Epoxies Etc.
Cranston, RI 02921-3407
May 06, 2008 One-component, electrically conductive 40-3910 is formulated for electrical and mechanical bonding of semiconductor, capacitor, and resistor chips in micro and opto-electronic hybrid circuit fabrication. Product does not require dry ice during transit and cures quickly at low temperatures. It provides optimized retention of strength after environmental aging.

Master Bond, Inc.
Hackensack, NJ 07601
May 06, 2008 With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165°F for 6-8 hr. Chemical resistant adhesive features mixed viscosity of 400 cps, tensile strength of 6,500 psi, tensile modulus of greater than 375,000 psi, volume resistivity greater than 1,015 W cm, and Shore D hardness of 80.

Master Bond, Inc.
Hackensack, NJ 07601
May 06, 2008 With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohmW cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz. EP121CL is also available in 1-component and thermally conductive versions.

Electronics Assembly, Henkel Corporation
Irvine, CA 92618
Apr 21, 2008 Reflow curable encapsulant material, Hysol® FF6000(TM), combines flux functionality and underfill protection into one solution. It is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. In-line approach eliminates neeed for dispensing equipment as well as time required for underfill application and cure. Areas of use include Package-on-Package device configurattions and/or large (23 x 23 mm or up) BGAs and CSPs.

Aremco Products, Inc.
Valley Cottage, NY 10989
Apr 18, 2008 Used to bond aluminum panels and copper heat exchange tubes, Aremco-Bond(TM) 568 is aluminum-filled epoxy system that offers thermal conductivity of 9.0 Btu-in./hr-ft²-°F and flexural and tensile strength of 11,400 and 2,500 psi, respectively. Resistant to acids, bases, salts, and organic fluids, it mixes in 1:1 ratio by weight or volume, cures at room temperature or with low heat, and provides total mass loss of 0.75% at 125ºC and 0.35% of collected volatile condensable materials at 25ºC.

Sherwin-Williams
Cleveland, OH 44115
Apr 16, 2008 Free of hazardous air polluting solvents, anti-corrosive SeaGuard 6200 can be applied at temperatures as low as 20°F, making it suited for vessel maintenance during winter lay-up. Product may be used on many prepared steel substrates, including bilges and wet void areas, decks and superstructures, and underwater hulls. Applied by brush, roller, or spray, coating is suited for fabrication and new construction along with maintenance and repair.

Cotronics Corp.
Brooklyn, NY 11235-3623
Apr 09, 2008 Resistant to electricity, chemicals, and moisture, Duralco(TM) 4463 is 100% solid system that exhibits dimensional stability and adheres to glass, ceramics, metals, and plastics. This 500°F epoxy, suited for bonding and encapsulating applications, contains no VOCs and only requires users to mix and apply.

Master Bond, Inc.
Hackensack, NJ 07601
Apr 08, 2008 Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic solvents over temperature range of -65 to +250°F.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Apr 03, 2008 Loctite® 331(TM) Structural Adhesive is acid-free, 2-step acrylic that fixtures in 20 sec and develops full strength in 30 min, bonding magnets and metals of all sizes. Designed for filling large gaps, Loctite® 3060(TM) Structural Adhesive is acid-free, 2-component, external-mix acrylic featuring 2 cascading adhesive streams that automatically mix together. Loctite® E-220IC(TM) Hysol® Epoxy Adhesive is acid-free, 1-component epoxy designed for induction cure operations.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 31, 2008 Designed for use in high performance composite structures and potting/casting applications, polyfunctional epoxy resin EP34CA can be combined with hardeners to provide low viscosity liquid which is suited for filament windings. Mechanical properties vs. time/temperature of unidirectional graphite composites based on Modmore Type II T fiber and matrix of EP34CA/EP34C yield flexural strength of 236,000 psi, flexural modulus of 17.8 x 106 psi, and interlaninar shear strength of 12,700 psi.

Cotronics Corp.
Brooklyn, NY 11235-3623
Mar 31, 2008 Offering dimensional stability, Duralco(TM) 4463 consists of 100% solid system that is mixed, applied, and cured at room temperature. Product resists electricity, chemicals, and moisture. With low odor and no VOCs, epoxy adheres to most glass, ceramics, metals, and plastics, and is suitable for bonding and encapsulated applications.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Mar 18, 2008 Featuring thermal stability and chemical resistance, 124-34A/B-187 consists of 2-component syringe dispensable, isotropically electrically conductive, epoxy adhesive, while 125-01A/B-187 offers 2-component syringe dispensable, anisotropically conductive version of product. Cure times as fast as 7-10 seconds can be achieved at elevated temperatures. Applications include assembly of electrical and electronic components.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 07, 2008 Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound exhibits electrical insulation properties and resistance to water.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 06, 2008 Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm, surface resistance of less than 1 ohm/square, and thermal conductivity of 7.9 W/meter-°K.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 05, 2008 Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250°F range. Product adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics.

Dow Chemical Co., The
Midland, MI 48674-0001
Jan 14, 2008 Suited for use in amine, DICY, anhydride, and phenolic cured epoxy systems, FORTEGRA(TM) Epoxy Tougheners are available in 4 forms, and provide adhesion and corrosion and chemical resistance. FORTEGRA 100 is epoxy toughening agent, while FORTEGRA 383-50 and 383-5 are blends of D.E.R(TM) 383 liquid epoxy resin with 50 and 5 weight percent, respectively, of toughening material. Used in powder coatings, FORTEGRA 664-12 is 12 weight percent blend of toughening material in D.E.R. 664.

Master Bond, Inc.
Hackensack, NJ 07601
Jan 11, 2008 One-component Polymer System EP11HT cures in 110 min at 250°F or 75 min at 300°F. It attains tensile shear strength of greater than 3,300 psi to form rigid and dimensionally stable bonds. Resistant to acids and solvents, service temperature range is -60 to 400°F and it bonds to substrates including metals, glass, ceramics, and plastics. EP11HT is available in pint, quart, 5 gal containers, and non-drip version EP11HTND-2.

Electronics Assembly, Henkel Corporation
Irvine, CA 92618
Dec 12, 2007 Suitable for laptops and gaming consoles that may experience only occasional vibration, 1-component Loctite® 3508 is pre-applied at corners of CSP pad site using standard dispensing system. It can be applied in-line with existing equipment with curing taking place during normal solder reflow process. Reworkable, lead-free compatible material enables total ball collapse and self-alignment properties to compensate for slight component-to-pad misalignment during placement.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 30, 2007 Curing at room temperature when exposed to UV light source, UV22 nanosilica-filled, one-component, UV-curable epoxy is not oxygen inhibited. Abrasion-resistant epoxy has service operating temperature range of -60 to +300°F and adding 195-257°F for 30 min gives it glass transition temperature of 275°F. It has Shore D hardness of greater than 80, tensile strength of greater than 4,600 psi, refractive index of 1.52, and shrinkage of 1-2%.

Power Adhesives Ltd
Basildon, Essex   United Kingdom
Nov 27, 2007 KNOT-TEC(TM) System lets manufacturers of such products as windows, doors, and furniture use entire board, rather than just portions before or knot or defect. Combining TEC(TM) 250 hot melt adhesive applicator and TECBOND(TM) 7718/12 polyamide hot melt glue sticks, system repairs knots and fills wooden surfaces so that they are smooth and unnoticeable prior to painting/finishing. Solution performs repairs in seconds, and any surplus glue can be removed with chisel or cutting tool.