Epoxy Compounds

Adhesives & Sealants

Structural Bonding Epoxy has high-strength, one-part formula.

July 1, 2015

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offers respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000–550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable epoxy has unlimited working life at room temperature, can serve as electrical insulator, and bonds to diverse substrates. Read More

Adhesives & Sealants

Epoxy Polysulfide System exhibits high thermal conductivity.

May 20, 2015

Along with 9-10 BTU•in/ft²•hr•°F thermal conductivity, EP21TPFL-1AO electrically insulative, 2-part system exhibits chemical resistance and offers 150%–200% elongation, 70-90 Shore A hardness, and 2:3 mix ratio by weight or volume. Black and white color coding facilitates mixing, and working life is 90–120 min at 75°F. Curing fully at ambient temperatures, flexible product adheres to metals, ceramics, composites, glass, rubbers, and plastics. Service range is -60 to +250°F. Read More

Paints & Coatings, Adhesives & Sealants

Epoxy Coating suits applications above or below water.

May 4, 2015

Based on blend of liquid epoxy polymer and aliphatic polyamine curing agents, KALCOAT™ 560 can displace water from wet surfaces to make permanent bond. High build 100% solids epoxy coating is solvent-free and incorporates Kevlar® microfibers for reinforcement and viscosity management for high application rates. KALCOAT 560 can be used as anti-corrosive coating, repair compound, fairing compound, and encapsulating coating for variety of applications. Read More

Adhesives & Sealants

UV Cure Adhesive suits circuit assembly applications.

April 27, 2015

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony. Read More

Adhesives & Sealants, Paints & Coatings

Two-Part Epoxy Paste has ultra low thermal resistance.

April 7, 2015

Master Bond EP48TC has thermal resistance of 5–7 x 10–6 K•m2/W, which enables thermal conductivity of 20–25 BTU•in/ft2•hr•°F. Applied in bond lines as thin as 10–15 microns, epoxy paste has tensile lap shear strength from 900–1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75°F is 90–120 min. Curing at room temperature, it is serviceable over -100 to +300°F and available in ½ pint to 5 gallon containers. Read More

Materials & Material Processing, Adhesives & Sealants

Epoxy Potting Compound resists high temperatures.

March 27, 2015

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils, insulators, and sensors. Read More

Adhesives & Sealants

Epoxy Stick facilitates fuel tank repairs.

March 25, 2015

Offering resistance to ethanol and most solvents, Permatex Fuel Tank Repair Epoxy Stick is suited for filling holes and damaged seams in both metal gas tanks and containers. Product comes as 2-part putty in stick form which helps measure and mix proper amount. Finished repair sets in just 1 hour and can be drilled, sanded, threaded, or filed after 5 hours. When fully cured, epoxy withstands moderate temperatures and does not shrink after application. Read More

Adhesives & Sealants, Chemical Processing & Waste Management, Green & Clean

Acrylic Resins suit ultra-low VOC coatings.

February 10, 2015

Suited for 2-component concrete coatings, MAINCOTE™ AEH Acrylic Epoxy Hybrid combines weatherability and UV resistance of acrylics with chemical resistance of epoxies. Product offers tire pickup resistance in waterborne 2K concrete coatings as well as resistance to aggressive cleaning regimens. With VOC levels of 50 g/L or less, MAINCOTE™ 4950 Acrylic Resin is suited for direct-to-metal coatings. Product offers balance of hardness, corrosion, and durability, as well as architectural gloss. Read More

Adhesives & Sealants

Fast Cure Adhesives suit cartridge dispensing.

February 4, 2015

Suitable for use with TriggerBond® dispensing guns, TriggerBond Epoxies offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger. Three types are available with setting times of 5, 20, and 46 minutes, respectively. Read More

Adhesives & Sealants

UV-Cured Epoxy Adhesive increases electronic assembly reliability.

January 28, 2015

Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More

Adhesives & Sealants

Thermally Conductive Epoxy suits die attach applications.

November 3, 2014

Adhering to metals, ceramics, and silicon dies, Supreme 3HTND-2DA cures in 5–10 min at 150°C, offers die shear strength of 19–21 kg-f, and is serviceable from -100 to +400°F. One-part, electrically insulative epoxy passes NASA low outgassing test specifications and has low ionics, particularly chlorine at <15 ppm. As toughened system, product can withstand rigorous thermal cycling and shock. Supreme 3HTND-2DA comes in syringes and can be applied to defined area without running. Read More

Adhesives & Sealants

High-Temperature Adhesive bonds dissimilar materials.

October 17, 2014

Resistant to corrosion, chemicals, thermal shock, and electricity, Resbond™ S5H13 suits adhesive applications up to 500°F. Epoxy bonds heavy plastic to stainless steel; seals and insulates Bi-Polar, Electro-Cauterizers; and withstands thousands of steam sterilization cycles at 375°F. Adhering to metals, plastics, composites, glass, and ceramics, paste cures at room temperature and exhibits 1.9 gms/cc density, 80 Shore D hardness, and 10,000 psi tensile strength. Read More

Adhesives & Sealants, Green & Clean

Hybrid Adhesive features structural cyanoacrylate technology.

October 1, 2014

Combining bond strength of structural epoxy with speed of instant adhesive, Loctite® 4090™ offers rapid, high-strength bonding to range of substrates, including metals, most plastics, and rubbers. Product offers impact, moisture, and UV resistance, as well as temperature resistance to 300°F. Available as 50 ml cartridge packaged with 5 mix nozzles, gel adhesive fixtures in 3-5 min when used to fill gaps up to 0.2 in. Low blooming product is suited for appearance-sensitive applications. Read More

Adhesives & Sealants

Single-Component, Snap Cure Epoxy exhibits high strength.

August 5, 2014

Curing in 1–2 min at 300°F, Master Bond EP3SP5FL has flowable, moderate viscosity and adheres to such substrates as metals, composites, glass, ceramics, rubbers, and plastics. Tensile lap shear strength exceeds 2,000 psi at room temperature when bonding aluminum to aluminum. Also acting as effective electrical insulator, epoxy has -60 to +200°F service range. At ambient temperatures, hardness is >85 Shore D. Above 200°F, material softens to 25–30 Shore D to foster and facilitate rework. Read More

Adhesives & Sealants, Chemical Processing & Waste Management, Optics & Photonics

Epoxy Resin Adhesive cures at temperatures as low as 60°C.

June 13, 2014

Suited for optical packaging applications where several temperature-sensitive materials are bound together, DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping. This multi-purpose, one-component adhesive can be processed within 48 hr at room temperature and adheres to various plastics as well as metals and FR4 composites. Dispensed through needles with diameter as small as 200 µm, product exhibits low thermal stress and moderate shrinkage during curing. Read More

Adhesives & Sealants

UV Cure Adhesive suits microelectronic assembly applications.

April 8, 2014

Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. Read More

Adhesives & Sealants

Thermally Conductive Epoxy Adhesive complies with RoHS.

March 10, 2014

Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations. Read More

Adhesives & Sealants, Paints & Coatings, Architectural and Civil Engineering Products

Flooring/Wall Products target restaurant industry professionals.

February 21, 2014

Used for floor and wall resurfacing, restoration, and protection, HardCore system creates durable floors and walls over new or damaged concrete and other substrates. System includes application of 5 products in various combinations: HardShield water-based, clear epoxy sealer; HardFlor heavy-duty, ¼ in. bonded industrial flooring surfaces; HardCote customizable coating for walls; HardCure high-bond epoxy primer; and HardCove 100% total solids, trowelable epoxy. Read More

Adhesives & Sealants

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

January 31, 2014

Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP. Read More

Adhesives & Sealants

Epoxy Adhesive suits microelectronic assembly applications.

January 14, 2014

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More