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RAM Modules SIMMs & DIMMs
DesignWare HBM2 IP Solution consists of HBM2 controller, PHY and Verification IP and is based on Synopsys' silicon-proven HBM and DDR4 IP. Available for 14- and 7-nm process technologies, the solution helps user in achieving desired memory bandwidth, latency and power objectives. The HBM2 Controller supports pseudo-channel operation in lock step or memory interleaved modes. DesignWare HBM2... Read More
SAN CARLOS, Calif. - Nov. 23, 2016 - Alliance Memory today announced that its synchronous DRAM (SDRAM) portfolio now features a wide variety of components that provide an automotive temperature range of -40° to +105 °C and are fabricated and assembled to automotive quality standards.
Alliance Memory offers a complete lineup of high-speed CMOS SDRAMs, including double data rate (DDR),... Read More
Available in two modes MSP430FR5994 and MSP430FR2111, MSP430 FRAM Microcontrollers offer 256KB FRAM with MSP430FR5994 and unified FRAM memory in small 3x3 mm QFN package with MSP430FR2111. Integrating 10-bit analog-to-digital converter, EEPROM functionality, comparator, real-time clock, enhanced timers, internal oscillator with 16-bit MCU in MSP430FR2111, unit provides ferroelectric RAM and... Read More
Including 3V, 512-Mbit HyperFlash and 64-Mbit HyperRAM, Cypress HyperFlash and HyperRAM memory solution offers -40°C to +85°C and -40°C to +105°C temperature operating range. With 8-pin address/data bus, solution’s Interface provides two differential clock signals, one chip select and read data strobe. Reading/writing bandwidth at 33Mbps, HyperRAM is available in 6 mm x 8 mm 24-ball BGA... Read More
Mentor Graphics, Northwest Logic, and Krivi Semiconductor Announce Availability of Complete DDR4 SDRAM IP Design and Verification SolutionOct 07, 2016
WILSONVILLE, Ore. - Mentor GraphicsÂ® Corporation (NASDAQ: MENT), Northwest Logic and Krivi Semiconductor today announced the availability of a complete DDR4 SDRAM IP design and verification solution that enables ASIC and FPGA design teams to quickly design and verify DDR4 memory subsystems in the Mentor Graphics IP Partnership Program.Â Together, Mentor Graphics, Northwest Logic, and Krivi... Read More
Offered in 8 x 9 mm 54-ball and 8 x 13 mm 90-ball FPBGA packages, Models AS4C32M16MS and AS4C16M32MS are internally configured as 4 banks x 8 Mbit x 16 and 4 banks x 4 Mbit x 32, respectively. Devices offer clock rates up to 166 MHz, power consumption of 1.8 V, and programmable read/write burst lengths of 1, 2, 4, or 8. Auto temperature-compensated self-fresh minimizes power consumption at low... Read More
Organized as 256 Mb x 16, IS43QR16256A and automotive-grade IS46QR16256A come in 96-ball BGA package and operate at 1.2 V with speeds of 2,400, 2,100, 1,866, and 1,600. Power, bandwidth, performance, and reliability addressÂ networking, automotive, and industrial system needs. Along with bidirectional differential data strobe, features include data masking per byte on write commands, per DRAM... Read More
Housed in 78-ball, 9 x 13.2 mm, lead-free FBGA package, Model AS4C1G8MD3L is internally configured as 8 banks of 1G x 8 bits. Double data rate architecture enables fast transfer rates up to 1,600 Mbps/pin and clock rates of 800 MHz. Operating from single +1.35 V power supply, monolithic device is available with extended commercial temperature range of 0–95Â°C. Product offers fully synchronous... Read More
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Based on low-pin-count HyperBus™ interface, 64 Mb HyperRAM™ serves as expanded scratchpad memory for rendering of high-resolution graphics or calculations of data-intensive firmware algorithms in automotive, industrial, and consumer applications. Device operates with read/write bandwidth up to 333 MBps and is available in 3 V and 1.8 V supply voltages. When paired with HyperFlash™ NOR Flash... Read More
Internally configured as 4 banks of 8M word x 32 bits, 256 M Models AS4C8M32S-6TIN and AS4C8M32S-7TCN feature clock rates to 166 MHz and 143 MHz, and industrial and commercial temperatures ranges of -40 to +85Â°C and 0–70Â°C, respectively. Lead-free SDRAMs offer synchronous interface and operate from single +3.3 V (Â±0.3 V) power supply. Devices provide programmable read or write burst... Read More
Built-in ECC feature prevents data bit errors MILPITAS, Calif. - Integrated Silicon Solution, Inc. (NASDAQ: ISSI), a leader in advanced memory solutions, today announced it has begun sampling production units of its new 1-gigabit (1Gbit) DDR3 DRAMs with ECC. The new product has an embedded Error Correcting Code (ECC), which detects and corrects bit errors on-the-fly. It requires no monitoring,... Read More
Equipped with UHS-II connectors, UHS Speed Class 3 and 10, EP PRO-II SDXC and microSDXC cardsÂ increase transfer speeds as well as storage capacity. Read speeds reach 280 MBps, and write speeds reach 100 MBps. Available in capacities to 64–512 GBÂ (EP PRO-II SDXC full card) and 32–128 GB i(EP PRO-II microSDXC card), products comply with UHS-II, U3 Speed Class requirements and are capable... Read More
With 55 ns access time, typical operating current of 30 mA, and standby current of 1.5 ÂµA, AS6C8016-55TIN provides reliability and power savings for low-power portable electronics. This RoHS-compliant 8M IC (512K x 16 bit), supplied in 48-pin, 12 xÂ 20 mm TSOP-I package and suited for battery backup non-volatile memory, offers fully static operation and tri-state output. Operating range is... Read More
Axcelis Announces Shipment of Follow-On Multi System Order for 'Purion H' From Leading DRAM ChipmakerFeb 25, 2016
Systems Will Support Volume 20nm DRAM Device Production Ramp BEVERLY, Mass. - Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped a follow-on, multi system Purion H™ order to an existing volume production customer, one of the world's leading manufacturers of DRAM devices... Read More
Ferroelectric-RAM (F-RAM™), energy-efficient NVRAM (nonvolatile random access memory)Â technology, offers 100 trillion write cycle endurance. Ferroelectric material resists data corruption caused by radiation or magnetic field exposure. Providing data retention without additional batteries, nonvolatile static RAM (nvSRAM) offers access times as low as 20 nsec and unlimited endurance and uses... Read More
SAN JOSE, Calif. - Viking Technology, a division of Sanmina Corporation (Nasdaq: SANM), and leading global provider of innovative DRAM and solid state drive (SSD) solutions, today announces the testing and validation of its ArxCis-NV™, a DDR4 Non-Volatile DIMM (NVDIMM), by SupermicroÂ® for integration in its SuperServer platforms. This validation enables customers using SupermicroÂ®... Read More
To maximize data reliability without additional error correction chips, 4 Mb asynchronous Static Random Access Memory (SRAM) integrates hardware Error-Correcting Code (ECC)Â that block performs all error correction functions inline, without user intervention, for Soft Error Rate (SER) performance of <0.1 FIT/Mb. Optional error indication signal indicates correction of single-bit errors. Other... Read More
Operating from single +2.5-V (Â± 0.2 V) power supply, 256 Mb Model AS4C32M8D1, 512 Mb Model AS4C64M8D1, and 1 Gb Model AS4C64M16D1 are internally configured as 4 banks of 32M word x 8 bits, 64M word x 8 bits, and 64M word x 16 bits, respectively. Units feature clock rates of 200 MHz and 166 MHz and provide programmable read or write burst lengths of 2, 4, or 8. Lead-free and halogen-free,... Read More
Available in densities from 16–128 GB, NAND Flash Memory Modules integrate NAND chips fabricated with Toshiba's 15 nm second generation process technology and are fully compliant with JEDEC e-MMC v5.1 standard. Command queuing feature enables users to store multiple tasks in queue, which are then performed in order of user's preference. With secure write protection feature, important... Read More
Suited for industrial and embedded applications on IntelÂ®'s Skylake platform, unbuffered long DIMM and compact SO-DIMM DDR4 memory offerings operate at 2,133 MHz, feature respective profiles of 31.25 and 30.0 mm, and integrate ECC. JEDEC-compliant products, optimized for airflow, feature 30u thick gold connector, on-board thermal sensors, and conformal coatings. RoHS-compliant, 1.2 V... Read More