Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This high performance system can also be used for bonding and sealing.
EP30LP-2 is an easy to handle compound with a convenient two to one mix ratio by weight or volume. A 100 gram batch has a 60-90 minute... Read More
Maximizing penetration gaps, cracks and pores, EpoKwick FC Epoxy System features strong physical adherence and zero shrinkage. Suitable for thermal spray coatings in aerospace, automotive and energy industries, product is used with black, red and blue pigments for providing color contrast between mount and specimen during image analysis. EpoKwick is used by scientists in testing metals,... Read More
Suitable for use in bonding, coating, sealing and encapsulating for aerospace and OEM industries, EP30TC Epoxy provides 2.60-2.88 W/(m.K) thermal conductivity. Having 5,000-6,000 psi tensile strength with 24,000-26,000 psi compressive strength, epoxy is used in -100°F to +300°F temperature range. Available in ½ pint, pint, quart, gallon and 5 gallon container kits, EP30TC offers over 1014... Read More
Devcon® Dfense Blok™ with Ez Mix Technology Simplifies Wear & Abrasion Protection in Colder ClimatesJanuary 27, 2017
DANVERS, MA - Devcon DFense Blok EZ Mix™ provides the same exceptional wear and abrasion protection as original DFense Blok™, but is easier to mix in colder climates.
DFense Blok™ alumina ceramic bead-filled epoxy wearing compound is specially formulated to outperform and outlast traditional epoxy wear and abrasion products - even in the most severe impact and sliding abrasion... Read More
Master Bond EP42HT-2FG is a two part epoxy that fully meets stringent FDA CFR 175.300 and FDA CFR 175.105 food grade testing specifications. It also meets the toxicological requirements of the NSF/ANSI 51 (2009) Standard for Food Equipment Materials as defined in section 4.1. This low viscosity system offers convenient handling and can be used for a wide variety of applications in the food... Read More
Available in ½ pints, pints, quarts, gallons and 5 gallon containers, EP3HTND-2Med Black Curing Epoxy features 5,000-6,000 psi tensile strength. Having 1,600-1,800 psi tensile lap shear strength at room temperature, product bonds to glass, metals and ceramics. Used in -60°F to +400°F temperature, material provides resistance to sterilization methods such as chemical sterilants, EtO,... Read More
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving.
As a one component system, EP3HTND-2Med Black does not require any... Read More
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.
EP46HT-2AO Black combines superior thermal... Read More
Short Elliott Hendrickson; Champion Coatings; Wapasha Construction; and the city of Austin, Minnesota, take top spot in inaugural program honoring project excellence using Sherwin-Williams Protective Marine Coatings CLEVELAND, OHIO – Short Elliott Hendrickson Inc. (SEHÂ®), Champion Coatings, and Wapasha Construction took top honors in the inaugural Sherwin-Williams Impact Award program for... Read More
BLACKSBURG, VA – VPTÂ® Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI) today announced the availability of a fully encapsulated epoxy package option for its VPT Series of high-reliability DC-DC converters, EMI filters and accessory products. The epoxy packaging allows for aqueous cleaning processes often required in higher volume circuit board production applications. Additionally, the epoxy... Read More
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well... Read More
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•Â°F [1.30-1.44 W/(mÂ·K) and a volume resistivity... Read More
Designed for repairing high pressure pipelines, KALFIX 911 and KALFIX 913 are pressure transfer fillers offering extreme adhesion, even to underwater surfaces. For pipeline coating or cold weather use, KALFIX 563 epoxy and curing agent is able to displace water for permanent bond to all substrates with minimal substrate preparation. KALFIX 206, combining liquid epoxy resin and high temperature... Read More
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out”... Read More
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has... Read More
Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing SpecificationsFebruary 24, 2016
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which... Read More
By providing textured coating, Good GripÂ® Anti-Slip Paints eliminate dangerous, slick surfaces almost anywhere in just one coat. Epoxy resin formula adheres to wood, fiberglass, cement, and most materials. Paints dry tack-free in 60 minutes, are fully cured in 24 hours, and are resistant to oil, gas, and most chemicals. Meeting OSHA recommended static coefficient of friction, paints are... Read More
PassingÂ Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155Â°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80Â°C for 1–2 hr, but post cure of 150Â°C for 3 hr will optimize performance... Read More
Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TCÂ contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•mÂ²/W andÂ thermal conductivity of 22–25 BTU•in/ftÂ²•hr•Â°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates... Read More
Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli, respectively... Read More