Including 3V, 512-Mbit HyperFlash and 64-Mbit HyperRAM, Cypress HyperFlash and HyperRAM memory solution offers -40°C to +85°C and -40°C to +105°C temperature operating range. With 8-pin address/data bus, solution’s Interface provides two differential clock signals, one chip select and read data strobe. Reading/writing bandwidth at 33Mbps, HyperRAM is available in 6 mm x 8 mm 24-ball BGA package with self-refresh DRAM for expanded scratchpad memory.Read More
Based on 4 x 4 Gb die and supplied in 48-pin TSOP, 16 Gb BENAND™ is optimized for effective write endurance (using 8-bit BCH ECC) as well as read/write performance. ECC is not required from host controller, and this enables use with host controllers that do not have 8-bit ECC capability. Delivering long-term process support, product operates from 2.7–3.3 V supply over -40 to +85°C range and is suited for commercial and industrial applications.
Offered in commercial and rugged versions, respectively, 4U Models FSAn-4 and FSAn-4R are used in datacenters for accelerating high-performance databases, Hadoop clusters, and HPC applications with large data sets. Rugged version is deployed in broadcast trucks, ground stations, and surveillance aircraft. Providing hot swap and front loading features, devices use high performance PCIe NVMe flash with PCIe 3.0 x8 lanes for double bandwidth of 2.5 in. NVMe. Read More
Featuring 200 GB capacity, LX Series and Instamobile microSDXC cards let Android™ smartphone and tablet users expand available storage for HD movies, pictures, music, and productivity files. These Class 10, UHS-1 cards, which can store 18+ hr of 1080p HD video or up to 36,000, 3 MB photos, accelerate data transfer with respective read and write speeds up to 90 MBps and 40 Mbps. SD adaptor, included for use with DSLR cameras, also enables transfer of files to device or laptop. Read More
Offered in 16, 32, and 64 Mb densities, SST26VF SQI (Serial Quad I/O) Flash devices operate at Automotive Grade 2 and 3. Operating voltage ranges down to 2.3 V, and devices are capable of operating in temperatures up to 105°C. SuperFlash® technology promotes performance and reliability while also minimizing power consumption to 15 mA (typ) in high-speed operating conditions for high-bandwidth, compact designs. Read More
Enabling small PCB layout, 1.8 V FS-S Quad SPI NOR Flash memory comes in 8-lead SOIC and 24-ball BGA packages and features Quad Serial Peripheral Interface (Quad SPI). Memory leverages 80 MHz DDR mode to deliver read bandwidth of 80 MBps and enables accelerated program execution. In addition to providing 0.475 msec program time per 512 bytes, AEC-Q100 automotive qualified solution offers low standby current and deep-power-down modes to extend battery life.
SAN JOSE, Calif., - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it plans to exhibit its latest intellectual property (IP) and processor technologies at this year's Flash Memory Summit at booth 616 from August 11 to 13, 2015, in Santa Clara, CA. WHO: Cadence is scheduled to demonstrate its latest flash memory IP, verification models, and Tensilica offload processor...Read More
HGST Ships NVM Express(TM) Compliant Solid-State Drives with Industry-Leading Performance for Cloud and Enterprise ApplicationsApril 17, 2015
HGST's Ultrastar SN100 Series Enables New Levels of Server Utilization and Application TCO with a Combination of Industry-Leading Performance and Capacity, Choice of SSD Form Factors, and NVMe Standards Compliance SANTA CLARA, Calif. - 2015 Percona Live MySQL Conference and Expo (Booth #202) - Helping the world harness the power of data, HGST (@HGSTStorage), a Western Digital company...Read More
As universal storage solution suited for various electronic devices, Kingston Technology A19nm e•MMC™ Flash memory encloses MLC NAND and e•MMC controller inside one JEDEC standard package. Controller directs Flash management, including ECC, wear-leveling, lOPS optimization, and read sensing, and thereby reduces storage management burden on host CPU. Standard interface makes NAND technology invisible to host and negates need for host processor to keep changing its software. Read More
Available in densities from 16–128 GB, NAND Flash Memory Modules integrate NAND chips fabricated with Toshiba's 15 nm second generation process technology and are fully compliant with JEDEC e-MMC v5.1 standard. Command queuing feature enables users to store multiple tasks in queue, which are then performed in order of user's preference. With secure write protection feature, important data stored in assigned, secure areas cannot be overwritten or erased by unauthenticated users. Read More
Intended for applications where data protection is crucial, 64 GB SSD BGA (32 x 28 mm) overcomes malicious attack concerns with factory firmware lockdown technology that prevents covert firmware repurposing. Self-encrypting drive delivers multiple key management methods and security features based on Armor™ III processor technology. For sensitive applications, encryption key can be erased in <30 msec, and second security layer can be activated to erase entire storage media in <10 sec. Read More
Available with 16-, 32-, or 64-Mbit of memory, 3 V Series SST26VF Serial Quad I/O™ SuperFlash® Memory Devices complete sector and block erase commands in just 18 ms and full chip erase operation in 35 ms. SQI interface, consisting of 104 MHz quad-bit address and data multiplex I/O serial interface, enables low-latency execute-in-place capability with minimal processor buffer memory. Standby current consumption is 15 µA, typical, and active read current at 104 MHz is 15 mA, typical. Read More
Using single 1.8 V power supply for core and I/O voltage, 512 Mb density S25FS512S delivers SPI read performance of 80 MBps with quad DDR at 80 MHz clock speeds. Support is also standard for read operation at 133 MHz clock speeds in single, dual, and quad I/O mode as well as 1.08 MBps programming throughput. Available in -40 to +85 and -40 to +105°C operating ranges, memory offers 24- or 32-bit address options, Quad all (QPI, 4-4-4) read mode, and configurable initial read latency. Read More
Tegile Systems Chosen for More-Compelling Features, Lower Price Point than Dell for University of Northwestern - St. PaulMarch 6, 2015
NEWARK, Calif.,– Tegile Systems, the leading provider of flash-driven storage arrays for databases, virtualized server and virtual desktop environments, today announced that University of Northwestern - St. Paul has updated and upgraded its storage infrastructure with an estimated $200,000 5-year total cost of ownership savings over an alternative Dell Compellent system. University of...Read More
With fail-safe file system support and secure erase, eMMC Flash simplifies software integration and guarantees integrity of data. All file systems are supplied with advanced test suite to verify correct operation. Developers can use test suite to induce hardware errors and unexpected resets to verify fail-safe behavior and recovery. With built-in NAND controller, eMMC can be connected to any processor with compatible memory interface such as MMC/SDIO. Read More
First companion device to HyperFlash™ memory operating on the same HyperBus™ Interface simplifies board design and increases system performance SUNNYVALE, Calif. - Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, today announced the first RAM device with the HyperBus™ interface. The Spansion HyperRAM™ memory, a companion to HyperFlash™ memory, enables a...Read More
Offering advantages of software-defined storage at speed of flash, IBM FlashSystem® V9000 lets users consolidate existing storage systems under one management domain, and implement virtualization and storage services throughout. IBM FlashSystem 900 provides enterprise reliability and macro efficiency that can be deployed in as little as 2 hours. Based on IBM FlashCore™ technology, systems help businesses leverage power of big data, achieve real-time business insights, and make better decisions. Read More
Running all primary storage and active workloads, Flash Storage Platform™ includes 7300 and 7700 all flash arrays, Concerto™ OS 7, and Symphony™ 3 management control. Concerto OS 7 combines system-level flash management and control, block-level de-duplication and compression, and set of data management, protection, and recovery services. Capacity of 7300 FSP is 217 TB effective in 3 RU space, while 7700 FSP 6-shelf configuration exceeds 1.3 PB effective, delivering 2.2 PB effective in rack. Read More
Respectively offering 1 and 3 TB capacities, SSD-1000M and SSD-3000M deliver enterprise-level reliability from 100 x 70 x 9.5 mm package. Both 2.5 in. SATA SSDs employ 19 nm MLC NAND, and integrated Fixstars NAND controller prevents latency spikes and performance deterioration. Along with respective read/write times of <520/350 MB/s in standard mode and <520/500 MB/s in boost mode, features include SATA 6 Gbps interface and <3 W power consumption when idle.
ATP industrial Grade M.2 and embedded modules using SATA III interface products with its IC and module level testing capabilities provide both high reliability and outstanding performance to fulfill customers' rigorous requirements Taipei, Taiwan – ATP, the leading industrial Flash storage and DRAM memory solution provider, will be showing its industrial-grade M.2 and the latest SATA...Read More