Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 01, 2006 Measuring 9 mm in height, Model EX2 is suited for use inside enclosures where space is limited. Case-to-ambient thermal resistance is 1.8°C/W within air velocity of 600 fpm. Unit can be securely attached to component with double-sided, thermally conductive adhesive tape. No mechanical hardware is required.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Jan 24, 2006 Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Apr 22, 2005 Measuring 4–7 mm in height, blueICEâ„¢ Heat Sinks feature thermal resistance as low as 1.23°C/W within air velocity of 600 fpm. Double-sided, thermally conductive adhesive tape can be used to attach heat sinks securely to components so no mechanical hardware is needed. Units are suited for use inside most telecommunications enclosures where space is limited.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Mar 15, 2005 Low-profile powerICEâ„¢ heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4–7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23°C/W with air velocity of 600 fpm. They are provided with double-sided, thermally conductive adhesive tape for assembly without fasteners.

Lytron, Inc.
Woburn, MA 01801 1039
Aug 29, 2003 Ascentâ„¢ Series all-copper cold plates provide contact cooling of high watt-density electronic components such IGBTs, MOSFETs, resistors, and diodes. Normalized thermal resistance at 1 gpm is 0.58°C in²/W, and pressure drop at 0.5 gpm is 3 psi. Internal crisscrossed fin structure offers increased surface area. Available with straight or beaded fittings, plates are pressure tested to 30 psi and have maximum operating temperature of 125°F.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 12, 2003 Low-profile powerICE™ heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23–14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.

Lytron, Inc.
Woburn, MA 01801 1039
Aug 09, 2002 High Performance Seriesâ„¢ cold plates offer corrugated aluminum fins, which provide heat transfer surface. Vacuum brazing produces parts with uniform thermal conductivity over large surface area. Cold plates may be customized to any application and are available in sizes from 4 to 700 in² (as thin as 0.10 in.). They are manufactured by inserting aluminum fin into aluminum plate with machined cavity. Plate, lid, and fin are joined with vacuum brazing.

Lytron, Inc.
Woburn, MA 01801 1039
Jun 07, 2002 Press-Lock II™ series uses smaller, tightly packed tubes to improve thermal performance by 40 to 50% over company’s previous models. Plates are 0.3 in. thick and tubes are 0.25 in. dia, allowing for tight packaging and stack construction. Tubes are coplanar with plate, allowing parts to be mounted on both sides. Applications include cooling electronics, power supplies, lasers, RF transmitters, semiconductor processing equipment, thermoelectrics, and UPSes.

Lytron, Inc.
Woburn, MA 01801 1039
Apr 08, 2002 Aluminum Saddle has through or tapped holes for securing company's CP-20 Extended Surface cold plates to electronic boards. It applies consistent force across cold plate, ensuring good thermal connection. All-aluminum cold plates consist of connector tubes welded to micro-channel aluminum extrusion. They can be used with EGW, refrigerant, Fluorinert(R), and other fluids to remove heat from high heat load discrete components.