Epoxy Compounds

Adhesives & Sealants

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

June 22, 2016

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out”... Read More

Adhesives & Sealants

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

May 13, 2016

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also... Read More

Adhesives & Sealants, Paints & Coatings

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

February 24, 2016

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which... Read More

Adhesives & Sealants, Paints & Coatings

Anti-Slip Paints withstand tough industrial applications.

February 19, 2016

By providing textured coating, Good Grip® Anti-Slip Paints eliminate dangerous, slick surfaces almost anywhere in just one coat. Epoxy resin formula adheres to wood, fiberglass, cement, and most materials. Paints dry tack-free in 60 minutes, are fully cured in 24 hours, and are resistant to oil, gas, and most chemicals. Meeting OSHA recommended static coefficient of friction, paints are suitable for interior or exterior use on floors, stairs, ladders, ramps, tool handles, and railings. Read More

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Epoxy Potting Compound resists thermal shock and cycling.

January 19, 2016

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance properties. Applications include electronic potting and encapsulating, casting, coating, and electrical varnishes. Read More

Adhesives & Sealants

One-Component Epoxy Adhesive meets NASA outgassing specifications.

January 14, 2016

Applied in bond lines as thin as 10&ndash;15 microns, Master Bond Supreme 18TC contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5&ndash;7 x 10<sup>-6</sup> K&bull;m²/W and thermal conductivity of 22&ndash;25 BTU&bull;in/ft²&bull;hr&bull;°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates and offers 2,200&ndash;2,400 psi tensile lap shear strength, 6,000&ndash;7,000 psi tensile strength, and 22,000&ndash;24,000 psi compressive strength. Read More

Adhesives & Sealants

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life

December 16, 2015

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli,... Read More

Adhesives & Sealants

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications

November 4, 2015

Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of "shadowing" issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat. Formulated for... Read More

Adhesives & Sealants, Chemical Processing & Waste Management, Materials & Material Processing, Services

Dow to Showcase New Innovations at 2015 Western Coatings Symposium

October 28, 2015

Industry experts from Dow introduce new technologies and present broad portfolio of architectural and industrial coatings technology at the 2015 Western Coatings Symposium PHILADELPHIA – Dow Coating Materials (DCM) and Dow Microbial Control (DMC), business units of The Dow Chemical Company (NYSE: DOW), will discuss and showcase new and time-tested innovations in Las Vegas, Nevada Oct. 25-28... Read More

Adhesives & Sealants

High Temperature Resistant, One Component Epoxy Cures at 200-220°F

October 14, 2015

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other high-tech... Read More

Adhesives & Sealants

Non-Drip Epoxy Paste cures optically clear.

September 1, 2015

Formulated to cure optically clear in thin sections, even though Part A is translucent and Part B is light amber, 2-component EP21NDCL is suited for bonding, sealing, and coating applications. Product has 1:1 mix ratio by weight or volume, which can be adjusted to deliver different properties. Curing at room temperature, paste provides high tensile lap shear, tensile, and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi, and 12,000-13,000 psi, respectively. Read More

Adhesives & Sealants

One-Component No Mix Epoxy features rapid cure properties.

August 18, 2015

Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45&ndash;50 min at 175°F or 25&ndash;30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and beyond ½ in. deep. Epoxy is resistant to water, oils, fuels, and other chemicals. Read More

Adhesives & Sealants

High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements

July 22, 2015

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a... Read More

Adhesives & Sealants

Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.

July 15, 2015

With 90 min work life, SetWORX 90 toughened, 2-part epoxy adhesive bonds to such diverse substrates as metals, glass, ceramics, wood, and plastics. This Bishphenol A (BPA)-free system, offered in dual cartridges that let operator mix and dispense without weighing and mixing concerns, operates at elevated temperatures and maintains bond strength. Product comes in 50, 200, and 400 mL cartridges with various static mixers. Read More

Adhesives & Sealants

Structural Bonding Epoxy has high-strength, one-part formula.

July 1, 2015

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offers respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000&ndash;550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable epoxy has unlimited working life at room temperature, can serve as electrical insulator, and bonds to diverse substrates. Read More

Adhesives & Sealants, Paints & Coatings

Electrolube Encapsulation Resin Provides Full Protection for Automotive Sensor

June 12, 2015

Thermal cycling tests involving Electrolube's ER1455 chemically resistant, two-part epoxy resin have proved the material's ability to protect and retain an automotive sensor subject to highly aggressive environmental conditions. Electrolube recently helped one of its customers, a prominent manufacturer of control units and sensor devices, to overcome an issue with one particular... Read More

Adhesives & Sealants

Epoxy Polysulfide System exhibits high thermal conductivity.

May 20, 2015

Along with 9-10 BTU&bull;in/ft²&bull;hr&bull;°F thermal conductivity, EP21TPFL-1AO electrically insulative, 2-part system exhibits chemical resistance and offers 150%&ndash;200% elongation, 70-90 Shore A hardness, and 2:3 mix ratio by weight or volume. Black and white color coding facilitates mixing, and working life is 90&ndash;120 min at 75°F. Curing fully at ambient temperatures, flexible product adheres to metals, ceramics, composites, glass, rubbers, and plastics. Service range is -60 to +250°F. Read More

Adhesives & Sealants, Paints & Coatings

Epoxy Coating suits applications above or below water.

May 4, 2015

Based on blend of liquid epoxy polymer and aliphatic polyamine curing agents, KALCOAT&trade; 560 can displace water from wet surfaces to make permanent bond. High build 100% solids epoxy coating is solvent-free and incorporates Kevlar® microfibers for reinforcement and viscosity management for high application rates. KALCOAT 560 can be used as anti-corrosive coating, repair compound, fairing compound, and encapsulating coating for variety of applications. Read More

Adhesives & Sealants

UV Cure Adhesive suits circuit assembly applications.

April 27, 2015

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony. Read More

Adhesives & Sealants, Paints & Coatings

Two-Part Epoxy Paste has ultra low thermal resistance.

April 7, 2015

Master Bond EP48TC has thermal resistance of 5&ndash;7 x 10&ndash;6 K&bull;m2/W, which enables thermal conductivity of 20&ndash;25 BTU&bull;in/ft2&bull;hr&bull;°F. Applied in bond lines as thin as 10&ndash;15 microns, epoxy paste has tensile lap shear strength from 900&ndash;1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75°F is 90&ndash;120 min. Curing at room temperature, it is serviceable over -100 to +300°F and available in ½ pint to 5 gallon containers. Read More