Master Bond, Inc.    Hackensack, NJ 07601
Jan 14, 2011 Designed to bond to similar and dissimilar substrates, Master Bond EP13ND requires no mixing, has unlimited working life at room temperature, and features service operating temperature of -60 to 450°F. Product cures at temperatures of 300-350°F in 60-90 minutes. Upon cure, adhesive obtains tensile shear strengths in excess of 3,500 psi at 75°F. Formula is 100% reactive, does not contain solvents or diluents, and offers resistance to fuels, acids, bases, oils, and many solvents.

Master Bond, Inc.    Hackensack, NJ 07601
Dec 15, 2010 With thermal conductivity over 22 BTU/in/ft²/hr/°F and serviceability from -60 to +400°F, EP21ANHT helps mitigate issues associated with tightly packed components and miniaturized electronic circuits. This 2-component adhesive, sealant, and coating has 1:1 mix ratio by weight or volume and cures at room or elevated temperatures. Also able to act as electrical insulator, cured adhesive exhibits dielectric strength over 400 V/mil and tensile shear strength over 1,000 psi.

Henkel Corporation    Rocky Hill, CT 06067
Nov 17, 2010 Designed to meet UL-674 requirements for explosion-proof motors, Loctite® E-40EXP(TM) maintains more than 85% of its compression strength following exposure to 13 harsh chemicals. Two-component compound is used to pot and seal wire conduits, isolating electric motor from hazardous vapors and chemicals that could cause explosion. Curing in approximately 2 hours at room temperature, material will not expand and experiences very little shrinkage, facilitating accurate dispensing.

Master Bond, Inc.    Hackensack, NJ 07601
Nov 12, 2010 Formulated for applications subject to temperature cycling, vibration, and mechanical shock, EP21TDCHT-LO withstands cryogenic temperatures and meets NASA low outgassing specifications. It offers 1:1 mix ratio by weight or volume and cures at room temperature or more rapidly at elevated temperatures. Properties include 4K to +350ºF service temperature range, shear strength exceeding 2,500 psi, peel strength of greater than 20 pli, and Shore D hardness of greater than 60.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 22, 2010 Developed for coating and lining storage tanks, piping, scrubbers, and processing equipment in chemical industry, Master Bond EP21ARHT produces bond strength greater than 2,200 psi once fully cured. Also used in electronic, electrical, and metalworking industries, product can withstand immersion in 96-98% sulfuric acid and 20% hydrochloric acid for more than 1 year. Epoxy features dielectric strength of 440 V/mil and can be thermally cycled over temperature range of -60 to +400°F.

Epoxies Etc.    Cranston, RI 02921-3407
Oct 20, 2010 Potting, encapsulating, and casting resin 20-2121 consists of 2-component, room temperature curing system that will cushion sensitive electronic components. With toxicity level that reduces employee exposure to dangerous chemicals, moisture-resistant compound imparts minimal stress on components during cure or thermal cycling. Characteristics include 2,000 psi tensile strength, 80 Shore A Hardness, and respective viscosities of 14,000 and 800 cps @ 25°C for Polyol and Isocyanate.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 01, 2010 Master Bond EP65HT-1 has glass transition temperature exceeding 125ºC, and is serviceable over temperature range of -60 to +400ºF. It features tensile shear strength approaching 3,000 psi, and Shore D hardness greater than 75. Able to bond to metals, glass, ceramics, rubbers, and plastics, this dark brown, electrically insulating adhesive cures at room temperature in 3-5 min in masses of 10-20 g. It is available in dispensing gun that mixes parts with 10:1 ratio.

Creative Materials Inc.    Ayer, MA 01432
Sep 30, 2010 Formulated for optimized bond strength and flexibility required for bonding of solar array components, 124-08 electrically conductive epoxy adhesive features coefficient of thermal expansion compatible with composition of thin film PV cells. This 1- or 2-component, pre-catalyzed solution, which can be injected via syringe or jet dispensed, is resistant to humidity, has cure temperature range of 90 min @ 80°C to 5 min @ 175°C and is RoHS-compliant.

Airtech International, Inc    Huntington Beach, CA 92647
Aug 19, 2010 Toolfusion® 3 is low-viscosity resin formulated to produce pre-preg quality composite molds, with void contents of less than 1% achievable. Initial cure temperature is 120°F and resin can be post cured to achieve glass transition temperature of 425°F. It will work in various RTM and VARTM processes including single and double bag arrangements to produce autoclave quality laminates, which have vacuum integrity for vacuum bag processing of parts in oven and autoclave.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 27, 2010 Able to bond to wide variety of substrates including many metals, plastics, rubbers, ceramics, and glass, 2-part Polymer System EP31 has lap shear strength exceeding 4,600 psi and peel strength of more than 40 pli. Chemically resistant adhesive cures at room temperature or more quickly at elevated temperatures and offers Shore D Hardness of greater than 75 and low shrinkage upon cure. Product is available in black and optically clear versions, as well as non-drip type EP31ND.

Hilti Inc.    Tulsa, OK 74121
Jul 26, 2010 Engineered for structural design and installation communities, Construction Grouts include Multipurpose and Precision Grouts, which meet ASTM C-1107 and CRD-C621 non-shrink standards, and 3-component Epoxy Grout, which is both VOC- and butyl glycidyl ether-free. Products are suitable for baseplate filling, bridge repair, doweling/rebar, machine pad formation, railings, and posts.

SunRay Scientific    Mount Laurel, NJ 08054
Jun 18, 2010 Featuring polymer rheology that maximizes thermal connection and minimizes light loss, MAXIGLOW(TM) 502 conductive silver epoxies are intended for conventional epi-up packaging of LEDs driven at 20 mA. ZTACH(TM) anisotropic conductive adhesives, intended for flip chip packaging of high-power LEDs driven at 350 mA, enables self assembly process that eliminates need for extra processing steps. Both lead-free products are used for packaging of high brightness LEDs (HBLEDs).

Master Bond, Inc.    Hackensack, NJ 07601
Apr 16, 2010 Combining quartz filler and amine compound, Supreme 45HTQ is suited for bonding and encapsulating transducers, gauges, actuators, and sensors in harsh environments. Epoxy adhesive features tensile strength exceeding 8,500 psi and compressive strength greater than 20,000 psi. Resistant to chemicals, acids, oils, water, and steam, product can withstand long term exposure to 400-500°F temperatures. Rate of thermal expansion is 30-35 X 10^-6 in./in.°C.

Master Bond, Inc.    Hackensack, NJ 07601
Apr 14, 2010 Withstanding long-term exposure to wide temperature ranges between -100 and +500°F, two component Supreme 46HT-2 delivers high performance structural bonding to both similar and dissimilar substrates. It has mixing ratio of 100 to 30, and cures at elevated temperatures of 250°F min. Applications include aerospace, electronic, metalworking, transportation, appliance, and chemical/oil processing. Supreme 46HT-2ND2, a non-drip version that will not flow during cure, is also available.

Creative Materials Inc.    Ayer, MA 01432
Apr 08, 2010 Type 118-15, 123-39, 124-08, and 125-18 are 100% solids silver-filled epoxy systems designed for attachment of electronic components. Featuring 1:1 mix ratio by weight, RoHS-compliant products are fast curing, resistant to thermal shock, and cure in temperatures as low as 80°C. They are dispensible via syringe or high-speed jet dispensing systems in dots or lines as narrow as 1-3 mils. Each type exhibits other specific characteristics adventageous for specific applications.

Master Bond, Inc.    Hackensack, NJ 07601
Mar 30, 2010 Formulated for service from -73°C to over +205°C, Supreme 11HT produces bonds that exhibit tensile shear strength in excess of 2,300 psi and T-peel strength of 25 pli. This 2-part structural adhesive, which is 100% reactive and cures at room temperature or above, does not contain any diluents, solvents, or hazardous ingredients. Formula is resistant to impact, thermal shock, vibration, and fatigue cracking as well as moisture, creep, and corrosion.

Aremco Products, Inc.    Valley Cottage, NY 10989
Mar 29, 2010 Used for repairing defects and corrosion pitting in aluminum molds and wear surfaces, Aremco-Bond(TM) 2210 aluminum- and ceramic-filled compound provides abrasion, corrosion, and impact resistance. Tensile shear strength is 2,600 psi, and flexural strength is 14,100 psi. Mixed in 100:14 ratio of resin to hardener by weight, 100% solids epoxy cures at room temperature in 24-48 hr and can be accelerated by heating to 200°F for 4 hr. Cured product is machinable and has 89 Shore-D hardness.

Master Bond, Inc.    Hackensack, NJ 07601
Mar 22, 2010 Offering optical clarity and chemical resistance, UV10TKLO-2 is not oxygen inhibited and cures rapidly at room temperature when exposed to UV light. Maximum UV absorption takes place in 320-365 nm range. One component, modified epoxy system has volume resistivity of greater than 10¹⁴ W cm, dielectric constant of 3.6 at 60 Hz, and service temperature of -60 to 300°F. Product is suited for optical, electro-optical, and vacuum applications.

Progressive Epoxy Polymers, Inc.    Pittsfield, NH 03263
Nov 20, 2009 Bio Clear 810(TM) is solvent free, clear epoxy used for object encapsulation (marine, electronic, and gift industries) as well as poured-on bar top and table top applications. Features include low exotherm kick, slow UV epoxy yellowing, and low viscosity, making it suited for poured applications between 1/4 and one inch thick. Bio Clear 810 has a 2:1 mix ratio.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 30, 2009 Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50°C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow, setup, and handling properties suited for large potting and encapsulating applications.