Devcon    Danvers, MA 01923
Aug 25, 2003 Offered as liquid or putty, Flexane® Fast Cure consists of 100% solids urethane compound that is suited for making repairs to worn or damaged conveyor belts and other rubber equipment. It bonds to rubber, metal, concrete, fiberglass, and wood and cures to functional medium-hard rubber in 1.5 hrs. Compound has working time of 8 min, is tack-free in 30 min, and withstands service temperatures up to 120°F (wet) or 180°F (dry).

Masterbond, Inc.    Lake In The Hills, IL 60102 9600
Aug 19, 2003 Type EP3RRLV cures in 30–35 min at 220°F and 10–15 min at 300°F. It offers electrical insulation, thermal shock and heat resistance, and protection against water and chemicals. Epoxy requires no mixing and has unlimited working life at room temperature. It bonds to metals, ceramics, glass, and most plastics. Suited for potting, encapsulation, and underfill applications, EP3RRLV has tensile strength of >5,000 psi, Shore D hardness of 80–85, and viscosity of 1,000–1,500 cps.

Master Bond, Inc.    Hackensack, NJ 07601
Aug 18, 2003 Water-resistant Master Bond X17MED bonds polyethylene and polypropylene, curing readily at room temperature. Adhesive bonds polyolefins without any special surface preparation. It is offered in pint, quart, gallon, 5 gal, and drum containers.

Bettcher Industries, Inc.    Vermilion, OH 44089
Aug 12, 2003 Single-component, heat-curing EP17 is chemically resistant and bonds to substrates such as metals, glass, ceramics, vulcanized rubbers, and plastics. With operating range of -300 to 600°F, 100% reactive product contains no solvents or diluents and will not sag or drip on vertical surfaces. Product cures at temperatures from 300–350°F in 60–90 min and has tensile strength is 8,700 psi, Shore D hardness of 90+, and compressive strength of 13,000+ psi.

Tra-Con, Inc.    Bedford, MA 01730
Aug 08, 2003 TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75°C and in 24 hr at 25°C.

Kester Solder Co.    Des Plaines, IL 60018
Aug 06, 2003 Suited for throughput assembly of flip chip devices on rigid and flexible substrates, SE-CURE® 9208 consists of filled one-component, snap-cure underfill epoxy material. Product eliminates resin bleedout and allows for uniform, void-free encapsulation under die for gaps of 0.001–0.005 in. With operating temperature range of -55 to +150 °C, product cures below glass transition temperature.

Penn Fibre/Delaware Div.    Greenwood, DE 19950
Jul 31, 2003 Delrin® Forming Solutions offers high strength to weight ratio, high dimensional stability, scratch and wear resistance, low moisture vapor transmission rate, and chemical and solvent resistance. Surface readily accepts paints and inks. Delrin® FS comes in coils from .007–.125 in. thick and up to 24 in. wide, and sheets up to .250 in. thick and up to 48 in. wide. Metric sizes, up to 1250 mm wide, are available for international markets.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 30, 2003 Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is available in thicknesses of 2–8 mils and up to 16 in. sq.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jul 29, 2003 Aremco-Bondâ„¢ 568 2-part, 1:1 mix, aluminum-filled epoxy system provides mechanical strength and thermal conductivity to 400°F, making it suitable for bonding aluminum and copper heaters and heat sinks. Thermal conductivity is 9.0 Btu-in./hr-ft²-°F, and flexural and tensile strength is 11,400 and 2,500 psi, respectively. Aremco-Bondâ„¢ 568 is resistant to wide range of acids, bases, salts, and organic fluids. It has passed NASA outgassing studies to ASTM E-595.

Sealed Air Corp., Packaging Products Div.    Saddle Brook, NJ 07663
Jul 29, 2003 Cell-Aire® ST protects items from becoming scratched during handling and transportation. Foam is naturally tacky, which provides low-slip surface to hold items in place. Features include tear resistance and closed-cell foam construction that provides moisture barrier and thermal insulation. Offered in light blue, foam is available in 48, 60, and 72 in. widths, and each width is offered in 4 thicknesses from 1/32–1/8 in.

GE Company GE Plastics    Pittsfield, MA 01201
Jul 25, 2003 Visualfx(TM) Resins are formulated to enhance look of products in business equipment and telecom markets. Earth Elements line consists of glossy, sparkle, and marble black effects, in LEXAN® polycarbonate resin and CYCOLOY® ABS/PC resin. Glacial Elements line, available in CYCOLOY, includes variations of white. Alliage® metallic effect, in CYCOLAC® ABS resin offers three-dimensionality in wide color range, while Tempulse(TM) sparkle effect, in CYCOLOY adds gleam to high-gloss and textured surfaces.

Saint-Gobain Performance Plastics, Attachment Tapes, Sealants & Gaskets    Granville, NY 12832-1699
Jul 18, 2003 Norseal® V860 closed-cell, 15 lb density foam is offered with or without pressure-sensitive acrylic adhesive. It is both abrasion- and flame-resistant and meets FMVSS 302 for appliance seals, duct seals, motor-mount pads, or door frame assemblies.

Vantico Inc.    Los Angeles, CA 90039-1011
Jul 15, 2003 Gap filling, sag resistant Araldite 2015 epoxy securely joins dissimilar materials used in fabricating bike accessories. It attains handling strength after 4 hours at room temperature and produces joints with lap shear strength of 3,200 psi at room temperature. Epoxy dispenses, waste-free, from 50 ml, dual barrel cartridges and handles temperatures from -67 to 250°F. Adhesive produces durable joints on aluminum, titanium, and fiber composite substrates.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 11, 2003 Master Bond Polymer System Supreme 10HTFL one component, flexible, epoxy resin based adhesive/sealant cures to flexible thermoset polymer at temperatures of 250–300°F and above and does not require refrigeration for extended storage before use. It adheres to metallic and non-metallic substrates and exhibits tensile lap shear strengths of more than 2,000 psi and T-peels in excess of 60 pli. Product is resistant to thermal and mechanical shock and vibration and chemicals.

DuPont Packaging and Industrial Polymers    Wilmington, DE 19880
Jul 07, 2003 Delrin® Decorating Solutions System consists of molding resins, ethching solution, coatings, and application technology. It delivers aesthetics of painted or metal-plated plastics with functional attributes of Delrin® acetal resins, such as resistance to alcohol and most other perfume and cosmetic ingredients. Paintable, plateable Delrin® can be molded to make parts with integral hinge, replacing 2- or 3-piece casings made of other materials.

HumiSeal Div. of Chase Corp.    Woodside, NY 11377 9841
Jul 02, 2003 Suited for printed circuit and printed wire assemblies, moisture-resistant 1B31 clear conformal coating allows users to make quick repairs, cost-efficient prototypes, low cost retrofits and small production runs. Product contains UV safety tracer for inspection under black light and is MIL-I-46058C and IPC-CC-830 qualified. It is available in liquid bulk packaging in quarts, gallons, 5-gallon pails, and 55-gallon drums.

Roland DGA Corporation    Irvine, CA 92618
Jul 01, 2003 Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ft³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ft³ density and 27 Shore D hardness. Suited for milling foundry patterns and core boxes, High Density Urethane SRP boards offer 75 lb/ft³ density and 85 Shore D hardness.

Sherwin-Williams Co.    Cleveland, OH 44115
Jun 30, 2003 Fast Cladâ„¢ DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4–6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water, and can be used directly over prepared steel.

Master Bond, Inc.    Hackensack, NJ 07601
Jun 17, 2003 Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30–40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is 70,000–80,000 cps and operating temperature is 4°K to 250°F.

Premix Thermoplastics, Inc.    Milton, WI 53563
Jun 11, 2003 PRESEAL(TM) highly conductive, thermoplastic elastomers are formulated for EMI/RFI gasketing in electronics industry. They can be injection molded into complex shapes and sizes and can be extruded, or over-molded onto HIPS, ABS, PC/ABS, PC, and PPO-PS for molded-in gaskets. Compounds provide EMI shielding and have volume resistivity of <0.01 ohm-cm, 100 dB shielding effectiveness, and <35% compression set.