Conductive Compounds, Inc.
Londonderry, NH 03053
Nov 04, 2008 Silver-filled, 2-part EP-600 attaches components, such as resistors, LEDs, and grounding wires to metal and plastic substrates where high temperature curing cannot be used. Electrically conductive product cures at temperatures from 20-140°C with cure times from 48 hr to 2-6 min, depending on temperature. Available in pre-weighed pouches, EP-600 works in high-speed automated dot dispense and screen printing production machines, as well as handheld dispensing equipment.

Conductive Compounds, Inc.
Londonderry, NH 03053
Oct 17, 2008 Silver-filled, 2-part epoxy adhesive (EP-600) is designed to attach electrical components to metal/plastic substrates. It accelerates manufacture of PTF circuits built on temperature-sensitive substrates and cures at temperatures from 20 to 140°C with times from 48 hr to 2-6 min; snap cure times are possible at higher temperatures. Elasticity allows for differences in thermal expansion properties of bonded components and for flexing/bending substrates without fracturing SMT joints.

Unisorb Installation Technologies
Jackson, MI 49204 1000
Oct 13, 2008 Available in pre-measured and proportioned kit sizes, Ship Safe Standard V-100 contains no regulated compounds according to USA, Canadian, and EU transportation agencies. Being free from hazardous material regulations eliminates fees associated with shipping hazardous classified epoxies. Product comes in 11 lb kit yielding 181.5 cu-in., 22 lb kit yielding 363.0 cu-in., and 55 lb kit yielding 907.5 cu-in.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Oct 01, 2008 Adhering to variety of transparent conductive oxides, Silver Conductive Inks and Adhesives operate in high humidity environments and provide optimal environmental aging. Inks are used in grid lines and buss bars printed onto TCO's in thin film solar cells, while adhesives connect multiple solar cells to build arrays. Two-component 118-09A/B187 ink offers 0.0005 W-cm volume resistivity, while single-component 123-39C adhesive features volume resistivity of 0.0003 W-cm.

Instarmac Group plc
Dordon B78 1SE  United Kingdom
Sep 29, 2008 Consisting of solvent free, 2-part epoxy resin system, DPM IT One Coat cures within 18-24 hr to provide waterproof surface membrane. Product prevents passage of moisture into subsequent layers, is pigmented blue for visual control over coverage uniformity, and is suitable for isolating moisture where relative humidity values are above 92%. Designed for use with damp proof membranes, DPM IT A Additive reduces curing times to as little as 3 hours after application.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 26, 2008 Available in ½ pint, pint, quart, gallon, and 5 gal kits, Master Bond EP30 features low viscosity, chemical resistance, dimensional stability, hardness, optical clarity, and electrical insulation properties. It is used in potting and encapsulating electronic components as well as in bonding optical elements, and has adhesion to metals, ceramics, glass, and plastics. EP30 has lap shear strength exceeding 3,000 psi for aluminum to aluminum bonds, and low shrinkage upon cure.

Epoxies Etc.
Cranston, RI 02921-3407
Sep 05, 2008 Able to cure in 30 min @ 150°F, 10-3022 is used to bond polyester mesh to aluminum frames and stainless steel foil to polyester mesh. Adhesive forms impact-resistant bonds and retains strength after cleaning stencils. Featuring 2:1 by volume mix ratio, product also exhibits resistance to shock, vibration, and flexing. In addition to 50, 200, and 400 ml TriggerBond® dual barrel cartridges, 1 and 5 gal packages are available.

Aremco Products, Inc.
Valley Cottage, NY 10989
Sep 03, 2008 Suited for aerospace manufacturers, ASTM E-595 compliant Aremco-Bond(TM) 631 two part, modified epoxy has tensile shear strength of 3,000 psi as measured by ASTM D1002-94, volume resistivity and dielectric strength of 1.2 x 1,014 Wcm and 440 V/mil respectively, and maximum operating temperature of 204ºC. It features total mass loss of 0.75% at 125ºC, and collected volatile condensable materials of 0.35% at 25ºC. Epoxy is resistant to various acids, bases, salts, and organic fluids.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Aug 04, 2008 Offered for variety of application techniques such as screen-printing, pad-printing, stencil application, and B-staged films, 118-06 series of single-component, electrically conductive, epoxy adhesives are also available as adhesive films, pre-cast on release liner at dry thicknesses ranging from 10-125 microns. B-staged adhesive films are already partially cured and can complete cure with exact amount of heat/pressure for specific period of time.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 01, 2008 USP Class VI- and FDA-approved, EP41SMED low-viscosity epoxy adhesive has 5:1 mix ratio by weight. Bonds are resistant to water, oil, and many organic solvents as well as cold sterilants, ETO, and gamma radiation. It contains no solvents or diluents, adheres to wide variety of similar and dissimilar substrates, and is available for use in pint, quart, gallon, and 5 gal container kits. Shelf life in original unopened containers is 6 months minimum.

Chemline Inc.
St. Louis, MO 63103
Jul 14, 2008 With mix ratio of 4A:1B, Monomid(TM) Epoxy Flooring System forms cleanable, high-gloss finish. It offers 5 mils DFT in one coat when applied over Monomid Clear Sealer and can be applied over various other primers for application on steel. Solution supports addition of anti-slip aggregate or sand and also offers moisture resistance. In 3 hr at 77ºF, coating dries to touch to form abrasion- and chemical-resistant finish. Use is suited for industries requiring low odor and VOC levels.

Huntsman Corp.
The Woodlands, TX 77380
Jul 09, 2008 Semi-flexible, cycloaliphatic epoxy material Araldite® S-HCEP is designed for producing sheds on reinforced fiber-core composite insulators used in medium- to high-voltage outdoor power applications. It exhibits intrinsic hydrophobicity, hydrophobicity transfer, and recovery. Requiring no stirring, degassing, or pre-heating, erosion resistant epoxy has 1:1 mix ratio by volume, permitting meter-mixing on same type of equipment used for liquid silicone rubber.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 07, 2008 Formulated to cure at room temperature, 2-component Supreme 11AOHT can be applied without sagging or dripping. It has mixing ratio of 1:1, operating temperature of -100 to +400°F, thermal conductivity of 10 BTU/in/ft²/hr/°F, and dielectric strength of greater than 400 V/mil. Suited for applications involving thermal cycling, product adheres to most metals, ceramics, glass, rubbers, and plastics. Bonds are resistant to water, oil, and most organic solvents.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 26, 2008 Formulated for general purpose bonding, Type EP50-1 produces high strength bonds with more than 2,000 psi at room temperature that are resistant to thermal cycling and chemicals including water, oil, and organic solvents. Suited for metals, glass, ceramics, wood, and vulcanized rubbers, product is approved for service over temperature range of -60 to more than 250°F. It comes in premeasured, flexible divider pouches, disposable cartridges, and in pint, quart, gallon, and 5 gal containers.

Powers Fasteners, Inc.
Brewster, NY 10509
May 21, 2008 Listed as category 1 product for uncracked concrete and dry holes, PE1000+ features 3:1 ratio holding power and meets International Building Code (IBC) requirements for strength design (Cracked Concrete). Dual-component system comes in 13 oz cartridge made from engineered plastic and can be dispensed with manually or pneumatically operated injection tool. Uses include anchoring threaded rod, bolts, reinforcing bars, and smooth dowels into concrete and other solid base materials.

Epoxies Etc.
Cranston, RI 02921-3407
May 06, 2008 One-component, electrically conductive 40-3910 is formulated for electrical and mechanical bonding of semiconductor, capacitor, and resistor chips in micro and opto-electronic hybrid circuit fabrication. Product does not require dry ice during transit and cures quickly at low temperatures. It provides optimized retention of strength after environmental aging.

Master Bond, Inc.
Hackensack, NJ 07601
May 06, 2008 With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165°F for 6-8 hr. Chemical resistant adhesive features mixed viscosity of 400 cps, tensile strength of 6,500 psi, tensile modulus of greater than 375,000 psi, volume resistivity greater than 1,015 W cm, and Shore D hardness of 80.

Master Bond, Inc.
Hackensack, NJ 07601
May 06, 2008 With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohmW cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz. EP121CL is also available in 1-component and thermally conductive versions.

Electronics Assembly, Henkel Corporation
Irvine, CA 92618
Apr 21, 2008 Reflow curable encapsulant material, Hysol® FF6000(TM), combines flux functionality and underfill protection into one solution. It is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. In-line approach eliminates neeed for dispensing equipment as well as time required for underfill application and cure. Areas of use include Package-on-Package device configurattions and/or large (23 x 23 mm or up) BGAs and CSPs.

Aremco Products, Inc.
Valley Cottage, NY 10989
Apr 18, 2008 Used to bond aluminum panels and copper heat exchange tubes, Aremco-Bond(TM) 568 is aluminum-filled epoxy system that offers thermal conductivity of 9.0 Btu-in./hr-ft²-°F and flexural and tensile strength of 11,400 and 2,500 psi, respectively. Resistant to acids, bases, salts, and organic fluids, it mixes in 1:1 ratio by weight or volume, cures at room temperature or with low heat, and provides total mass loss of 0.75% at 125ºC and 0.35% of collected volatile condensable materials at 25ºC.