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Computer Hardware & Peripherals -> Computer Boards & Cards -> Memory Boards & Cards -> Others


(Showing headlines 1 - 20)   more ....
Firmware Technology is optimized for industrial applications.

Firmware Technology is optimized for industrial applications.

Atp Electronics Inc.    Sunnyvale, CA 94085
Sep 10, 2014 Utilizing NAND ICs, advancedMLC (aMLC) addresses performance, endurance, and data retention needs of industrial applications. Product lines include 2.5 in. SSDs, SlimSATA, and mSATA with densities from 8–64 GB. Flexible densities reflects combination of endurance, write performance, and data retention. Mainstream densities suit write-intensive or performance-driven applications, such as boot-up, backup during sudden power-off, data logging, and caching for enterprise storage.

Memory Cards support professional 4K UHD video recording.

Memory Cards support professional 4K UHD video recording.

Transcend, Inc    Orange, CA 92867
Jul 14, 2014 Supporting next generation CFast 2.0 specification with SATA III interface, CFX650 Memory Cards come in 128 and 256 GB capacities and offer read/write speeds up to 510 Mbps/370 Mbps. CFX600 Memory Cards, offering capacities up to 512 GB, can save 4K Ultra High Definition and Full HD video recordings. Both contain built-in ECC technology, which automatically detects and corrects transfer errors. With included RecoveRx™ software, users can recover accidentally deleted or lost files.

Three-in-One Network Tap aids data monitoring and troubleshooting.

IPCopper    Portland, OR 97223
Jul 07, 2014 Acting as network memory, USC10G3 enables accelerated investigations into network events, cybercrime, and hacking. High speed (10GbE) capabilities allow every network communication to be captured, while 24 TB capacity supports storage of months or years of every packet header and payload. GPS time synchronization delivers timestamping with resolution of 1/1,000,000 of 1 sec, and bypass keeps network up even if appliance loses power or malfunctions.

SLC NAND Flash (36 nm) targets embedded, wireless markets.

Macronix International Co., Ltd.    Taipei   Taiwan
Jun 06, 2014 Supplied in 48-pin TSOP and 63-ball VFBGA packages, Single-Level Cell (SLC) NAND Flash utilizes 36 nm floating-gate technology and is offered in densities from 1–8 Gb in both 1.8 and 3.0 V voltages. Extended industrial temperature range is -40 to +85°C, and extended operating temperature range is also available. Along with 25 µsec random access and 25 nsec sequential access, products offer 100K program/erase cycle endurance.

Dual-Core MCUs suit functional safety applications.

Dual-Core MCUs suit functional safety applications.

Texas Instruments, Inc. (TI)    Dallas, TX 75243-4136
Jun 03, 2014 Based on 32-bit lockstep ARM® Cortex®-R5 cores in cached memory architecture, Hercules™ RM57Lx and TMS570LCx support speeds up to 330 MHz, delivering 550 peak DMIPS, 660 peak MIPS, and up to 330 MFLOPS. RM57Lx models help developers meet IEC 61508 functional safety standards, while TMS570LCx MCUs help meet ISO 26262 functional safety standard. Floating point devices support up to 4 MB of integrated program Flash, 512 KB of on-chip RAM, and 128 KB of data Flash for EEPROM emulation.

Automotive Flash Memories come in NOR and NAND variants.

Spansion, LLC    Sunnyvale, CA 94088 3453
May 05, 2014 With respective densities of 16, 32, and 64 Mb, automotive serial NOR flash memories S25FL116K, S25FL132K, and S25FL164K are qualified across -40 to +125°C range. Automotive NAND flash products S34ML01G1, S34ML02G1, and S34ML04G1 offer respective densities of 1, 2, and 4 Gb and are qualified from -40 to +105°C. All 6 devices, qualified to AEC-Q100, meet PPAP requirements and are also suited for solar inverters, power switches, factory automation, and safety monitoring devices.

microSD Memory Cards comply with UHS-II interface standard.

microSD Memory Cards comply with UHS-II interface standard.

Toshiba America Electronic Components (TAEC)    Irvine, CA 92618-1811
Apr 29, 2014 Available in 32 and 64 GB capacities, microSD Memory Cards are UHS Speed Class 3 enabled and allow 4 K video capture at constant minimum write speeds of 30 MBps. Cards with 64 GB capacity offer max read speed of 260 MBps and max write speed of 240 MBps, while 32 GB models have max read speed of 145 MBps and max write speed of 130 MBps. All feature cryptographic security and high-level copyright protection functions.

UHS-I Speed Class 3 Cards support 4K video capture.

UHS-I Speed Class 3 Cards support 4K video capture.

Transcend Corp.    Orange, CA 92867
Mar 31, 2014 Featuring full support for Ultra High Speed Class 3 specification, SDXC/SDHC UHS-I Cards are capable of reaching read and write speeds up to 95 Mbps and 85 Mbps. In devices that do not support UHS-I specification, cards offer constant write speeds of at least 10 Mbps, which makes them suitable for Full HD video recording as well as fast-action consecutive shooting. Capacities ranging from 32–128 GB enable cards to handle capacity requirements of professional photography and filmmaking.

CMOS DDR2 SDRAMs offer 400 MHz clock rate, 800 Mbps/pin data rate.

CMOS DDR2 SDRAMs offer 400 MHz clock rate, 800 Mbps/pin data rate.

Alliance Memory, Inc.    San Carlos, CA 94070
Mar 18, 2014 Supplied in 60-ball, 8 x 10 x 1.2 mm and 84-ball, 8x 12.5 x 1.2 mm FBGA packages, AS4C32M16D2 (512 Mb) and AS4C64M16D2/AS4C128M8D2 (1 Gb) are respectively internally configured as 4 banks of 8M words x 16 bits and 8 banks of 8M x 16 bits/16M x 8 bits. Features include programmable read or write burst lengths of 4 or 8, auto precharge function, refresh functions, and programmable mode register. All models have synchronous interface and operate from single +1.8 V (±0.1 V) supply.

Modular VGA Cards come in single and dual configurations.

Eurocom Corp.    Nepean K2E 7R4  Canada
Mar 06, 2014 Measuring 82 x 105 mm with 100 W rating, MXM 3.0b Graphics Module is designed for 256-bit memory interface and larger notebooks. MXM 3.0a Graphics Module, measuring 82 x 70 mm with max power rating of 55 W, is designed for graphics cards with 64 or 128-bit memory interface. Both modular graphics solutions provide potential for small form factor, military, embedded systems as well as upgrade path to users looking to improve performance of their current notebook.

NOR Flash Memory features high-speed, 12-pin interface.

Spansion, LLC    Sunnyvale, CA 94088 3453
Feb 25, 2014 Supplied in 8 x 6 mm BGA package, Spansion® HyperFlash™ NOR Memory devices support read throughputs up to 333 MBps and feature interface that consists of 8-pin address/data bus, differential clock (2 signals), Chip Select, and Read Data Strobe for controller. Devices provide migration path from single Quad SPI to Dual Quad SPI to HyperFlash Memory. Offered in 3 and 1.8 V power supply versions, products come in 128, 256, and 512 Mb densities.

SDRAM Chips support industrial applications.

SDRAM Chips support industrial applications.

I'M Intelligent Memory Limited    Kwai Chung   Hong Kong (prc)
Feb 03, 2014 Operating on standard supply voltage of 3.3 V, SDRAM Chips are available in capacities from 256–512 Mb. Model with 256 Mb capacity is available in x8 and x16 configurations, while 512 Mb version comes in x16 configuration. In addition to standard 54-pin TSOP-II package, all products are also offered in 8 x 8 mm 54-ball FBGA package. Pin-outs, timings, and functionalities are JEDEC-compliant.

Bipolar PROMs serve as drop-in replacements for OEM devices.

e2v Technologies PLC    Chelmsford   United Kingdom
Jan 24, 2014 Manufactured on bipolar process, PROM Series has 4 members ranging in size from 2K (512 x 8) to 16K (2K x 8), with speeds from 90–125 ns. Units are One-Time Programmable devices, offering on-chip address decoding without separate fusing pins, 3-state outputs, and full TTL-compatibility. Available in variety of ceramic packages, including Leadless Chip Carriers, Dual Inline Packages, and Flatpacks, PROMs meet OEM specifications for military and aerospace applications.

Microcontroller Development Board includes GPS/GNSS receiver.

Microcontroller Development Board includes GPS/GNSS receiver.

SkyTraq Technology, Inc.    Hsinchu City 300   Taiwan
Dec 30, 2013 Based on 100 MHz, 32-bit RISC with 16 KB I-Cache and 2 KB D-Cache, NavSpark includes IEEE-754 compliant floating point unit, 1 MB flash memory, and 212 KB SRAM. NavSpark-BD model has GPS/Beidou receiver onboard for smartphone manufacturers, while NavSpark-GL includes GPS/GLONASS receiver. Housed in 7 x 7 mm QFN56 package, Venus822 quad-mode GPS/GNSS processor with extended I/O pins can simultaneously process 34 GPS/GLONASS/Beidou/Galile /QZSS/SBAS signals in parallel.

Memory Module features 0.72 in. form factor.

Virtium    Rancho Santa Margarita, CA 92688
Dec 02, 2013 Designed to meet demand for optimized airflow in space-constrained systems, 16 GB DDR3 VLP Mini-RDIMM features layout that minimizes overall thickness while doubling density. Module is available in 1.5 and 1.35 V configurations and can be screened for extended temperature operation. Device is suited for many networking and high-end medical applications where low-profile and small size are key requirements.

CMOS Synchronous DRAM comes in 2M x 32, 4M x 32 configurations.

Alliance Memory, Inc.    San Carlos, CA 94070
Nov 15, 2013 While AS4C2M32S-7TCN (2M x 32 bit device) comes in 90-ball, 8 x 13 x 1.2 mm TFBGA package, AS4C4M32S-7TCN (4M x 32 bit device) comes in 86-pin, 400 mil plastic TSOP II package. Access times for these SDRAMs are 5.4 and 5.5 nsec, respectively, while clock rates are 143 and 166 MHz. Operation is from single +3.3 V ±0.3 V power supply over 0 to +70°C range. Features include programmable read or write burst lengths. auto pre-charge function, refresh functions, and programmable mode register.

Data Appliance combines analytics and in-memory technology.

Teradata Corp.    Dayton, OH 45342
Oct 28, 2013 With Teradata Intelligent Memory and Teradata Database, Teradata Data Warehouse Appliance 2750 offers self-managing, in-memory platform that accelerates delivery of analytics. Teradata Intelligent Memory automatically places most frequently used data into memory for fastest analytic performance, eliminating disk I/O bottlenecks and query delays. Appliance offers full redundancy, mission critical availability, scalability to handle petabytes of data, and granular integrated workload management.

BSP for WEC7 is available on Altera's Cyclone V SoC.

iWave Systems Technologies Pvt, Ltd    Bangalore 76  India
Sep 20, 2013 Suited for Proof of Concept (POC) development and accelerating development cycle, Windows Embedded Compact 7 (WEC7) BSP is available on Altera's Cyclone V SoC. Along with dual Cortex A9 cores implementation (SMP), DDR3 memory, and Cyclone V SoC, features include FPGA configuration, USB OTG as Host or Device, UART, display, SD/MMC, and Flash memory. Additional feates, supplied as standard, include Ethernet, interrupt, timer, Eboot, SPI, I²C, GPIO, KITL support, and Hive Registry support.

Memory Cards support Ultra-High Speed Class 1 specification.

Memory Cards support Ultra-High Speed Class 1 specification.

Transcend, Inc    Orange, CA 92867
Aug 21, 2013 Featuring 8–128 GB capacities, SDHC/SDXC UHS-I Cards are fully equipped to handle requirements of professional photography and filmmaking, including continuous burst-mode shooting and extended video recording. Series includes 128 GB 600x and 64 GB 300x models with transfer speeds of 90 MBps and 45 MBps, respectively. When paired with RDF8 USB 3.0 multi-card reader or RDF5 USB 3.0 card reader with built-in USB port, 128 GB card enables 1 GB files to be transferred in just 12 seconds.

RRAM Non-Volatile Memory offers 1 TB capacity.

Crossbar, Inc    Santa Clara, CA 95054
Aug 08, 2013 Featuring 3-layer structure consisting of non-metallic bottom electrode, amorphous silicon switching medium, and metallic top electrode, Resistive RAM can be stacked in 3D, delivering multiple terabytes of storage on single chip. Device enables massive amounts of information, such as 250 hours of HD movies, to be stored and played back. Typical applications include mobile phones and tablets; enterprise storage, SSDs, and cloud computing; wearable computing; and secure payments.

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