Tra-Con, Inc.
Bedford, MA 01730
Nov 03, 2005 Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.

Aremco Products, Inc.
Valley Cottage, NY 10989
Oct 26, 2005 Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365°F. Along with electrical insulation, product exhibits chemical resistance to acids, alkalis, organic fluids, and salts. Flexural strength is 12,300 psi, dielectric strength is 480 V/mil, and dielectric constant is 4.7 @ 1 kHz. Cured product exhibits linear shrinkage of .003 in./in. and Shore-D hardness of 92.

Tra-Con, Inc.
Bedford, MA 01730
Oct 25, 2005 Thermally conductive, electrically insulating Tra-Cast LX50019 is used for staking and setting transistors, diodes, resistors, integrated circuits, and other heat-sensitive components in printed circuit electronic applications. RoHS-compliant product develops high-impact bonds at room temperature, and has coefficient of thermal expansion that makes it compatible for bonding variety of substrates including silica, steatite, alumina, and sapphire.

Devcon
Danvers, MA 01923
Oct 20, 2005 Consisting of alumina-filled epoxy compound, Ceramic Repair Putty(TM) is engineered to form smooth barrier against abrasion, corrosion, cavitation, and chemical attack. Non-sagging product covers 66 sq-in./lb at thickness of ¼ in. Applied with trowel, putty fills voids, protecting equipment from further damage. Pot life is 25 min, and functional cure is attained in 16 hr at room temperature. Once cured, putty withstands service temperatures to 150°F wet and 350°F dry.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 11, 2005 With 1:1 mix ratio by weight or volume, low-viscosity EP37-3FLF cures at room temperature and bonds to metal, glass, ceramic, rubber, and plastic substrates. Bonds offer resistance to impact, shock, and thermal cycling. Also usable as potting and encapsulation compound, product has service operating temperature range of -80 to +250°F, Shore D hardness of 30, and tensile strength of 4,000 psi at 75°F. Peak exotherm for 200 gm mass is 40°C.

Cotronics Corp.
Brooklyn, NY 11232
Oct 05, 2005 Electrically conductive, 400°F Duralco 125 requires no measuring, mixing, or clean up of excess epoxy. User snaps on static mixing tube and squeezes to apply. Product cures at room temperature, with no objectionable odors, to provide thermal and mechanical shock strength, adhesion to dissimilar substrates, and chemical resistance. Applications include flexible circuits, solder replacement, bonding semiconductors, EMI shielding, and assembling heating elements.

Tra-Con, Inc.
Bedford, MA 01730
Sep 30, 2005 With working life of 60 min, black medium-viscosity TRA-CAST 3145 can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. Product is thermally conductive, electrically insulating, and suitable for staking transistors, diodes, resistors, ICs, and other heat-sensitive components in PCB applications. TRA-CAST 3145 has 100% reactive solids content, offers Shore D hardness of 90, and is also useful as potting compound.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 23, 2005 With operating temperature of 4°K to 400°F, thermally conductive, electrically insulative EP21TCHT-1 cures at room temperature or more rapidly at elevated temperatures. It features mix ratio of 100:60 by weight and mixed viscosity of light paste. Product is 100% reactive and does not contain solvents or diluents. It adheres to metals, ceramics, glass, wood, vulcanized rubbers, and most plastics, and withstands exposure to water, fuels, and most organic solvents.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Sep 23, 2005 Loctite® 3355(TM) works on colored and opaque substrates such as metals, plastics, glass, and ceramics that cannot transmit light. Once dispensed onto opaque part, exposure to UV light at 254-365 nm for 5-60 sec activates adhesive, which cures to fixture strength in minutes and reaches full cure in hours at room temperature. Single component, medium viscosity product requires no mixing, exhibits chemical resistance, and shrinks less than 0.7% during cure.

Cotronics Corp.
Brooklyn, NY 11232
Sep 14, 2005 Supplied in hand-held applicator, 400°F Duralco 125 cures at room temperature to provide electrical conductivity, thermal and mechanical shock resistance, adhesion to dissimilar substrates, and chemical resistance. No mixing or measuring is required. Adhesive is suited for manufacture and repair of flexible circuits, solder replacement, bonding semiconductors, EMI shielding, bonding thermistors, and assembling heating elements.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 31, 2005 Suited for potting, encapsulation, sealing, and bonding, Polymer System EP39MHT exhibits electrical insulation and chemical inertness for service up to 450°F. This 2-component system cures at ambient or elevated temperatures, is 100% reactive, and contains no VOCs. Able to bond similar and dissimilar substrates, cured product is thermoset solid featuring resistance to thermal and/or mechanical shocks and can be color-coded to facilitate processing.

Epoxies Etc.
Cranston, RI 02921-3407
Aug 25, 2005 Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75–80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130°C, and dielectric strength of 450 V/mil.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 05, 2005 Resistant to thermal shock, EP45HT MED is formulated for use in assembly of reusable medical devices. This 2-component epoxy adhesive requires min heat cure of 250°F and withstands exposure to repeated cycles of radiation, steam (autoclaving), and chemical sterilants. Able to handle long-term exposure to temperatures from -80 to +500°F, cured system acts as electrical insulator and meets biocompatibility requirements of USP Class VI specifications.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 02, 2005 Nickel-filled, 2-component EP21TDCNFL is 100% reactive and does not contain solvents or volatiles. Product is prepared using 1:1 mix ratio by weight or volume, and once cured, has volume resistivity of less than 5^-10 Ω/cm and tensile lap shear strength of 2,000 psi. Temperature range of 4°K to 250°F makes adhesive suited for cryogenic applications. Bonds offer thermal resistance as well as shock and vibration resistance.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 27, 2005 Two-component Master Bond EP30DP epoxy/urethane elastomer can be cast in thick cross sections without development of undue exotherm during cure. With service operating temperature of -80 to +250°F, product is formulated to cure at room temperature or more rapidly at elevated temperatures. Cured compound offers abrasion resistance and electrical insulation. Polymer system has Shore A hardness of 85, is 100% reactive, and does not contain solvents or dilutents.

Tra-Con, Inc.
Bedford, MA 01730
Jul 26, 2005 With 1:1 mix ratio and Shore D hardness of 65, TRA-BOND 2170T suits applications that require chemical fastening to plastic parts. Amber epoxy adhesive bonds nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton, and other thermoplastic substrates. Featuring working life of 2 hr, product and can be cured in 24 hr at room temperature or at accelerated rate in 65°C heat. Industries of use include medical, aerospace, photonic, and automotive.

Tra-Con, Inc.
Bedford, MA 01730
Jul 26, 2005 High-viscosity TRA-BOND 216R01 exhibits lap shears of 3,600 psi with room temperature cure and 4,500 psi with 65°C heat cure. Product is tested and certified to requirements of UL94 V-O and is RoHS compliant.

Norplex Micarta
Postville, IA 52162
Jul 13, 2005 Thermoset composite material, Type NP510UD, combines unidirectional glass fabric with epoxy resin system that features Tg of 130°C. It provides flexural strength of 103,000 psi in machine direction and 30,000 psi in cross direction. Tensile strength is 56,000 psi in machine direction, while compressive strength is 43,000 psi in direction perpendicular to laminations. Applications include leaf and vibratory springs in papermaking machines and conveyors.

Permabond
Somerset, NJ 08873
Jul 11, 2005 Resistant to harsh environmental conditions, chemicals, and water, adhesive range includes clear, non-yellowing epoxy as well as flexible grade with peel-strength that allows flexibility of joint design while maintaining performance. Products come in dispensing cartridges with mixing nozzles and have 1:1 mix ratio of resin and hardener. They are suited for bonding, sealing, encapsulating, and repairing plastics, metal, composites, ceramics, and wood.

Tra-Con, Inc.
Bedford, MA 01730
Jun 16, 2005 Manufactured as 2-part, low-viscosity epoxy, flexible TRA-BOND 2170T bonds all types of plastic, including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton, and thermoplastic substrates. Epoxy can be room temperature- or heat-cured and exhibits lap shear strength of 2,500 psi. Also available in thixotropic formulation, material suits applications in automotive, medical, aerospace, and photonics industries.