition, optional SRIO mini-SAS connector provides high-speed cabled connectivity.

Unified Communications System targets small businesses.

Vertical Communications Inc.    Cambridge, MA 02142
Jul 14, 2014 Scalable from 5 to 140 users, Vertical Summit™ Communications System can be networked to accommodate up to 250 locations. Built-in Summit Communicator mobility application extends premise-based communications capabilities to iOS and Android devices through SIP-based softphone, enabling users to talk, text, chat, and broadcast messages from anywhere. Streamlining call handling and routing, IP Attendant for Office simplifies call control by visually displaying all call, user, and network statuses.

Cloud-Based Telephony Software offers diverse TTS capabilities.

Aculab    Milton Keynes MK1 1PT  United Kingdom
Jun 03, 2014 Aculab Cloud presents programmable telephony resources and, via APIs, facilitates creation of applications that make, receive, and interact with calls. Adding to its text-to-speech (TTS) capabilities, this cloud-based platform offers third TTS engine from IVONA Software that enables additional language options for developers: US, UK, Austrian, and Indian English; Danish; Dutch; French; Canadian French; German; Icelandic; Italian; Polish; Brazilian Portuguese; Portuguese.

COM Express Mini Module features quad-core processor.

COM Express Mini Module features quad-core processor.

Arbor Technology    San Jose, CA 95125-1039
Apr 08, 2014 Measuring 55 x 84 mm, EmNANO-i2300 Type 10 Module comes in 4 Intel Atom-based versions, ranging from 1.33 GHz dual core E3825 with 6 W power consumption, up to 1.91 GHz quad-core E3845 with 10 W max power consumption. Module can support TMDS (HDMI/DVI) or DisplayPort at DDI interface as well as 24-bit LVDS channel. Providing up to 4 GB of fast DDR3L onboard memory, module includes 8 USB 2.0 ports, 1 USB 3.0 SuperSpeed port, three 5 Gbps PCI Express 2.0 lanes, and two 3 Gbps SATA interfaces.

FPGA Mezzanine Carriers feature AMC form factor.

FPGA Mezzanine Carriers feature AMC form factor.

VadaTech    Henderson, NV 89052
Apr 07, 2014 Supplied in single width size, FPGA Mezzanine Carriers come in versions that include Virtex®-5, Virtex®-6, Artix®-7, Kintex®-7, Virtex®-7 FPGAs and Zynq® All Programmable SoCs. Modules allow any VITA-57 compliant FMC mezzanines to be plugged in, providing variety of I/O options. Carriers include DDR3 memory, allowing large buffer sizes and queuing during processing. To eliminate potential single-point-of-failure in system, Virtex and Kintex versions have optional local processors.

OpenVPX and XMC Modules feature Freescale processors.

OpenVPX and XMC Modules feature Freescale processors.

Extreme Engineering Solutions (X-ES)    Middleton, WI 53562
Apr 02, 2014 Consisting of 3U OpenVPX™ REDI module based on Freescale QorIQ T2080 processor, XPedite5970 supports up to 8 GB of DDR3 SDRAM and provides variety of I/O options to backplane, including 10 Gigabit Ethernet, Gen3 PCIe, and Gen2 SRIO. Conduction-cooled XPedite6101 XMC/PrPMC module is based on Freescale QorIQ T2081, T1042, or T1022 processor. It provides up to 8 GB of DDR3 ECC SDRAM, Gen2 PCI Express interface to P15, as well as dual Gigabit Ethernet, USB 2.0, and SATA 3.0 Gb/s interfaces to P16.

COM Express CPU Module incorporates AMD G-Series SoC.

COM Express CPU Module incorporates AMD G-Series SoC.

ARBOR Technology Corp.    New Taipei City 235  Taiwan
Mar 17, 2014 Based on 1.0 GHz AMD GX-210HA dual core SoC with 9 W TDP, EmNANO-a56M0 Mini Type 10 CPU Module is suited for medical equipment, security and surveillance, gaming, digital signage, and 3D display. Board includes Radeon HD 8210 GPU and 2 GB DDR3L SDRAM as well as single channel 18-bit LVDS and DDI interfaces. Measuring 55 x 84 mm, module also incorporates Gigabit Ethernet controller, plus 8 USB 2.0 ports, 3 PCIe x1 lanes, and 2 SATA ports.

IP Communicator reduces security monitoring, service expense.

IP Communicator reduces security monitoring, service expense.

Honeywell    Detroit, MI 48209
Feb 19, 2014 Able to eliminate need for phone lines, MIP-2 and MIP-2UD allow security/burglar alarm panels to be monitored primarily over IP (Internet Protocol) with option to add phone line for backup. Seamless connection to security panel dialer ports enables communicators to report alarm information from any system that utilizes Contact ID protocol; reconfiguration of security panel is not required. Using upload/download capabilities of MIP-2UD, dealers can access system information remotely.

Hybrid VoIP/PTSN System maximizes uptime via built-in redundancy.

Xorcom USA    Phoenix, AZ 85027
Feb 10, 2014 As stand-alone, pre-configured, out-of-the-box IP-PBX featuring CompletePBX™ distribution, Blue Steel features hot-swappable server-grade HDDs, hot-swappable 250 W power supplies, and built-in power for up to 4 Astribanks. System supports various combinations of telephony ports, internally and via Astribank units connected via USB2: up to 960 PSTN/analog phones ports, up to 16 E1 R2/T1 CAS PRI ports, up to 1,000 users, and up to 550 concurrent SIP calls.

Communications Module targets underground grid architectures.

Ambient Corp.    Newton, MA 02459
Feb 06, 2014 Supporting multiple protocols such as DNP3 as well as local data aggregation, local applications, and control, Ambient Smart Grid® Nodes provide connectivity to remote devices such as meters or demand response equipment. Optional Powerline Communications Module is used to optimize automation and communication on downtown underground grid architectures that pose challenge to wireless communication. PLC facilitates secure, high-speed communication over existing low and medium voltage grid.

XMC/PMC Module features 12 CAN bus channels.

XMC/PMC Module features 12 CAN bus channels.

Extreme Engineering Solutions (X-ES)    Middleton, WI 53562
Nov 11, 2013 Available as conduction- or air-cooled, XPort9200 provides 12 isolated CAN bus 2.0A and 2.0B-compliant channels that support speeds up to 1 Mbps. When configured as XMC, unit supports VITA 42.3-compliant x1 PCIe interface through XMC P15 connector and routes all 12 CAN bus channels to XMC P16 connector. When configured as PMC, XPort9200 supports 32-bit PCI interface through PMC P11 and P12 connectors and routes all 12 CAN bus channels to PMC P14 connector.

COM Express Module supports 4th Gen Intel® Core(TM) processors.

congatec AG    Deggendorf   Germany
Sep 05, 2013 Featuring max thermal design power of 15 W, conga-TC87 Type 6 COM Express Module can be equipped with embedded dual-core single-chip processors: Intel Core i7-4650U, i3-i5-4300U, or i3-4010U. Module supports dual-channel DDR3L memory up to 16 GB, as well as Intel® flexible display interface, DirectX 11.1, OpenGL 4, OpenCL 1.2, and flexible hardware decoding. conga-TC87 provides 8 USB ports, 4 PCI Express 2.0 lanes, 4 SATA ports with up to 6 Gbps, RAID support, and Gigabit Ethernet interface.

Boards and Modules support 4th Gen Intel® Core(TM) processors.

Boards and Modules support 4th Gen Intel® Core(TM) processors.

Kontron Modular Computers GmbH      Germany
Jun 12, 2013 Based on 4th generation Intel® Core™ processors, COM Express, Mini-ITX, 6U CompactPCI, and SYMKLOUD Media cloud platforms integrate features such as Intel AVX2 instructions, which accelerate floating-point-intensive computations, and Intel AES-NI, which accelerates data encryption and decryption. Target uses include digital signal and image processing applications in medical, industrial automation, and military markets, as well as cloud-based video transcoding for content delivery networks.

COM Express Module features 4th Gen Intel Core processor.

COM Express Module features 4th Gen Intel Core processor.

American Portwell Technology    Fremont, CA 94538
Jun 06, 2013 Measuring 125 x 95 mm, PCOM-B630VG Type 6 COM Express Basic Module includes Mobile Intel® QM87 Express chipset, Intel Turbo Boost technology, Intel Hyper-Threading Technology, and Intel vPro™ Technology for remote capabilities. Unit supports up to 16 GB ECC DDR3L 1,333/1,600 MT/s DRAM on two 204-pin SODIMM sockets, and 3 independent displays: DisplayPort, HDMI or DVI, and VGA. Expansion interface supports one PCI Express x16 Gen3 at 8.0 GT/s, with 3 controllers integrated into processor.

COM Express Compact Module features quad-core processor.

congatec AG    Deggendorf   Germany
May 03, 2013 Suitable for visualization and control applications, conga-TCG is available with 4 processors from AMD Embedded G-Series SOC platform, ranging from 1.0 GHz dual-core AMD GX-210HA with 1 MB shared L2 cache and 9 W TDP to 2.0 GHz quad-core AMD GX-420CA with 2 MB shared L2 cache and 25 W TDP. Integrated AMD Radeon™ graphics feature Universal Video Decoder 4.2 for seamless processing of BluRays. Interface options include VGA, Single/Dual channel 18/24-bit LVDS, DisplayPort 1.2, and DVI/HDMI 1.4a.

Tool Changer Communications Module provides diagnostics.

Tool Changer Communications Module provides diagnostics.

Applied Robotics, Inc.    Glenville, NY 12302
Mar 26, 2013 Available for Sigma line of Tool Changers, SmartComm™ Communications Module supports many major industrial buses, including DeviceNet, Ethernet IP, Profibus, CC-Link, and Profinet. Module Diagnostics are available via webpage and advanced diagnostics are available via ARI Management Software. Customers can view, track, and download IO status, set and read Maintenance counter functions, view timing of functions, and even view and download Cycle Time statistics to pinpoint problems.

Telephony Board supports digital span monitoring.

Sangoma Technologies Corp.    Markham, ON L3R 9R6  Canada
Mar 26, 2013 Providing passive tapping of digital telephony spans, T116 16-Span Tapping Board offers platform for building call monitoring, recording, logging, fraud detection, and security applications. Board employs high-impedance circuitry to ensure that there is no disruption or degradation of communications signals on digital spans. Capable of monitoring up to 240 individual calls, Model T116 is developed for global markets that require compliance with T1, E1, or J1 standards.

Packet Processing Adapter transfers 40 Gbps across PCIE bus.

Accolade Technology    Mansfield, MA 02048
Mar 04, 2013 Featuring quad 10 GigE ports over 8 PCI Express Gen 3 lanes with 8 GB on board DDR3 DRAM buffer, ANIC-40K3 PCI Express Gen 3 Packet Capture and Application Acceleration Adapter is suited for IDS, DPI, network forensics, load balancing, and flow analysis applications. Adapter is based on Advanced Packet Processing v5.0 engine, which is implemented in FPGA, providing hash based packet classification that supports up to 48 million flows, traffic management, and de-duplication.

COM Express Modules utilize 3rd Gen Intel® Core(TM) technology.

congatec AG    Deggendorf   Germany
Mar 01, 2013 Equipped with Intel HM76 Express Chipset, conga-TS77 and conga-BS77 are available with 2.20 GHz dual-core Intel® Celeron® Processor 1020E, 1.40 GHz dual-core Intel Celeron Processor 1047UE, or 1.50 GHz single-core Intel Celeron Processor 927UE. Modules offer up to 16 GB of dual-channel DDR3 memory plus direct support for USB 3.0 and Intel Hyper-Threading Technology. Additional features include 7 PCI Express 2.0 lanes, PCI Express Graphics 3.0 x 16 lanes, 4 SATA ports, and 1 Gb Ethernet interface.

Board Support Package targets Freescale's SABRE platform.

iWave Systems Technologies Pvt, Ltd    Bangalore 76  India
Feb 21, 2013 Intended for Freescale’s SABRE platform for smart devices based on i.MX 6Quad applications processor, Windows Embedded Compact 7 BSP supports advanced multimedia and connectivity options used in consumer, industrial, and medical devices. BSP includes Multimedia framework and OpenVG/OpenGL ES for graphics processing which utilizes VPU and GPU capabilities of i.MX 6 processors. Package supports SATA 3.0 and Standard SD/SDIO for storage, Ethernet for networking, and LVDS/HDMI 1080p for display options.

(Showing headlines 1 - 20)   more ....

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