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Computer Hardware & Peripherals -> Computer Boards & Cards -> Processors & Microcontrollers -> Processors & CPU


Processors & CPU




(Showing headlines 1 - 20)   more ....

DSP Platform targets intelligent processing markets.

Microsemi Corporation    Irvine, CA 92614
Sep 10, 2014 Supplied in single 64-pin QFN and 56-pin 3 x 3 CSP packages, Timberwolf™ DSP Platform comprises 4 MAC core, dedicated hardware accelerators, and 2 independent 16-bit DACs. Field upgradable platform, when combined with algorithmic firmware, can enable beam forming, multi-channel acoustic echo cancellation, direction of arrival and far field MIC capabilities. Product enables low-power, hands-free applications that require clear speech, free of noise and echo. 

PICMG 1.3 Full-Size CPU Card utilizes Intel Q87 chipset.

PICMG 1.3 Full-Size CPU Card utilizes Intel Q87 chipset.

IBASE Technology Inc.    Taipei   Taiwan
Sep 05, 2014 To meet medical imaging, industrial automation, network security, and digital signage application requirements, IB980 utilizes Intel® Q87 chipset to support 4th Generation 22 nm-based Intel Core™ CPUs with 3D Tri-Gate transistors and integrated Intel HD Graphics. Card also offers 2 DDR3-1600 long DIMM slots for 16 GB max system memory and offers diverse I/O support. Other features include 4x SATA III, LPT, 2x Intel PCIe Gigabit LAN, 1x Mini PCIe slot (mSATA), iAMT(9.0), and TPM(1.2).

DAQ Processor Board offers real-time computing.

DAQ Processor Board offers real-time computing.

CAS DataLoggers    Chesterland, OH 44026
Jul 18, 2014 Available for ADwin-Pro-II Data Acquisition and Control Systems, Pro-CPU-T12 Processor Module offers 1 Gb Ethernet support for high-speed data transfer, enabling standalone data recording in applications where there is no PC or connection to one. Board includes 1 GHz clock, 1 GB main memory for storing code and data, and 64-bit floating point unit for math co-processing. Additional features include trigger input, 2 digital I/Os, and ability to run C code embedded into ADbasic code.

General-Purpose Processor offers multiple peripheral options.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Jul 08, 2014 Enabling real-time processing with available quad core programmable real-time units (PRUs), Sitara™ AM437x processors are based on 1 GHz ARM® Cortex®-A9 core. PRU offloads real-time processing from ARM to manage deterministic tasks and enables such complex functions as multiple industrial fieldbus protocols. Quad core PRU-ICSS (industrial communications subsystem) connectivity peripheral enables dual, simultaneous industrial protocols as well as motor feedback protocols.

AMC Processor Board supports 100G capabilities.

AMC Processor Board supports 100G capabilities.

VadaTech    Henderson, NV 89052
Jul 07, 2014 Along with Cavium™ Octeon II CN6880 multi-core processor and Virtex-7™ FPGA, AMC738 features CFP2 front panel port that can utilize 4 x 25 Gbps lanes or 10 x 10 Gbps lanes. Board comes in double module, full size and offers several banks of DDR3 memory, Serial over LAN capabilities, and true hardware Random Number Generator. On-board SDHC socket is available for mass storage, and other front panel interfaces include dual RJ-45 and dual RS-232 ports.

Industrial DSPs serve imaging, audio, automotive applications.

Industrial DSPs serve imaging, audio, automotive applications.

Analog Devices Inc    Norwood, MA 02062
Jun 23, 2014 Delivering 800 MMACS of processing power at <100 mW, ADSP-BF70x Blackfin® processor series includes 8 models with up to 1 MB internal SRAM. Second configuration features optional DDR memory interface. For always-on safety critical applications, DSPs come in single 12 x 12 QFN or 12 x 12 BGA packages and provide data integrity with parity and ECC-protected memory circuitry. Flexibility and functionality are provided via USB, SDIO, CAN, ePPI, SPORT, and QuadSPI connectivity options.

Intelligent Box PC utilizes 4th Gen Intel® Core(TM) processor.

Intelligent Box PC utilizes 4th Gen Intel® Core(TM) processor.

American Portwell Technology    Fremont, CA 94538
Jun 20, 2014 Powered by dual-core 4th generation Intel® Core™ processor with integrated HD4400 graphics engine, Model WEBS-5481 supports 16 GB of DDR3L memory; triple display with DVI-D, HDMI, and DisplayPort; 5.1-CH audio; and dual Intel® Gigabit Ethernet ports. Unit offers variety of I/O including 2 x SATA, 2 x USB 3.0, 2 x USB 2.0, 1 x 8bits GPIO, and 6 x COM ports. With thermally enhanced ripple fin design, PC operates from -20 to 55°C in digital signage, surveillance, and image processing applications.

Small Cell SoC for APs expands network capacity and coverage.

Qualcomm    San Diego, CA 92121
Jun 19, 2014 Targeting SMB and neighborhood access points (APs), FSM90xx SoC is based on 28 nm technology and brings LTE and Wi-Fi closer together by leveraging Qualcomm® Internet Processor (IPQ). Packet processing engine scales to handle networking functions, including Wi-Fi and LTE, and hardware accelerators built into chipset boost data processing for both radio technologies. With APs based on this SoC, it is possible to expand network capacity as well as ensure optimal end-user mobile experiences.

Communications Processors foster connection between devices, car.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Jun 12, 2014 With integrated Wi-Fi®, Bluetooth®, Bluetooth low energy, and GPS/GNSS technologies, WiLink™ 8Q series delivers complete wireless connectivity experience for automotive infotainment systems via all-in-one AEC-Q100 qualified chip. Automotive-grade wireless connectivity devices work with range of infotainment processors and support advanced multimedia use cases while offering concurrent support for GPS, GLONASS, and other satellite constellations.

DAQ and Control System offers expanded storage option.

DAQ and Control System offers expanded storage option.

CAS DataLoggers    Chesterland, OH 44026
Jun 09, 2014 Available for ADwin-Pro II Data Acquisition and Control Systems, Pro-CPU-T11 processor board is suited for standalone data recording in absence of PC or PC connection. Available options give users up to 2 TB of storage space on 2.5 in. SSD or hard disc drive. Equipped with pair of SATA local hard drives, module increases speed of Ethernet communication to 1 GBps. Module also features trigger input, 2 digital I/Os, and software routines that support recording files to drive.

Digital Signal Processors suit low-power embedded applications.

Synopsys, Inc.    Mountain View, CA 94043 4033
Jun 06, 2014 Based on ARCv2DSP ISA, DesignWare® ARC® EM5D and EM7D consume as little as 7 µW/MHz on typical 40 nm LP processes for energy-efficient signal processing of voice/speech, audio, and sensor data. Cores include unified, single-cycle 32 x 32 MUL/MAC unit with 40-bit/72-bit accumulators. To deliver optimized performance for filtering, FFT, and other signal processing algorithms, devices feature fractional support with saturating arithmetic, rounding/non-rounding instructions, and divide/square root.

Image Recognition Processor suits ultra-small camera modules.

Toshiba America Electronic Components (TAEC)    Irvine, CA 92618-1811
Jun 04, 2014 Housed in 11 x 11 mm package with typical power consumption of 0.6 W, Model TMPV7502XBG features 1-channel video input interface. Device is suited for advanced driver assistance systems, which identify and recognize oncoming and surrounding vehicles and pedestrians from in-vehicle cameras. Offering accurate image detection, processor is capable of performing multiple detections simultaneously, such as lane departure warning, collision warning, and traffic sign recognition.

Multi-Core Processor enhances 3D imaging and CV applications.

Inuitive Ltd    Ra'anana 43665  Israel
Jun 03, 2014 Leveraging multi-core architecture comprising 3D image processor, dual CEVA-MM3101 Vector DSPs, and ARM® Cortex® A5 processor with ARM NEON®, NU3000 ASIC delivers performance and accuracy needed for such applications as 3D imaging, Natural User Interface, and 3D vision for PCs, laptops, tablets, smartphones, and other consumer devices. Flexible architecture allows use of same NU3000 ASIC to support different operational ranges for various 3D imaging and Computer Vision (CV) applications.

Low-Power DSP delivers up to 200 MHz performance.

Texas Instruments, Inc., Semiconductors    Dallas, TX 75243
May 29, 2014 Offering combination of low stand-by and low active power, Model TMS320C5517 is suited for battery-powered, portable systems requiring analytics, such as smart products offering face detection, object tracking, and voice recognition. McSPI operates in master or slave modes and enables low-power analytics through connectivity to external sensors. Allowing customers to connect to standard codecs, McBSP serial port supports continuous full-duplex communication and up to 128 channels in TDM mode.

Image Sensor and Processor target automotive applications.

Image Sensor and Processor target automotive applications.

OmniVision Technologies, Inc.    Sunnyvale, CA 94089
May 20, 2014 Built on OmniBSI™ backside illumination technology, OV10640 Image Sensor captures detailed, full-resolution 1.3 MP images and video at 60 fps. Sensor features HDR implementation and processing technology to minimize motion artifacts, resulting in clear scene reproduction with up to 120 dB dynamic range with RAW output. OV490 Companion Processor enables simultaneous output of fully processed YUV or RGB data for display-based applications and RAW data for machine-vision downstream processing.

Weight Processors offer Profibus-DP communication option.

Weight Processors offer Profibus-DP communication option.

Hardy Process Solutions, Inc.    San Diego, CA 92121
May 20, 2014 In addition to EtherNet/IP, Modbus TCP and RTU, and analog 4–20 mA versions, HI 6500 series offers Profibus-DP communications option. HI 6500-PB supports process weighing applications in such industries as food processing, chemical and petrochemical, and general manufacturing automation. Offering stable processed rate with resolution of 1:10:000 and update speed of 110 updates/sec, product can deliver weight readings of up to 4 instruments simultaneously on one display panel.

DSP Core supports Bluetooth connectivity.

Ceva Inc.    San Jose, CA 95110-3710
May 08, 2014 Leveraging instructions and interfaces added to multifunctional CEVA-TeakLite-4 v2 architecture, CEVA-TeakLite-4 DSP runs CEVA-Bluetooth connectivity in addition to broad range of audio and voice software packages, always-on user interface functions such as voice triggering and face activation, and full suite of sensor-fusion capabilities, all on single core. Typical applications include smartphones, Internet of Things, wearables, and wireless audio devices.

Dual Tower CPU Cooler provides quiet operation.

Noctua, Inc.    Mountain View, CA 94043
Apr 18, 2014 Featuring 150 mm wide fin-stack and widely spaced heatpipes, Model NH-D15 enables uniform heat distribution for optimal efficiency. Recessed lower fins enable NH-D15 to provide 64 mm clearance for tall memory heatsinks in single fan mode. Cooler also features pro-grade SecuFirm2™ multi-socket mounting system and NF-A15 fans that support PWM for automatic speed control through mainboard. Using supplied Low-Noise Adapter, max fan speed can be reduced to 1,200 rpm for quieter operation.

HMI Design Services support Intel E3845 processor.

HMI Design Services support Intel E3845 processor.

American Industrial Systems, Inc    Irvine, CA 92614
Apr 17, 2014 Intended for OEMs and ODMs, Design for Manufacturability Services are available for product design, development, and production using 1.91 GHz Intel® Atom™ E3845 processor with 10 W max TDP and 2 M cache. Processor is suitable for intelligent HMI systems—context-aware, securely managed embedded devices that connect seamlessly to networks, clouds, and each other. Service capabilities include electrical, software, mechanical, systems, video and vision, environmental, and functional safety design.

Mobile Processors integrate Cat 6 LTE Advanced modem.

Qualcomm    San Diego, CA 92121
Apr 15, 2014 Delivering ultimate connected mobile computing experiences in video, imaging, and graphics, Snapdragon™ 810 and 808 integrate 4th Generation Cat 6 LTE Advanced multimode modem together with support for Qualcomm RF360™ Front End Solution. Units support 3 x 20 MHz Carrier Aggregation, enabling speeds of up to 300 Mbps. Designed in 20 nm technology node with 64-bit capability, both offer seamless connectivity and power efficiency for flagship smartphones and tablets.




(Showing headlines 1 - 20)   more ....


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