Epoxy Compounds

Adhesives & Sealants

EP30TC Epoxy offers 7-10 x 10-6 K.m2/W thermal resistance.

February 4, 2017

Suitable for use in bonding, coating, sealing and encapsulating for aerospace and OEM industries, EP30TC Epoxy provides 2.60-2.88 W/(m.K) thermal conductivity. Having 5,000-6,000 psi tensile strength with 24,000-26,000 psi compressive strength, epoxy is used in -100°F to +300°F temperature range. Available in ½ pint, pint, quart, gallon and 5 gallon container kits, EP30TC offers over 1014... Read More

Adhesives & Sealants, Materials & Material Processing

Devcon® Dfense Blok™ with Ez Mix Technology Simplifies Wear & Abrasion Protection in Colder Climates

January 27, 2017

DANVERS, MA - Devcon DFense Blok EZ Mix™ provides the same exceptional wear and abrasion protection as original DFense Blok™, but is easier to mix in colder climates.

DFense Blok™ alumina ceramic bead-filled epoxy wearing compound is specially formulated to outperform and outlast traditional epoxy wear and abrasion products - even in the most severe impact and sliding abrasion... Read More

Adhesives & Sealants

EP42HT-2FG: Food Grade Epoxy System

January 16, 2017

Master Bond EP42HT-2FG is a two part epoxy that fully meets stringent FDA CFR 175.300 and FDA CFR 175.105 food grade testing specifications. It also meets the toxicological requirements of the NSF/ANSI 51 (2009) Standard for Food Equipment Materials as defined in section 4.1. This low viscosity system offers convenient handling and can be used for a wide variety of applications in the food... Read More

Adhesives & Sealants

EP3HTND-2Med Black Curing Epoxy meets USP Class VI standards.

January 12, 2017

Available in ½ pints, pints, quarts, gallons and 5 gallon containers, EP3HTND-2Med Black Curing Epoxy features 5,000-6,000 psi tensile strength. Having 1,600-1,800 psi tensile lap shear strength at room temperature, product bonds to glass, metals and ceramics. Used in -60°F to +400°F temperature, material provides resistance to sterilization methods such as chemical sterilants, EtO,... Read More

Adhesives & Sealants

Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations

January 10, 2017

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving.

As a one component system, EP3HTND-2Med Black does not require any... Read More

Adhesives & Sealants, Materials & Material Processing

Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests

December 13, 2016

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.

EP46HT-2AO Black combines superior thermal... Read More

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Sherwin-Williams Announces Water & Wastewater Impact Award Winners

September 29, 2016

Short Elliott Hendrickson; Champion Coatings; Wapasha Construction; and the city of Austin, Minnesota, take top spot in inaugural program honoring project excellence using Sherwin-Williams Protective Marine Coatings CLEVELAND, OHIO – Short Elliott Hendrickson Inc. (SEH®), Champion Coatings, and Wapasha Construction took top honors in the inaugural Sherwin-Williams Impact Award program for... Read More

Adhesives & Sealants, Electrical Equipment & Systems

Rugged Epoxy Encapsulated Package Option for VPT Series

September 20, 2016

BLACKSBURG, VA – VPT® Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI) today announced the availability of a fully encapsulated epoxy package option for its VPT Series of high-reliability DC-DC converters, EMI filters and accessory products. The epoxy packaging allows for aqueous cleaning processes often required in higher volume circuit board production applications. Additionally, the epoxy... Read More

Adhesives & Sealants

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

September 1, 2016

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well... Read More

Adhesives & Sealants

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

July 12, 2016

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•Â°F [1.30-1.44 W/(m·K) and a volume resistivity... Read More

Adhesives & Sealants

Epoxy Adhesives target pipeline coatings.

July 5, 2016

Designed for repairing high pressure pipelines, KALFIX 911 and KALFIX 913 are pressure transfer fillers offering extreme adhesion, even to underwater surfaces. For pipeline coating or cold weather use, KALFIX 563 epoxy and curing agent is able to displace water for permanent bond to all substrates with minimal substrate preparation. KALFIX 206, combining liquid epoxy resin and high temperature... Read More

Adhesives & Sealants

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

June 22, 2016

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out”... Read More

Adhesives & Sealants

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

May 13, 2016

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has... Read More

Adhesives & Sealants, Paints & Coatings

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

February 24, 2016

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which... Read More

Adhesives & Sealants, Paints & Coatings

Anti-Slip Paints withstand tough industrial applications.

February 19, 2016

By providing textured coating, Good Grip® Anti-Slip Paints eliminate dangerous, slick surfaces almost anywhere in just one coat. Epoxy resin formula adheres to wood, fiberglass, cement, and most materials. Paints dry tack-free in 60 minutes, are fully cured in 24 hours, and are resistant to oil, gas, and most chemicals. Meeting OSHA recommended static coefficient of friction, paints are... Read More

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Epoxy Potting Compound resists thermal shock and cycling.

January 19, 2016

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance... Read More

Adhesives & Sealants

One-Component Epoxy Adhesive meets NASA outgassing specifications.

January 14, 2016

Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TC contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•Â°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates... Read More

Adhesives & Sealants

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life

December 16, 2015

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli, respectively... Read More

Adhesives & Sealants

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications

November 4, 2015

Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of "shadowing" issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat. Formulated for demanding... Read More

Adhesives & Sealants, Chemicals & Chemical Processing, Materials & Material Processing, Services

Dow to Showcase New Innovations at 2015 Western Coatings Symposium

October 28, 2015

Industry experts from Dow introduce new technologies and present broad portfolio of architectural and industrial coatings technology at the 2015 Western Coatings Symposium PHILADELPHIA – Dow Coating Materials (DCM) and Dow Microbial Control (DMC), business units of The Dow Chemical Company (NYSE: DOW), will discuss and showcase new and time-tested innovations in Las Vegas, Nevada Oct. 25-28 at... Read More