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Adhesives & Sealants -> Epoxy Compounds


Epoxy Compounds


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Potting Compound features 6 hr working life.

Potting Compound features 6 hr working life.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 30, 2009 Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50°C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow, setup, and handling properties suited for large potting and encapsulating applications.

Epoxy Adhesive has linear shrinkage of 0.0003 in./in.

Epoxy Adhesive has linear shrinkage of 0.0003 in./in.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 29, 2009 Low viscosity, optically clear, two part epoxy compound, EP30LV-1 is formulated to cure at room temperatures, and forms bonds with both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Electrical insulator adhesive requires only contact pressure for curing. Suitable applications include optical, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries.

Epoxy Adhesive conducts static electricity through filters.

Magnolia Plastics, Inc.
Chamblee, GA 30341
Oct 26, 2009 MagnobondŽ 133-351 A/B is 2-part epoxy adhesive that bonds fuel filter media to filter end caps. Its conductive carbon filler allow static electricity to be discharged safely, enabling filter manufacturers to use it to create static discharge circuit. Designed to bond dissimilar substrates, low-viscosity adhesive also offers chemical resistance.

Epoxy Adhesive suits temperatures up to 600°F.

Epoxy Adhesive suits temperatures up to 600°F.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 14, 2009 Designed to withstand severe and repeated thermal cycling, Master Bond EP46HT-1 has continuous service operating temperature range of -100 to +550°F and can withstand intermittent exposures up to 600°F. It has glass transition temperature of over 235°C and provides adhesion to metals, glass, vulcanized rubbers, and most plastics. Product cures rapidly at elevated temperatures, is 100% reactive, and does not contain any solvents or diluents. Hardened system is electrical insulator.

Thermal Adhesive Film provides electrical insulation.

Thermal Adhesive Film provides electrical insulation.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 02, 2009 Formulated to function as preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices, FL901AO epoxy film can cure in 1 hr at 250°F or 30-40 min at 300°F. B-stage, 100% solid adhesive-preform offers thermal conductivity of 10 BTUoin./ft˛hr°F and volume resistivity exceeding 10 x 1012 W-cm, providing no-mess solution to electronic assembly and other industrial bonding and sealing operations.

Clear Epoxy can be shaped and engraved with ordinary router.

Clear Epoxy can be shaped and engraved with ordinary router.

Progressive Epoxy Polymers, Inc.
Pittsfield, NH 03263
Sep 01, 2009 Bio Clear 810(TM) is pourable bar- and table-top clear epoxy, which can be shaped, edged, and engraved with ordinary router once it has set and cured. Low viscosity epoxy is available in 1.5 quart, 3 quart, and 3 gal kits, each with mix ratio of 2:1.

Fire Retardant Adhesive meets aerospace industry needs.

Magnolia Plastics, Inc.
Chamblee, GA 30341
Aug 31, 2009 As 2-component, room temperature curing epoxy paste adhesive, Magnobond 5925 is designed to bond honeycomb aircraft interior panels as well as for ditch-and-pot applications. Solvent-free solution, in addition to being fire-resistant, also exhibits resistance to chemicals, moisture, and environmental conditions. It can be packaged in any 2:1 mix ratio side-by-side cartridges and will help improve safety of all commercial airliners.

Dry Film Adhesive cures at 150°C.

DuPont
Research Triangle Park, NC 27709-4425
Aug 28, 2009 Pre-manufactured with thickness uniformity, DuPont(TM) PerMX(TM) 3000 can cover or tent holes in substrate and provide reliable bonding in 5 min cycle. Negative tone, photodielectric epoxy material offers both corrosion and chemical resistance. With greater than 4:1 aspect ratio, straight vertical sidewalls, and thermal resistance, product is suited for applications in 3D, through silicon via, and wafer level packaging of electronic components and microelectromechanical systems.

Epoxy Adhesive features high thermal conductivity.

Epoxy Adhesive features high thermal conductivity.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 03, 2009 Suited for bonding, sealing, and potting applications, EP30BN optimizes heat dissipation of aerospace, defense, and microelectronic assemblies with minimal weight penalty. Two part boron nitride epoxy adhesive features electrical insulation properties with volume resistivity in excess of 1,014 Wcm and thermal conductivity of 24 Btu/hr/ft˛/°F/in. Mechanical strength properties and chemical resistance are maintained over wide temperature range of -60 to 300°F.

Epoxy repairs defects in corroded linings/stacks to 400°F.

Epoxy repairs defects in corroded linings/stacks to 400°F.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jul 17, 2009 Capable of providing tensile shear strength of 2,400 psi and flexural strength of 13,400 psi, Aremco-Bond(TM) 2200 bonds ceramic and metal wear plates. Electrical insulating properties include dielectric strength of 460 V/mil and volume resistivity of 1.0 x 1015. Abrasion, corrosion and impact resistant compound cures at room temperature in 24-48 hr or by heating to 175 °F for 4 hr. Cured product is machinable and features linear shrinkage of .009 in/in and Shore-D hardness of 86.

Epoxy Adhesive contains no volatiles or hazardous solvents.

Epoxy Adhesive contains no volatiles or hazardous solvents.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 06, 2009 Exhibiting low shrinkage and offering Tg that exceeds 94°C, epoxy adhesive UV10TK40 offers tensile strength of 8,300 psi and shore D hardness greater than 75, forming high surface hardness. It cures tack free in presence of air and will gel rapidly upon UV light exposure. Environmentally-friendly and 100% reactive, UV cure adhesive is suited for clear coating, sealing and bonding, and any process that requires critical alignment or exact positioning.

Epoxy System is reinforced with nanosilica fillers.

Epoxy System is reinforced with nanosilica fillers.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 03, 2009 Type UV22 features nano-sized filler (less than 50 nm) that provides cured system with abrasion resistance, optical clarity, low shrinkage, and physical strength, while maintaining low viscosity of 4,000 cps. UV22 cures rapidly upon exposure to UV light at room temperatures, has tensile strength greater than 4,600 psi and tensile modulus greater than 500,000 psi. Single component system has service temperature range of -60 to +300°F, is solvent-free adhesive, and not oxygen inhibited.

High Strength Epoxy make repairs to 400°F.

High Strength Epoxy make repairs to 400°F.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jun 22, 2009 Aremco-Bond(TM) 2200 glass-fiber and Kevlar reinforced epoxy-novolac compound is suited for bonding ceramic and metal wear plates used to insulate chutes, ducts, and centrifuges, and repairing defects in corroded linings and stacks to 400°F. Tensile shear strength is 2,400 psi and flexural strength is 13,400 psi, and product is resistant to acids, alkalis, organic fluids, and salts. Electrical insulating properties include dielectric strength of 460 V/mil and volume resistivity of 1.0 x 1015.

Epoxy Potting Compound has low viscosity formulation.

Epoxy Potting Compound has low viscosity formulation.

Epoxies Etc.
Cranston, RI 02921-3407
Jun 10, 2009 Formulated for electronic potting and encapsulating applications, Type 20-3060 Epoxy flows quickly in and around electronic components, self levels, releases air bubbles, and provides smooth, glasslike finish. It offers electrical insulation, chemical resistance, and protection from environment. Potting compound is available in quarts, gallons, and 5 gal pails.

Conductive Electrical Adhesive suits applications to 500°F.

Conductive Electrical Adhesive suits applications to 500°F.

Cotronics Corp.
Brooklyn, NY 11232
May 21, 2009 Offering alternative to silver-filled, electrically conductive epoxies, nickel-filled Duralco 122 cures at room temperature in 16-24 hr at 75°F or can be fast cured in 10 min at 200°F. Resistant to moisture, chemicals, and solvents, 2-part epoxy bonds well to glass, ceramics, plastics, dissimilar materials, and metals, including steel, stainless, aluminum, and lead. It is suited for flexible circuits, semiconductors, EMI shielding, thermistors, wire tacking, and heating elements.

Thermal Conductive Epoxy Adhesive cures at room temperature.

Thermal Conductive Epoxy Adhesive cures at room temperature.

Master Bond, Inc.
Hackensack, NJ 07601
May 14, 2009 Exhibiting thermal conductivity and electrical insulation properties, EP21TCHT-1 offers service operating temperature range of 4 K to 400°F. It adheres to metals, ceramics, woods, vulcanized rubbers, and most plastics, and provides bonds resistant to water, fuels, and most organic solvents. NASA qualified for low outgassing applications, adhesive is suited for use in vacuum environments. Product has mix ratio of 100-60 by weight and light paste viscosity.

Halogen-Free Adhesives suit assembly of handheld electronics.

Halogen-Free Adhesives suit assembly of handheld electronics.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Apr 03, 2009 LoctiteŽ line of halogen-free adhesives and sealants are formulated to contain less than 900 ppm bromine and chlorine as well as 1,500 ppm total halogens. Product range includes cyanoacrylates, light cure cyanoacrylates, epoxies, urethanes, UV acrylics, silicones, hot melts, two-part acrylics, and anaerobics used for bonding, sealing, gasketing, and mounting range of components. All meet IPC IEC No. 61249-2-21 requirements.

Clear Epoxy is for bonding and potting optical devices.

Clear Epoxy is for bonding and potting optical devices.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 21, 2008 Featuring viscosity of 700-800 cps, Master Bond EP29LP multi-purpose 2-part optical epoxy has low exotherm to peak of 120°F . It adheres to optical fibers, connectors, lenses, and glass and forms high strength bonds of more than 3,500 psi in shear. With temperature range of 60-250°F, epoxy has chemical resistance to water, fuels, acids, bases, and salts.

One Part Epoxy Adhesive works in -60 to +450°F temperatures.

One Part Epoxy Adhesive works in -60 to +450°F temperatures.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 10, 2008 Bonding to similar and dissimilar substrates, EP13 single-component epoxy adhesive requires no mixing and has unlimited working life at room temperature. It exhibits dimensional stability, is 100% reactive, and does not contain any solvents or diluents. Able to be applied to vertical surfaces without sagging or dripping, adhesive cures within 60-90 minutes at temperatures of 300 to 350°F. Readily machinable product, upon cure, obtains tensile shear strengths in excess of 3,500 psi.

Epoxy Adhesive suits specialized electronics applications.

Conductive Compounds, Inc.
Londonderry, NH 03053
Nov 04, 2008 Silver-filled, 2-part EP-600 attaches components, such as resistors, LEDs, and grounding wires to metal and plastic substrates where high temperature curing cannot be used. Electrically conductive product cures at temperatures from 20-140°C with cure times from 48 hr to 2-6 min, depending on temperature. Available in pre-weighed pouches, EP-600 works in high-speed automated dot dispense and screen printing production machines, as well as handheld dispensing equipment.




(Showing headlines 1 - 20)   more ....



 Latest Products in the News


Huntsman Corp.  - April 21, 2008
Huntsman Introduces New AralditeŽ Epoxy Insulating Systems at IEEE - PES

Ticona Engineering Polymers  - June 12, 2007
RJR Polymers Extends Epoxy Technology to Adhere VectraŽ LCP in Electronic Packaging

Permabond  - June 1, 2007
Permabond ET505 High Strength Epoxy Eases Production Process

Permabond  - June 1, 2007
PermabondŽ Engineering Adhesives Introduces High Strength Single Part Epoxies

National Adhesives  - May 9, 2007
Bondmaster Epoxy Adhesives for Motors Now Available in Cartridge Sizes

Henkel Loctite Corporation  - August 8, 2006
New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages


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