Master Bond, Inc.
Hackensack, NJ 07601
Oct 19, 2004 Suited for bonding, sealing, coating, encapsulation, and casting, EP30P transparent, 2-component epoxy system cures at room temperature, which can be accelerated by use of heat. Electrically insulating, 100% reactive system contains no solvents or diluents and exhibits minimal linear shrinkage upon cure. With tensile strength that exceeds 9,500 psi, product has mixed viscosity of 1,200–1,400 cps and resists water, acids, bases, and salts.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 04, 2004 Type EP34AN room temperature cure, 2-component epoxy adhesive/sealant, with thermal conductivity of 22–24 BTU/in/ft²/hr/°F, maintains physical properties after prolonged exposure to temperatures from 400–450°F. It exhibits dimensional stability and electrical insulation properties and can be applied without sagging or dripping. Able to bond to various substrates, 100% reactive epoxy has Shore D hardness of greater than 85 and tensile strength of 5,500 psi.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 17, 2004 EP30FL Epoxy Potting and Encapsulation compound has low viscosity and can be used in both thick and thin cross sections. Generating low exotherm during cure, it cures at room temperature with low shrinkage. Electrically insulated compound adheres to both similar and dissimilar substrates, is 100% reactive, does not contain any volatiles, and withstands mechanical shock and vibration.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 06, 2004 Dual-component EP42HT-2 epoxy adhesive, sealant, coating, and casting material withstands repeated sterilizations, including radiation, ethylene oxide, chemical sterilants, and steam. Featuring service operating temperature range of -60 to +450°F, product exhibits chemical resistance and Shore D hardness greater than 75. Properties include mixed viscosity of 3,500 cps and tensile strength greater than 12,000 psi. It is castable in thicknesses exceeding 2–3 in.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Jul 28, 2004 Hysol® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260°C reflow temperature.

Devcon
Danvers, MA 01923
Jul 20, 2004 Self-extinguishing, 5 Minute® Epoxy FR fills gaps and bonds rigid substrates such as metals, glass, ceramics, concrete, and wood. Mixed as dispensed, product has 115,000 cps viscosity, 3-5 min working time, 10-15 min fixture time, and 2-3 hr functional cure time. Once cured, it offers tensile shear strength of 2,800 psi on cold-rolled steel and dielectric strength of 490 V/mil. Bonds withstand temperatures from -40 to +200°F and resist motor oil, kerosene, and unleaded gasoline.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 15, 2004 One-component, heat-curing, EP17 offers service operating range of -300 to +600°F and cures in 60–90 min at 300–350°F. Product bonds to metals, glass, ceramics, vulcanized rubbers, and plastics. Chemical-resistant EP17 has Shore D hardness greater than 90, compressive strength greater than 13,000 psi, and tensile strength of 8,700 psi. Flowable paste is 100% reactive, does not contain solvents, and can be applied on vertical surfaces without sagging.

Huntsman Advanced Materials
Los Angeles, CA 90039-1011
Jul 08, 2004 Formulated in light blue, black, orange, and gray, Epocast 1633 epoxy syntactic materials are self-extinguishing and halogen-free. They have 2–5 min work life, are extrudable, and permit insert handling in less than 1 hr at room temperature. After gelling at 77°F and curing for 5 hr @ 120°F, or 2 hr @ 150°F, products exhibits compressive strength of 6,500 psi, lap shear strength of 1,400 psi, and service temperature of 160°F.

Cotronics Corp.
Brooklyn, NY 11232
Jun 08, 2004 Bond-It(TM) 7056AL is filled with activated, aluminum metal creating fast-set, machinable, repair epoxy. With 1:1 mixing ratio, product is dispensed, mixed, and troweled on without running, dripping, or sagging. It cures at room temperature without objectionable or sulphur odors and hardens in 4-8 min. Bond-It 7056AL adheres to smooth, rough, or porous surfaces, including most plastics, metals, ceramics, glass, and wood.

Tra-Con, Inc.
Bedford, MA 01730
Jun 07, 2004 TRABOND 2248 thixotropic, all-liquid system applies at room temperature, but requires high-temperature cure. It bonds to metals, glass, ceramics, and plastics. Ultimate glass transition temperature is 109°C. TRA-BOND 2248 complies with specification ASTM E-595-90 for NASA Outgassing acceptability. It is recommended for applications where good mechanical properties are required at high and low temperatures.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 04, 2004 Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1–2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155°C. It resists chemicals and adheres to wide range of substrates. It is typically cured in 3-5 hr at 125°C.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 03, 2004 Two-component EP24 cures at room temperature or more rapidly at elevated temperatures. It will also cure at colder temperatures, down to 20°F. With mix ratio of 1:1, adhesive is 100% reactive and resistant to thermal cycling and chemicals. It develops high bonding strength of more than 3,000 psi at room temperature and is suited for metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Service operating temperature is -300 to +250°F.

Huntsman Advanced Materials
Los Angeles, CA 90039-1011
May 18, 2004 High-Strength Araldite® AW 8545-1 Resin/Hardener HW 8545-1 epoxy adhesive material bonds metal or composite skins to aluminum or aramid-fiber honeycomb cores. Low coefficient of thermal expansion minimizes read-through from internal honeycomb cores to panel surfaces. Adhesive has 1:1 mix ratio and readily spreadable viscosity of 43,000 cP. Once cured, adhesive produces durable laminates with shear strength greater than 3,000 psi and glass transition temperature of 135°F.

Master Bond, Inc.
Hackensack, NJ 07601
Apr 21, 2004 EP45HTMed 2-component, heat-cured epoxy adhesive withstands long-term exposure from -80 to +500°F and has glass transition temperature of greater than 185°C. It adheres to various materials and withstands exposure to repeated cycles of radiation, steam, and chemical sterilants. Cured system acts as electrical insulator and is formulated for use in assembly of reusable medical devices. It is 100% reactive and does not contain solvents or diluents.

Devcon
Danvers, MA 01923
Apr 20, 2004 Plastic Steel® Putty (A) bonds to metals, concrete, and plastics, forming repairs that can be drilled, tapped, machined, or painted. It resists oil, gasoline, water, and chemicals at service temperatures to 250°F. Able to cure at temperatures down to 40°F, Plastic Steel 5-Minute® Putty (SF) cures to steel-filled material in under 1 hr. Plastic Steel Liquid (B) steel-filled liquid epoxy hardens in 1 hr at room temperature and can be machined to close tolerances.

Tra-Con, Inc.
Bedford, MA 01730
Apr 08, 2004 Moisture-resistant TRA-BOND 789-3T3N1 is suited for side mount staking of components and any application were resistance to wicking and flow is critical. Product exhibits electrical resistance and has viscosity of over 200,000 cps. Thermal expansion coefficient ensures bonding to substrates, and product works on hard-to-bond substrates such as nickel, gold, and copper.

Devcon
Danvers, MA 01923
Mar 24, 2004 Effective at temperatures to 250°F (dry) and 125°F (wet), 4 oz Magic Bond(TM) Epoxy Stick consists of 2-part epoxy putty designed to seal leaks and repair gouges in steel, aluminum, wood, fiberglass, concrete, and ceramics. Product mixes by hand kneading, hardening in 30-40 min to finish that can be painted, sanded, machined, tapped, or drilled. Dual-color putty stick includes resin (green) and activator (white), which blend to uniform light gray.

Tra-Con, Inc.
Bedford, MA 01730
Mar 19, 2004 Tra-Bond 816H02 is suitable for stacking transistors, diodes, resistors, and integrated circuits to PCBs. Rheology of adhesive allows it to stay in place once dispensed. It bonds readily to metals, silica, steatite, sapphire, ceramics, glass, and plastics. It can be cured at room temperature to Shore D Hardness of 90 and has working life of 1.5 hr.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 16, 2004 Two-component, nickel-filled, electrically-conductive adhesive, Type EP76M features volume resistivity of 5-10 ohm-cm and thermal conductivity of 8-9 BTU/in./ft²/hr/°F. Product develops tensile shear strength of 2,000 psi when measured and cured at room temperature. Adhesive is 100% reactive, does not contain dilutents or solvents, and offers thermal shock and chemical resistance. Service operating temperature is -60 to +250°F. Cures can be accelerated by use of heat.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 10, 2004 With 1:1 mix ratio, EP51ND 2-component epoxy adhesive can be applied on vertical surfaces without dripping or flowing. It spreads evenly and smoothly, and only contact pressure is required for cure. Product gels in ~5 min and cures fully at ambient temperatures. Bonded parts can be safely handled within ½ hr. Adhesive exhibits thermal shock and chemical resistance, and hardened product acts as electrical insulator. Service operating temperature is -100 to 250°F.