Samsung Electronics Co., Ltd.    Seoul 100-742  Korea (south)
May 24, 2012 Built on 32 nm High-k Metal Gate process technology, Exynos 4 Quad is suited for heavy-load applications such as video editing and calculation-intensive simulation. Hot-plug functionality supports on-off switching for each core, while per-core DVFS minimizes power consumption by adapting different levels of voltage and frequency when changing workloads. Measuring 12 x 12 x 1.37 mm, processor incorporates full HD 30 fps video hardware codec engine for 1080p video recording and play-back.

AMD    Sunnyvale, CA 94088
May 23, 2012 AMD Embedded G-Series Accelerated Processing Units (APUs) supports Windows Embedded Compact 7, next generation of Windows Embedded CE RTOS. This pairing optimizes delivery of feature-rich applications on small, specialized devices for industries such as medical, retail, and industrial automation. Features available with Windows Embedded Compact 7 include Silverlight for Windows Embedded, version of Internet Explorer with support for Adobe Flash 10.1, and multi-touch support.

AXIOMTEK Co., Ltd.    Taipei   Taiwan
May 04, 2012 Open Pluggable Specification (OPS)-compliant OPS870-HM, based on Mobile Intel® HM76 Express chipset, is powered by 3rd Gen Intel Core(TM) processors. Measuring 180 x 30 X 120 mm, plug-in product connects to displays via JAE TX-25 plug connector and includes HDMI, DisplayPort, UART, and USB 3.0 signals. Equipped with pluggable HDD tray and DRAM, product provides full HD content playback and dual display presentations. Ethernet (10/100/1000Mbps) port and PCIe Mini Card slot are standard.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
May 04, 2012 TLV320AIC3262 integrated audio codec features embedded miniDSP cores, providing echo and noise cancellation at wideband voice sampling rates up to 16 kHz. It integrates 5 amplifiers and 2 miniDSP cores, and gives designers ability to interface to up to 3 devices simultaneously, such as application, Bluetooth, and baseband processors. Audio and voice samples can be received, mixed and processed within codec. Device is designed for mobile phones, tablets and mobile computing devices.

Broadcom Corp.    San Jose, CA 95110
May 02, 2012 Featuring 64 custom processors running at 1 GHz, Series BCM88030 provides multi-threading and hardware acceleration for functions such as packet parsing, classification, and look-ups. Full duplex, fully programmable 100 Gbps NPU includes proprietary look-up algorithm that utilizes DDR3 DRAM for scalable MAC and IP tables. Built on XGS Core® packet processing architecture, processor integrates OA/M engine, 1588 timing and synchronous Ethernet, 10 GbE SerDes, and 1/10/40/100GbE Ethernet MACs.

LSI Logic Corp.    Milpitas, CA 95035
May 01, 2012 Designed for enterprise networking equipment such as switching and routing line cards, Axxia® AXE2502 delivers deterministic, predictable network performance by offloading complex networking tasks. Full offload architecture deals with control traffic in both traditional and software-defined networks. Combining performance of hardware accelerators with programmable flexibility of PowerPC® processors, AXE2502 accelerates control plane processing, statistics, security, and deep packet inspection.

Highland Technology, Inc.    San Francisco, CA 94103
Apr 25, 2012 With 24 isolated channels provided, V545 generalized DSP-based sinewave processor is intended for both simulation and acquisition of LVDTs, RVDTs, synchros, and resolvers. Each channel can be signal source or measurement input. Per channel features include true RMS AC measurement, frequency measurement, programmable phase shift, and phase-sensitive detector. Users can program relationship between input and output channels, allowing simulation and measurement of range of inductive transducers.

GlacialTech Inc.    Taipei   Taiwan
Apr 16, 2012 Igloo 5761 series, comprising 96 x 128 x 90 mm tower style exposed heatpipe base CPU coolers, is designed for socket types from Intel LGA775/1155/1156 and AMD FM1/AM2/AM2+/AM3/AM3+ and also provides cooling effect to components around CPU. With 30 dBA noise rating, PWM version increases/deceases fan speed, from 800 (±300 rpm) to 2,000 rpm (±10%), to match CPU load and produces 43 cfm airflow. Constant fan speed version, operating at 1,200 rpm, produces 34 cfm and is rated at 20 dBA.

GlacialTech Inc.    Taipei   Taiwan
Apr 13, 2012 Designed for reduced noise operation, CE- and UL-approved Igloo S26 Series CPU coolers also provide cooling to components around CPU. This 80 x 65 x 125 mm product, weighing 260 g, is available for various socket types, from Intel® LGA775/1155/1156 to AMD® FM1/AM2/AM2+/AM3/AM3+, and enhances CPU working hours. With rated voltage of 12 Vdc, 80 x 80 x 25 mm fan operates at up to 1,600 rpm ±10% and produces up to 26.5 cfm airflow @ 17 dBA.

RGB Spectrum    Alameda, CA 94501
Apr 11, 2012 By combining up to 4 MediaWall® units, SuperWall(TM)'s control software can create displays with up to 120 windows arranged over up to 48 screens. Parallel processing architecture can scale up as necessary, while maintaining picture quality. SuperWall offers Java-based web control interface that supports all functions of MediaWall processors including SinglePoint(TM)KvM software for controlling computers displayed on wall with single mouse and keyboard.

ADLINK Technology Inc.    Irvine, CA 92618
Apr 10, 2012 Combining 4:3 TFT LCD panel, TI® Cortex(TM) A8 processor, and touchscreen in single unit, SP-860 Smart Panel can be configured for POS, stationary display, and outdoor/ruggedized operation. System includes built-in Wi-Fi+ BT SIP module, stackable expansion capability, and 2 LAN ports. Supporting Linux 2.6.32, WinCE 6.0, and Android 2.3.4 operating systems, Model SP-860 offers 4-wire resistive touch sensor and high brightness, sunlight-readable display as options.

Analog Devices Inc    Norwood, MA 02062
Apr 09, 2012 Fostering adoption of multifunction analytics into embedded vision applications, ADSP-BF608 and ADSP-BF609 Blackfin® processors have two 500 MHz cores and up to 4.3 Mb on-chip SRAM. Integrated video analytics accelerator, Pipelined Vision Processor (PVP), is comprised of configurable processing blocks that accelerate up to 5 concurrent image algorithms. Processors are also available without PVP. Typ power consumption for BF609 is 400 mW, and all products offer on-chip peripheral options.

PESA Industries, Inc.    Huntsville, AL 35805
Apr 06, 2012 Based on E-DXE Enterprise Data Exchange Engine, 24-bit, 96 kHz DRS Series uses high-speed multiplexing technology for signal distribution. DXE frame provides all essential signal processing features, including input sample rate conversion, input gain, and phase inversion. DRS Series-C uses internal control card to support 64 mono I/O in 1 RU frame, while DRS Series-M supports four 512 x 512 I/O frames and DRS Series-E supports up to five 1,536 x 1,536 I/O frames.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Apr 06, 2012 Based on C5000(TM) ultra-low-power (ULP) DSP, Audio Capacitive Touch BoosterPack (430Boost-C55audio1) is plug-in board for MSP430(TM) LaunchPad development kit. DSP is solely controlled by MCU, allowing designers to add audio and other real-time features to their system without DSP programming experience. Solution is suited for low-power applications that use record and playback audio functions, such as MP3 players, home automation, and industrial applications.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Apr 04, 2012 Featuring combined fixed- and floating-point capabilities, TMS320C665x is based on KeyStone multicore architecture and delivers real-time performance. Products meet need of video security and traffic management, where there exists need to carry out both video processing and analytics at end point. Single-core C6655 and C6654 deliver up to 40 GMACs and 20 GLOPS and 27.2 GMACs and 13.6 GLOPS, respectively, while C6657 features two 1.25 GHz DSP cores and delivers up to 80 GMACs and 40 GFLOPs.

Siemens AG    Munich D-80333  Germany
Mar 29, 2012 Available in DC/DC/DC, AC/DC/relay, and DC/DC/relay versions, Simatic S7-1215C provides 2 Profinet interfaces, 14 digital inputs, 10 digital outputs, 2 analog inputs, and 2 analog outputs as well as fast outputs for controlling up to 4 stepper motors. Boolean execution time is 0.085 µs per operation. Suited for open-loop and closed-loop control tasks in mechanical and plant engineering, modular controller targets conveying systems, pump controls, and energy management applications.

Semaphore    Nashua, NH 03063
Mar 26, 2012 Based on 32-bit, 505 MIPS PowerPC processor, Model MS-CPU32X supports up to 20 serial ports in T-BOX MS RTU installation. Unit uses Linux core and includes 2 Ethernet ports, 2 SHDSL modems, 1 RS232, and 1 RS485 port. With resolution of 1 ms, module supports sequence-of-events recording. Information stored with millisecond resolution can be displayed in tabular and trend chart reports as well as in SCADA screens generated by Semaphore WebForm Studio software.

Kontron Modular Computers GmbH      Germany
Mar 14, 2012 Offering optimized performance on MicroTCA integrated platforms and as daughter compute-intensive module board in ATCA platforms, AM4150 comes with 2.2 GHz Freescale QorIQ P5020 CPU with 2 cores based on e5500 Power Architecture. High-speed frame managers and multiple high-speed connections, such as Serial Rapid IO (1.3/2.1) and PCIe, accommodate demanding processing requirements. To support max throughput and low latency, board provides dual-channel memory up to 8 GB ECC DDR3 RAM.

Calnetix    Cerritos, CA 90703
Mar 09, 2012 Featuring power amplifiers rated at 3,600 VA/channel, Insight(TM) 3600 provides control of advanced permanent magnet, bias magnet bearings in up to 5 axes. Sensor interface drives and demodulates up to 5 sensor coils, providing position of rotor in real-time, while DSP regulates power amplifier current to drive bearing actuators based on position sensor data. Graphical user interface enables programming, remote monitoring, and diagnostics of system.

congatec AG    Deggendorf   Germany
Mar 08, 2012 Based on cooling pipes which are integrated in standardized heatspreader of COM Express specification, Cooling System makes it possible to cool next generation processors with power dissipation of well over 35 W thermal design power (TDP). Design is available in different variants comprising passive, active, and customer-specific solutions. By eliminating mechanical stress, cooling system optimizes quality and extends life span of module.