Tra-Con, Inc.
Bedford, MA 01730
Sep 17, 2003 TRA-BOND 2248 high-temperature epoxy staking adhesive bonds to metals, glass, ceramics, and plastics in applications up to 190°C.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Sep 12, 2003 Hysol® U-09FL features storage stability, and once mixed, offers 10 minute work-life. Two-component urethane cures at room temperature in 3-24 hr. Ultra-clear and highly flexible, product is suited for applications that require clear, non-yellowing bondline. Hysol U-09FL bonds polycarbonate and variety of other plastics, as well as glass and metal.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Sep 08, 2003 Hysol® GR725 consists of semiconductor-grade molding compound suited for use on Power ICs and Power Discrete devices that operate at high temperatures and require electrical stability. Green, non-Bromine/Antimony, epoxy cresol novolac-type material is flame retardant and adheres to Ni/Pd/Au and Cu/Ag lead frames. It provides 20,000 hrs at 200°C HTSL. Product meets JEDEC Level 1, 260°C reflow requirements and UL 94 V-O at 1/8 in. thickness.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 28, 2003 Supreme 10HT adhesive resists mechanical vibration, impact, and shock; requires no mixing; and cures at temperatures above 250°F. Single component system can be stored at ambient temperatures and has min storage stability of 3 months up to max of 6 months without refrigeration. Product passes NASA outgassing test requirements and has operating temperature range of 4°K to 400°F. It is available in pint, quart, gallon, 5 gal, and drum containers.

Electronic Materials, Inc.
Breckenridge, CO 80424 8817
Aug 28, 2003 EMCAST V-150 and V-151 epoxy adhesive systems mate 2 UV-blocking substrates by pre-exposing epoxy adhesives to UV and visible light, then, after surfaces are mated, using room temperature or heat cure to solidify bond. EMCAST V-150 has 12,000 cps viscosity, 77 Rex D hardness, 4,400 psi tensile strength, and lap shear strength to 3,500 psi. EMCAST V-151 exhibits 15,000 cps viscosity, 82 Rex D hardness, 6,400 psi tensile strength, and lap shear strength to 3,800 psi.

Tra-Con, Inc.
Bedford, MA 01730
Aug 25, 2003 Tra-Duct 926K01 consists of silver, 2-part epoxy adhesive that develops electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Able to be heat cured in one hour at 100°C, medium viscosity product is recommended for electronic bonding, coating, and sealing applications. It can be used as flexible cold-solder for heat sensitive components.

Devcon
Danvers, MA 01923
Aug 25, 2003 Offered as liquid or putty, Flexane® Fast Cure consists of 100% solids urethane compound that is suited for making repairs to worn or damaged conveyor belts and other rubber equipment. It bonds to rubber, metal, concrete, fiberglass, and wood and cures to functional medium-hard rubber in 1.5 hrs. Compound has working time of 8 min, is tack-free in 30 min, and withstands service temperatures up to 120°F (wet) or 180°F (dry).

Masterbond, Inc.
Lake In The Hills, IL 60102 9600
Aug 19, 2003 Type EP3RRLV cures in 30–35 min at 220°F and 10–15 min at 300°F. It offers electrical insulation, thermal shock and heat resistance, and protection against water and chemicals. Epoxy requires no mixing and has unlimited working life at room temperature. It bonds to metals, ceramics, glass, and most plastics. Suited for potting, encapsulation, and underfill applications, EP3RRLV has tensile strength of >5,000 psi, Shore D hardness of 80–85, and viscosity of 1,000–1,500 cps.

Bettcher Industries, Inc.
Vermilion, OH 44089
Aug 12, 2003 Single-component, heat-curing EP17 is chemically resistant and bonds to substrates such as metals, glass, ceramics, vulcanized rubbers, and plastics. With operating range of -300 to 600°F, 100% reactive product contains no solvents or diluents and will not sag or drip on vertical surfaces. Product cures at temperatures from 300–350°F in 60–90 min and has tensile strength is 8,700 psi, Shore D hardness of 90+, and compressive strength of 13,000+ psi.

Tra-Con, Inc.
Bedford, MA 01730
Aug 08, 2003 TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75°C and in 24 hr at 25°C.

Kester Solder Co.
Des Plaines, IL 60018
Aug 06, 2003 Suited for throughput assembly of flip chip devices on rigid and flexible substrates, SE-CURE® 9208 consists of filled one-component, snap-cure underfill epoxy material. Product eliminates resin bleedout and allows for uniform, void-free encapsulation under die for gaps of 0.001–0.005 in. With operating temperature range of -55 to +150 °C, product cures below glass transition temperature.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 30, 2003 Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is available in thicknesses of 2–8 mils and up to 16 in. sq.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jul 29, 2003 Aremco-Bond™ 568 2-part, 1:1 mix, aluminum-filled epoxy system provides mechanical strength and thermal conductivity to 400°F, making it suitable for bonding aluminum and copper heaters and heat sinks. Thermal conductivity is 9.0 Btu-in./hr-ft²-°F, and flexural and tensile strength is 11,400 and 2,500 psi, respectively. Aremco-Bond™ 568 is resistant to wide range of acids, bases, salts, and organic fluids. It has passed NASA outgassing studies to ASTM E-595.

Vantico Inc.
Los Angeles, CA 90039-1011
Jul 15, 2003 Gap filling, sag resistant Araldite 2015 epoxy securely joins dissimilar materials used in fabricating bike accessories. It attains handling strength after 4 hours at room temperature and produces joints with lap shear strength of 3,200 psi at room temperature. Epoxy dispenses, waste-free, from 50 ml, dual barrel cartridges and handles temperatures from -67 to 250°F. Adhesive produces durable joints on aluminum, titanium, and fiber composite substrates.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 11, 2003 Master Bond Polymer System Supreme 10HTFL one component, flexible, epoxy resin based adhesive/sealant cures to flexible thermoset polymer at temperatures of 250–300°F and above and does not require refrigeration for extended storage before use. It adheres to metallic and non-metallic substrates and exhibits tensile lap shear strengths of more than 2,000 psi and T-peels in excess of 60 pli. Product is resistant to thermal and mechanical shock and vibration and chemicals.

Roland DGA Corporation
Irvine, CA 92618 2201
Jul 01, 2003 Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ft³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ft³ density and 27 Shore D hardness. Suited for milling foundry patterns and core boxes, High Density Urethane SRP boards offer 75 lb/ft³ density and 85 Shore D hardness.

Sherwin-Williams Co.
Cleveland, OH 44115
Jun 30, 2003 Fast Clad™ DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4–6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water, and can be used directly over prepared steel.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 17, 2003 Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30–40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is 70,000–80,000 cps and operating temperature is 4°K to 250°F.

Cotronics Corp.
Brooklyn, NY 11232
Jun 11, 2003 Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400°F service, product provides high temperature stability, and electrical, thermal, and chemical resistance.

Tra-Con, Inc.
Bedford, MA 01730
Jun 10, 2003 TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.