Master Bond, Inc.
Hackensack, NJ 07601
Nov 30, 2007 Curing at room temperature when exposed to UV light source, UV22 nanosilica-filled, one-component, UV-curable epoxy is not oxygen inhibited. Abrasion-resistant epoxy has service operating temperature range of -60 to +300°F and adding 195-257°F for 30 min gives it glass transition temperature of 275°F. It has Shore D hardness of greater than 80, tensile strength of greater than 4,600 psi, refractive index of 1.52, and shrinkage of 1-2%.

Power Adhesives Ltd
Basildon, Essex   United Kingdom
Nov 27, 2007 KNOT-TEC(TM) System lets manufacturers of such products as windows, doors, and furniture use entire board, rather than just portions before or knot or defect. Combining TEC(TM) 250 hot melt adhesive applicator and TECBOND(TM) 7718/12 polyamide hot melt glue sticks, system repairs knots and fills wooden surfaces so that they are smooth and unnoticeable prior to painting/finishing. Solution performs repairs in seconds, and any surplus glue can be removed with chisel or cutting tool.

Epoxies Etc.
Cranston, RI 02921-3407
Nov 21, 2007 Formulated with high purity polymers and ultraviolet protectors, Type 20-3302 epoxy system is formulated to minimize yellowing when cured. Curable at room temperature, it features water clear clarity, bubble free castings, and low viscosity for quick self leveling. Available in 2 different viscosities, it is suited for LED potting, fiber optics, and other clear adhesive or encapsulating applications.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 08, 2007 Formulated to cure quickly at ambient temperatures, Supreme65HT-6 produces bonds with tensile lap shear strengths in excess of 3,000 psi for service in temperature range of below -80°F to +400°F. It is resistant to vibration, stress fatigue cracking, moisture, creep, and corrosion. Available in pre-measured bubble packs, cartridges, ½ pint, pint, quart, gallon, and 5 gal containers, unit offers adhesion to metal, glass, ceramics, wood, vulcanized rubbers, and plastics.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 30, 2007 With elongation of greater than 60%, Type EP21TDCSFL is 100% reactive epoxy adhesive that has has 1:1 mix ratio by weight/volume, does not contain diluents/solvents, cures at room temperature, and offers mechanical shock resistance and low outgassing properties. Features include volume resistivity of less than 10^-3 W cm, tensile shear strength of greater than 1,500 psi, T-peel of greater than 30 pli, and thermal conductivity of 11 BTU/in./ft²/hr/°F.

Air Products & Chemicals, Inc.
Allentown, PA 18195
Oct 16, 2007 With zero VOCs, Ancarez(TM) AR555 is suited for floor, institutional, and OEM coating applications. Fast-dry performance optimizes sandability and stackability, while coalescing properties enable uniform film formation, and anti-corrosive attributes make product suitable for providing protection.

Henkel Corp.
Madison Heights, MI 48071
Sep 10, 2007 Hysol FP4581 and FP4583 underfill systems adhere to SiN and polyimide and deliver combination of thermal mechanical characteristics to prevent delamination, bump fatigue, and UBM failure. With low CTE properties, Hysol FP4581 forms rigid, low stress seal that dissipates stress on solder joints. Hysol FP4583 contains fillers that are less than or equal to 2 microns in diameter and is formulated for use with overmolded components in high-lead and lead-free applications.

Epoxies Etc.
Cranston, RI 02921-3407
Aug 29, 2007 Filled with pure silver, electrically conductive 40-3900 features electrical resistivity value of less than 1 x 10^-4 W-cm and operating temperature range of -50 to +170°C. Product cures in 24 hr at 25°C, 1 hr at 65°C or 15 min at 90°C. In addition to chip bonding in microelectronic and optoelectronic applications, 2-component resin is suited for microwave EMI and RFI shielding, assembly and repair of PCBs, and as cold solder.

Aremco Products, Inc.
Valley Cottage, NY 10989
Aug 16, 2007 Offering temperature resistance up to 350°F, Aremco-Bond(TM) 2300 consists of 100% solids epoxy mixed in ratio of 10 parts resin to 1 part hardener by weight. Mixed viscosity is 5,000 cP and pot life for 100 g mass is approximately 45 min. Milky-clear product provides resistance to acids, alkalis, organic fluids, and salts. Supplied in pint, quart, and gallon kits, adhesive is suited for bonding engineered thermoplastics, ceramic wear tiles, and sheet molding compounds.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 06, 2007 In 6 mil thick films, Master Bond EP27 will set in as little as 2 hr at 40°F and will cure in 48-72 hr. Product has non-critical mix ratio of 2:1 by weight or volume and mixed viscosity of 2,000 cps. Cured epoxy resin offers long-term resistance to immersion in aggressive solvents such as ethanol, toluene, butyl cellosolve, 70% sulfuric acid, 30% nitric acid, 50% sodium hydroxide, and bleaches. It also offers high bond strength to metallic and non-metallic substrates.

Cotronics Corp.
Brooklyn, NY 11232
Jun 05, 2007 Able to adhere to plastic surfaces as well as metals, ceramics, and glass, Bond-It 7050 bonds to Nylon, PVC, and dissimilar/difficult-to-bond materials. No special surface preparation is required. Users mix and apply, and product cures at room temperature to form 400°F bonds that exhibit temperature stability as well as electrical, thermal, and chemical resistance. Available in regular or fast-setting grades, activated 400°F epoxy incorporates adhesion promoters into its structure.

Epoxies Etc.
Cranston, RI 02921-3407
May 01, 2007 Impact resistant epoxy adhesive Type 10-3216 bonds to metals, woods, plastics, rubbers, and masonry products. Featuring 1:1 mix ratio, it will not crack, and is available in low viscosity translucent version as well as high viscosity gray version. Structural adhesive can be used in cryogenic bonding and is suitable for many aircraft and aerospace applications.

Master Bond, Inc.
Hackensack, NJ 07601
Apr 11, 2007 Providing resistance to water and chemicals, 2-component EP37LV-1 Polymer System features tensile strength in excess of 8,300 psi, working life of 30 min at room temperature, and final mix viscosity of 5,000 cps. Full cures are obtained in 8-10 hr, while complete cures take longer at lower temperatures. Applications range from grouting, troweling and concrete patching in damp locations to marine coatings, floor toppings, and solder substitutes for copper pipe joints.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Mar 13, 2007 Pre-applied to board at corners of CSP pad site using standard dispensing system, one-component Loctite® Cornerbond(TM) 3508 cures during normal lead-free solder reflow, allowing for self-alignment of IC components. It provides 6-month shelf life, pot life greater than 75 hr, and ability to use standard refrigerated storage. Reworkable feature enables defective components to be removed without requiring entire assembly to be scrapped.

Huntsman Advanced Materials
Los Angeles, CA 90039-1011
Mar 08, 2007 Featuring chemical and moisture resistance, ARALDITE® Epoxy Adhesives are suitable for bonding and potting electronic components. Room temperature- and elevated temperature-curing products are RoHS-compliant and sag resistant. Providing lap shear strength, high-temperature ARALDITE® Polyurethane Adhesives can bond hard-to-join thermoplastic substrates and encapsulate pressure-sensitive components. All come in dual-barrel cartridges as well as bulk packaging for automated mixing/dispensing.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 02, 2007 With service temperature range of -60°F to over 400°F, Type EP30HT epoxy produces high strength, rigid, chemical resistant bonds, and adheres to similar and dissimilar materials such as metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Product attains shear bond strengths over 3,200 psi, with volume resistivity greater than 1,015 W-cm, dielectric strength of 440 V/mil, and dielectric constant of 3.46 at 1 MHz.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 09, 2007 Suitable for use in both thick/thin sectioned configurations, EP21TDC-2LO bonding, sealing, coating, and encapsulation system has thermal conductivity of 9 BTU/in./ft²/hr/°F and volume resistivity of 1,012 Wcm. With service operating temperature range of 4 K to 250°F, room temperature curable product features Shore D hardness of 36, elongation of 50%, 1:3 mix ratio by weight or volume, working life of 90 min for 100 g mass, tensile strength of 1,070 psi, and T-peel strength of 15 pli.

Henkel Consumer Adhesives, Inc.
Avon, OH 44011-1355
Jan 23, 2007 Hysol® FP5110 offers adhesion to 2- and 3-layer flexible printed circuits by bonding to polyimide and epoxy adhesive material. It provides an alternative to mechanical soldering by bonding bumps to substrate through lead-free compatible thermal compression process that eliminates need for flux application, reflow, and cleaning. Other features include 10 sec SnapCure at 180°C, storage requirements of -15°C, and compatibility with ultrasonic bonding processes.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jan 05, 2007 Consisting of 2-component, 100% solids, aluminum-filled epoxy, Aremco-Bond(TM) 805 is suited for bonding, potting, and tooling applications. It adheres to high temperature plastics as well as glass, ceramic, and high-expansion metals. Product cures at room temperature in 24 hr or at 200°F in 2 hr. After curing, it exhibits thermal conductivity of 12.5 Btu-in./hr-ft²-°F and dielectric strength of 50 V/mil. Tensile shear and flexural strengths are 1,800 and 15,500 psi, respectively.

Aremco Products, Inc.
Valley Cottage, NY 10989
Nov 27, 2006 Used in applications requiring bond strengths up to 4,770 psi, 2-part, ceramic-filled Aremco-Bond(TM) 2310 is gray-pigmented, 100% solids epoxy adhesive with flexural strength of 12,000 psi, volume resistivity of 3.0 x 10¹³, dielectric strength of 410 V/mil, and dielectric constant of 4.28 at 1 kHz. Cured product exhibits linear shrinkage of .001 in./in. and Shore-D hardness of 78. Recommended cure is 2 hours at 150°F or 48 hr at room temperature.