Epoxy Compounds

Adhesives & Sealants

UV-Cured Epoxy Adhesive increases electronic assembly reliability.

January 28, 2015

Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More

Adhesives & Sealants

Thermally Conductive Epoxy suits die attach applications.

November 3, 2014

Adhering to metals, ceramics, and silicon dies, Supreme 3HTND-2DA cures in 5–10 min at 150°C, offers die shear strength of 19–21 kg-f, and is serviceable from -100 to +400°F. One-part, electrically insulative epoxy passes NASA low outgassing test specifications and has low ionics, particularly chlorine at <15 ppm. As toughened system, product can withstand rigorous thermal cycling and shock. Supreme 3HTND-2DA comes in syringes and can be applied to defined area without running. Read More

Adhesives & Sealants

High-Temperature Adhesive bonds dissimilar materials.

October 17, 2014

Resistant to corrosion, chemicals, thermal shock, and electricity, Resbond™ S5H13 suits adhesive applications up to 500°F. Epoxy bonds heavy plastic to stainless steel; seals and insulates Bi-Polar, Electro-Cauterizers; and withstands thousands of steam sterilization cycles at 375°F. Adhering to metals, plastics, composites, glass, and ceramics, paste cures at room temperature and exhibits 1.9 gms/cc density, 80 Shore D hardness, and 10,000 psi tensile strength. Read More

Adhesives & Sealants, Green & Clean

Hybrid Adhesive features structural cyanoacrylate technology.

October 1, 2014

Combining bond strength of structural epoxy with speed of instant adhesive, Loctite® 4090™ offers rapid, high-strength bonding to range of substrates, including metals, most plastics, and rubbers. Product offers impact, moisture, and UV resistance, as well as temperature resistance to 300°F. Available as 50 ml cartridge packaged with 5 mix nozzles, gel adhesive fixtures in 3-5 min when used to fill gaps up to 0.2 in. Low blooming product is suited for appearance-sensitive applications. Read More

Adhesives & Sealants

Single-Component, Snap Cure Epoxy exhibits high strength.

August 5, 2014

Curing in 1–2 min at 300°F, Master Bond EP3SP5FL has flowable, moderate viscosity and adheres to such substrates as metals, composites, glass, ceramics, rubbers, and plastics. Tensile lap shear strength exceeds 2,000 psi at room temperature when bonding aluminum to aluminum. Also acting as effective electrical insulator, epoxy has -60 to +200°F service range. At ambient temperatures, hardness is >85 Shore D. Above 200°F, material softens to 25–30 Shore D to foster and facilitate rework. Read More

Adhesives & Sealants, Chemical Processing & Waste Management, Optics & Photonics

Epoxy Resin Adhesive cures at temperatures as low as 60°C.

June 13, 2014

Suited for optical packaging applications where several temperature-sensitive materials are bound together, DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping. This multi-purpose, one-component adhesive can be processed within 48 hr at room temperature and adheres to various plastics as well as metals and FR4 composites. Dispensed through needles with diameter as small as 200 µm, product exhibits low thermal stress and moderate shrinkage during curing. Read More

Adhesives & Sealants

UV Cure Adhesive suits microelectronic assembly applications.

April 8, 2014

Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. Read More

Adhesives & Sealants

Thermally Conductive Epoxy Adhesive complies with RoHS.

March 10, 2014

Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations. Read More