Alliance Memory, Inc.    San Carlos, CA 94070
May 13, 2013 Operating from a single 2.7–3.6 V supply and offering 55 nsec access time, AS6C3216 is optimized for low-power industrial, telecom, medical, and automotive applications. This 32M IC (2M x 16/4M x 8 switchable), suited for battery backup non-volatile memory, offers fully static operation and tri-state output. Typical operating current is 45 mA, and standby current is 10 µA. All inputs and outputs are fully TTL-compatible, and current is stable within -40 to +85°C operating range.

Alliance Memory, Inc.    San Carlos, CA 94070
Apr 19, 2013 Offered in 54-ball, 8 x 8 x 1.2 mm TFBGA package, AS4C8M16S-7BCN and AS4C16M16S-7BCN are, respectively, 8M and 16M x 16 SDRAMs that feature fast access time from clock down to 4.5 ns at 5 ns clock and clock rates of 143 MHz. Lead (Pb)- and halogen-free products operate from single +3.3 V (±0.3 V) power supply and provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with burst termination option. Auto pre-charge function and refresh functions are also standard.

Fujitsu Semiconductor Europe GmbH    Langen D-63225  Germany
Mar 29, 2013 Providing 1 and 2 Mbits of memory, respectively, Models MB85RS1MT and MB85RS2MT are suited for real-time, continuous data-logging applications, including smart meters, industrial machinery, and medical devices. Serial-interface FRAM products eliminate need for battery and additional memory components, simplifying design process and saving board space. High-speed random access memory is non-volatile, allowing data to be retained when power is switched off.

Microsemi    Irvine, CA 92614
Mar 29, 2013 Addressing challenges to drilling equipment microelectronics, high-temperature NOR flash products meet environmental demands of oil and gas industry downhole drilling where temperatures reach 150°C and higher. Products come in 1, 4, and 16 Mb densities and withstand temperature, shock, and vibration encountered by equipment thousands of feet below surface. Package options include hermetic ceramic dual inline, small outline J-lead, flatpacks, ceramic quad flat pack, and pin grid array.

Transcend Corp.    Orange, CA 92867
Mar 20, 2013 With 32 GB capacity, TS4GKB72W3P 1,333 MHz DDR3 Load-Reduced DIMM (LRDIMM) memory module minimizes load on server memory bus. This lets administrators maximize memory capacity, increase performance, and reduce power consumption. Full memory buffer chip on module acts as go-between for all signals sent from host to DRAM chips, reducing electrical load on all interfaces. Areas of use include infrastructures that run memory-intensive applications, such as virtualization and cloud computing.

Alliance Memory, Inc.    San Carlos, CA 94070
Mar 07, 2013 Housed in 50-pin, 400 mil plastic TSOP II package, Model AS4C1M16S offers fast access time of 5.4 ns at 7 ns clock cycle and clock rate of 143 MHz. SDRAM is internally configured as dual banks of 512 K word x 16 bits with synchronous interface. Operating from single +3.3 V power supply, device provides programmable read/write burst lengths of 1, 2, 4, 8, or full page, with burst termination option. Auto precharge function provides self-timed row precharge initiated at end of burst sequence.

Integrated Silicon Solution, Inc. (ISSI)    San Jose, CA 95112-4216
Feb 12, 2013 Packaged in 96-ball BGA, 4 Gb Model IS43TR16256A operates at 1.5 V and is organized as 256 M x 16. Device is targeted for automotive, industrial, and medical applications as well as variety of communications applications, including access and aggregation nodes, routers and switches, network storage, optical transport, and base stations. Low-voltage Model IS43TR16256AL, operating at 1.35 V, will also be available.

Kingmax Micro Technology Inc.    City Of Industry, CA 91745
Jan 10, 2013 Equipped with error check and correction (ECC) function, ECC DDR3 SO-DIMMs are designed for space-constrained micro servers or embedded systems that execute critical missions. Memory modules offer speeds of 1,333 and 1,600 MHz and capacities of 4 GB and 8 GB. Operating at voltages down to 1.35 V, lead-free units are compliant with JEDEC standard and are compatible with major server boards.

Fujitsu Semiconductor Europe GmbH    Langen D-63225  Germany
Nov 29, 2012 Housed in SON-8 package measuring 3 x 2 mm, 16 Kbit MB85RC16 Ferroelectric Random Access Memory includes I2C interface and consumes 0.1 µA in standby mode, extending battery life for products with long standby times, such as portable measurement equipment. Device's small form factor and low operating current also make it suitable for systems such as space-constrained wearable medical equipment that requires real-time data logging.

Alliance Memory, Inc.    San Carlos, CA 94070
Nov 28, 2012 Model AS6C4008A is 512K, 8-bit SRAM IC with access time of 55 nsec, typical operating current of 30 mA, and standby current of 1 µA. Current is stable within operating temperature range of -40 to +85°C, while data retention voltage is 1.5 V min. All inputs and outputs are fully TTL-compatible. Offered in 36-ball, 6 x 8 mm TFBGA and in five 32-pin packages, product is suited for use as battery backup nonvolatile memory, and in industrial, telecom, medical, and networking applications.

Fujitsu Semiconductor Europe GmbH    Langen D-63225  Germany
Nov 09, 2012 Available in 3.9 x 5.05 mm and 5.30 x 5.24 mm SOP-8 packages, MB85RC256V operates from 2.7–5.5 V, offers non-volatile data memory capacity of 256 Kb with configurations of 32k x 8 bits, and provides 10¹² times read/write cycle capability. IC retains data for up to 10 years at industrial temperature ranges and supports 2-wire serial bus transmission protocol (I²C) with frequencies up to 1 MHz (operating from 4.5–5.5 V) and 400 kHz (from 2.7–4.5 V).

Transcend Corp.    Orange, CA 92867
Oct 17, 2012 Aimed at high-power servers, 32 GB DDR3 Registered DIMM is rated at 1,333 MHz with timings of 9-9-9-24. Unit is comprised of 8 Gb DRAM chips that fully comply with JEDEC standards. With overall height of 0.74 in., 16 GB Very Low Profile DDR3 Registered DIMM is suitable for use in space-restricted cases, 1U height rack systems, and blade servers. Unit is rated at 1,600 MHz with low latency of 11-11-11-28. Operating from 1.5 V, both include aluminum heat spreaders for optimal heat dispersion.

Super Talent Technology    San Jose, CA 95132
Oct 15, 2012 As fourth-generation Value SSD (VSSD) for business and home users, VSSD Bolt employs second-generation SandForce® processor and provides read/write speeds of up to 250 MBps. TRIM support and SMART Command Transport (SCT) technology maintain optimal performance and help prevent data loss by reporting on reliability indicators. Capacities from 16 GB (FTM01G425V) to 128 GB (FTM12G825V) are available for netbooks, notebooks, desktops, and embedded/enterprise applications.

Integrated Silicon Solution, Inc. (ISSI)    San Jose, CA 95112-4216
Oct 08, 2012 Operating at 1.5 V and supplied in 96-ball BGA, 1 Gigabit (1 Gb) IS43TR16640A and 2 Gigabit (2 Gb) IS43TR16128A are respectively organized as 64Mx16 and 128Mx16. Devices are available with clock speeds up to 933 MHz (DDR3-1866) as well as commercial and industrial temperature ranges. Suitable areas of use include automotive, communications, industrial, medical, and mil-aerospace applications.

Ramtron International Corp.    Colorado Springs, CO 80921
Sep 21, 2012 Populated with Ramtron F-RAM core memory and integrated products, TWR-FRAM Module offers engineers that develop with Freescale's ARM® Cortex™-based Kinetis® and i.MX, ColdFire®, PowerQUICC™, QorIQ®, and other microcontroller and microprocessor solutions a platform to demonstrate, evaluate, and develop F-RAM into their designs. F-RAM inherently features fast single-cycle and symmetrical read/write speeds, gamma radiation tolerance, and immunity to electromagnetic noise.

Virtium    Rancho Santa Margarita, CA 92688
Jul 31, 2012 Featuring 17.78 mm profile, DDR3L Blade VLP (Very Low Profile) memory modules offer alternative to JEDEC standard VLP for space-constrained limitations in telecom and networking applications. Modules promote air flow in system and also utilize low-power DRAM to reduce thermal dissipation on DRAM surface. These products are available in 4 and 8 GB densities in range of ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations.

Patriot Memory    Fremont, CA 94538
Jul 20, 2012 Designed specifically for use with 2nd and 3rd generation Intel® Core(TM) processors, Intel® Extreme Masters Limited Edition Modules are fully certified for Intel® XMP 1.3, delivering frequencies of 1,600, 1,866, and 2,133 MHz at 1.5 V. Devices are available in dual and quad-channel kits with capacities of 8, 16, and 32 GB. Heat shield provides thermal protection during long gaming sessions.

Arbor Technology Corp.      Taiwan
Jul 03, 2012 Powered by Intel® Atom(TM) N2600 processor, PCH NM10 chipset, and 2GB DDR3 memory, EmQ-i2506 embedded module, suited for fanless and mobile embedded systems, supports I/O and expansion interfaces such as 2 SATA ports, 3 PCIe x1, LPC Bus, and 8 USB 2.0 ports. This 70 x 70 mm Qseven board also offers VGA; 18-bit, single-channel LVDS; and DDI port connectivity for display options. Wide temperature version, QSM-653E, is also available and operates from -40 to 85°C.

Virtium    Rancho Santa Margarita, CA 92688
Jun 28, 2012 Able to reduce total power for systems that use multiple memory modules, DDR3L memory modules utilize 1.35 V DDR3L DRAM and feature thermal-relief copper pour methodology PCB design. Available densities include 4 and 8 GB, and form factor options include standard height, VLP and ULP low profile ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations. Products reduce thermal dissipation up to 10°C on DRAM surface, benefitting systems that must run above 85°C.

S2C Inc.    San Jose, CA 95110
Jun 20, 2012 ARM1176 and ARM926 GUC test chip modules are used to create FPGA-based prototypes and to interface FPGA-based prototype boards to user's target operating environment. ARM test chip modules can be used with S2C SoC/ASIC prototyping hardware including Virtex-7 TAI Logic Modules, Stratix-4 TAI Logic Modules, Stratix-4 TAI Verification modules, Virtex-6 TAI Logic Modules, and Virtex-6 TAI Verification Modules.