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Computer Hardware & Peripherals -> Computer Boards & Cards -> Memory Boards & Cards -> RAM Modules SIMMs & DIMMs


RAM Modules SIMMs & DIMMs




(Showing headlines 1 - 20)   more ....
DDR SDRAMs extend battery life in portable devices.

DDR SDRAMs extend battery life in portable devices.

Alliance Memory, Inc.    San Carlos, CA 94070
Sep 23, 2014 Offered in 8 x 9 mm, 60-ball and 8 x 13 mm, 90-ball FPBGA packages, AS4C Series CMOS Double Data Rate Synchronous DRAMs include 256 Mb, 512 Mb, 1 Gb, and 2 Gb models with power consumption ranging from 1.7–1.95 V. Mobile DDR devices offer clock rates of 166 and 200 MHz, and provide programmable read and write burst lengths of 2, 4, 8, or 16. RoHS-compliant units come in extended and industrial temperature ranges of -30 to +85°C and -40 to +85°C, respectively.

SD Card Controller supports UHS-II and U3 Speed Class.

Silicon Motion Inc    San Jose, CA 95131
Sep 23, 2014 Available in Lexar PRO 2000x as well as PRO 1000x SDHC/SDXC cards, single-channel Model SM2704 supports UHS-II bus interface and UHS Speed Class 3, featuring max data read speed up to 280 MBps along with max data write speed up to 260 MBps. Complete hardware/firmware solution supports all types of NAND Flash, including 1x/1y/1z nm SLC and MLC NAND. It handles needs of professional photography, HD video recording, and compressed 4K video capture and playback.

CMOS DDR3 SDRAMs offer clock rates of 800 MHz.

CMOS DDR3 SDRAMs offer clock rates of 800 MHz.

Alliance Memory, Inc.    San Carlos, CA 94070
Jul 07, 2014 Available in 78-ball and 96-ball FBGA packages measuring 9 x 10.5 x 1.2 mm and 9 x 13 x 1.2 mm, respectively, AS4C Series offers transfer rates up to 1,600 Mbps/pin with densities of 1, 2, and 4 Gb. DDR3 and DDR3L SDRAMs operate from single 1.5 or 1.35 V power supply, respectively, and are internally configured as 8 banks of 64 M, 128 M, 256 M, and 512 M x 8 bits and/or 16 bits. Devices offer fully synchronous operation and provide programmable read or write burst lengths of 4 or 8.

Three-in-One Network Tap aids data monitoring and troubleshooting.

IPCopper    Portland, OR 97223
Jul 07, 2014 Acting as network memory, USC10G3 enables accelerated investigations into network events, cybercrime, and hacking. High speed (10GbE) capabilities allow every network communication to be captured, while 24 TB capacity supports storage of months or years of every packet header and payload. GPS time synchronization delivers timestamping with resolution of 1/1,000,000 of 1 sec, and bypass keeps network up even if appliance loses power or malfunctions.

SLC NAND Flash (36 nm) targets embedded, wireless markets.

Macronix International Co., Ltd.    Taipei   Taiwan
Jun 06, 2014 Supplied in 48-pin TSOP and 63-ball VFBGA packages, Single-Level Cell (SLC) NAND Flash utilizes 36 nm floating-gate technology and is offered in densities from 1–8 Gb in both 1.8 and 3.0 V voltages. Extended industrial temperature range is -40 to +85°C, and extended operating temperature range is also available. Along with 25 µsec random access and 25 nsec sequential access, products offer 100K program/erase cycle endurance.

SDRAM Devices target communications applications.

Integrated Silicon Solution, Inc. (ISSI)    San Jose, CA 95112-4216
Jun 05, 2014 Organized as 512 M x 16 and packaged in 96-ball BGA, Models IS43TR16512A and IS43TR16512AL are 8 GB DDR3 and DDR3L devices operating at 1.5 V and 1.35 V, respectively. High density helps efficiency in packet buffering and storing large tables while minimizing number of discrete components required in networking line card. In addition to base stations, optical transport, routers, and switches, SDRAMs are suited for automotive, industrial, and medical systems.

Rugged COM Express Type 6 Module features removable memory.

Rugged COM Express Type 6 Module features removable memory.

Acromag, Inc.    Wixom, MI 48393 7037
May 29, 2014 Designed for defense, aerospace, and industrial applications, XCOM-6400 is available with 4th-generation Intel® Core i7 (2.4GHz, 47W) or i5 (1.6GHz, 25W) Haswell CPU and Intel 8-Series QM87 PCH chipset. SODIMM hold-down method ensures secure connections while letting users remove/upgrade memory, and heat management technologies include conduction-cooled rails, heat spreader plates, as well as optional cooling fins and fan. Dual memory slots that support up to 16 GB high-speed DDR3L.

DRAM Modules operate over wide temperature range.

DRAM Modules operate over wide temperature range.

Atp Electronics Inc.    Sunnyvale, CA 94085
May 19, 2014 Operating over -40 to +85°C range, DRAM module targets such industrial applications as telecom, networking, IPC, automation, and ruggedized systems. Product is available in DDR3 SODIMMs, mini-DIMMs, and VLP DIMMs in densities from 4–8 GB. Other areas of use include military and aerospace applications.

Archive Software delivers IT optimization.

EMC Corp.    Hopkinton, MA 01748-9103
May 15, 2014 Based on open standards, EMC® InfoArchive preserves value of enterprise information while helping customers accelerate journey to 3rd Platform of IT. Active archiving enables content and data to be archived periodically from applications that are still being actively used within enterprise. Application decommissioning manages legacy applications by extracting application data, managing it against current compliance policies, and ensuring access to support business reporting, discovery, and audit.

Automotive Flash Memories come in NOR and NAND variants.

Spansion, LLC    Sunnyvale, CA 94088 3453
May 05, 2014 With respective densities of 16, 32, and 64 Mb, automotive serial NOR flash memories S25FL116K, S25FL132K, and S25FL164K are qualified across -40 to +125°C range. Automotive NAND flash products S34ML01G1, S34ML02G1, and S34ML04G1 offer respective densities of 1, 2, and 4 Gb and are qualified from -40 to +105°C. All 6 devices, qualified to AEC-Q100, meet PPAP requirements and are also suited for solar inverters, power switches, factory automation, and safety monitoring devices.

DDR2 DRAMs target automotive and industrial applications.

Integrated Silicon Solution, Inc. (ISSI)    San Jose, CA 95112-4216
Apr 21, 2014 Available in clock speeds up to 400 MHz, Models IS43LD32320A and IS46LD32320A are organized as 32 M x 32, while Models IS43LD16640A and IS46LD16640A are arranged as 64 M x 16. Low-power 1 Gb devices are supplied in 134-ball BGA package, but 168-pin PoP BGA is also available. Models IS43LD16640A and IS43LD32320A come in both commercial and industrial temperature ranges, while Models IS46LD16640A and IS46DR32320A come in automotive temperature ranges.

DDR4 RDIMM Products feature 0.70 in. profile.

Virtium    Rancho Santa Margarita, CA 92688
Apr 21, 2014 Intended for server blades as well as networking and telecom applications, DDR4 RDIMM products have RDIMM form factor and ULP (Ultra Low Profile) design. Respectively, extended and industrial temperature ranges are -25 to +95°C and -40 to +95°C, while standard temperature range is 0 to +85°C. Available capacities range from 4–16 GB, and these 1.2 V configurations offer data transfer speed ratings to 1,866 MT/s.

RDIMM and LRDIMM Chipsets support Intel Xeon processors.

Montage Technology Group    San Jose, CA 95110
Apr 11, 2014 Fully compliant with DDR4 JEDEC 1.0 specification, DDR4 RDIMM and LRDIMM Chipsets support Intel's Xeon Processor ES-2600 V3 product family. Products include DDR4 Registering Clock Driver and DDR4 Data Buffers. DDR4 LRDIMM, with one central RCD and 9 Data Buffers for each individual byte lane, can operate at 1 or 2 speed grades faster than comparable RDIMM. Chipsets target high performance computing, enterprise server, and data/cloud market segments.

High-Speed CMOS SDRAMs come in TFBGA, TSOP II package options.

High-Speed CMOS SDRAMs come in TFBGA, TSOP II package options.

Alliance Memory, Inc.    San Carlos, CA 94070
Mar 31, 2014 High-speed CMOS synchronous DRAMs (SDRAMs) — 2M x 32 AS4C2M32S-6TIN/-6BIN, 4M x 32 AS4C4M32S-6TIN/-6BIN, and 8M x 32 AS4C8M32S-7BCN — are x32 devices that come in 90-ball, 8 x 13 x 1.2 mm TFBGA and 86-pin, 400 mil plastic TSOP II packages. Products offer access time from clock down to 5.4 nsec as well as programmable read or write burst lengths of 1, 2, 4, 8, or full page with burst termination option. Auto pre-charge and auto- or self-refresh functions are included.

DDR3 RDIMM Modules boost Mac Pro memory capacity up to 128 GB.

DDR3 RDIMM Modules boost Mac Pro memory capacity up to 128 GB.

Transcend, Inc    Orange, CA 92867
Mar 20, 2014 Offering 4 user-upgradeable slots, 16 and 32 GB DDR3 Registered DIMM (RDIMM) modules can boost total memory capacity of Intel® Xeon® E5 3.5 GHz, 6-Core; 3.0 GHz, 8-Core; and 2.7 GHz, 12-Core based Apple Mac Pro 2013 systems to 64, 96, and 128 GB. This enhances performance during such tasks as 3D graphic design, 4K video editing, and gaming by ensuring system can handle such RAM-intensive software applications as Apple Final Cut Pro X and Adobe After Effects CC.

CMOS DDR2 SDRAMs offer 400 MHz clock rate, 800 Mbps/pin data rate.

CMOS DDR2 SDRAMs offer 400 MHz clock rate, 800 Mbps/pin data rate.

Alliance Memory, Inc.    San Carlos, CA 94070
Mar 18, 2014 Supplied in 60-ball, 8 x 10 x 1.2 mm and 84-ball, 8x 12.5 x 1.2 mm FBGA packages, AS4C32M16D2 (512 Mb) and AS4C64M16D2/AS4C128M8D2 (1 Gb) are respectively internally configured as 4 banks of 8M words x 16 bits and 8 banks of 8M x 16 bits/16M x 8 bits. Features include programmable read or write burst lengths of 4 or 8, auto precharge function, refresh functions, and programmable mode register. All models have synchronous interface and operate from single +1.8 V (±0.1 V) supply.

Memory Modules feature low profile design.

Virtium    Rancho Santa Margarita, CA 92688
Mar 07, 2014 Supplied in Ultra-Low Profile 0.70 in. and Very-Low Profile 0.738 in. form factors, respectively, 16 GB and 32 GB DDR3 RDIMM products are suitable for server blades, telecom, and networking applications that require low profile memory. Both are ECC Registered and are available in 1.35 and 1.5 V configurations. In addition, both series can be screened for extended temperature operation.

Modular VGA Cards come in single and dual configurations.

Eurocom Corp.    Nepean K2E 7R4  Canada
Mar 06, 2014 Measuring 82 x 105 mm with 100 W rating, MXM 3.0b Graphics Module is designed for 256-bit memory interface and larger notebooks. MXM 3.0a Graphics Module, measuring 82 x 70 mm with max power rating of 55 W, is designed for graphics cards with 64 or 128-bit memory interface. Both modular graphics solutions provide potential for small form factor, military, embedded systems as well as upgrade path to users looking to improve performance of their current notebook.

I2C-Equipped, 1 Mbit FRAM can replace EEPROMs for data capture.

I2C-Equipped, 1 Mbit FRAM can replace EEPROMs for data capture.

Fujitsu Corp.    Sunnyvale, CA 94088
Feb 27, 2014 Suited for applications requiring frequent rewriting of data, MB85RC1MT operates from 1.8–3.3 V in temperatures from -40 to +85°C and supports high-speed mode that enables read and write operations at frequencies of 3.4 and 1 MHz. Non-volatility means data is retained even when power is switched off, and random access to memory cells enables accelerated data writing. Rated for 10 trillion write-erase cycles, FRAM features 1 Mbit of memory and I˛C serial interface.

SDRAM Chips support industrial applications.

SDRAM Chips support industrial applications.

I'M Intelligent Memory Limited    Kwai Chung   Hong Kong (prc)
Feb 03, 2014 Operating on standard supply voltage of 3.3 V, SDRAM Chips are available in capacities from 256–512 Mb. Model with 256 Mb capacity is available in x8 and x16 configurations, while 512 Mb version comes in x16 configuration. In addition to standard 54-pin TSOP-II package, all products are also offered in 8 x 8 mm 54-ball FBGA package. Pin-outs, timings, and functionalities are JEDEC-compliant.




(Showing headlines 1 - 20)   more ....


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