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Adhesives & Sealants -> Epoxy Compounds


Epoxy Compounds


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Epoxy System is reinforced with nanosilica fillers.

Epoxy System is reinforced with nanosilica fillers.

Master Bond, Inc.
Hackensack, NJ 07601
Jul 03, 2009 Type UV22 features nano-sized filler (less than 50 nm) that provides cured system with abrasion resistance, optical clarity, low shrinkage, and physical strength, while maintaining low viscosity of 4,000 cps. UV22 cures rapidly upon exposure to UV light at room temperatures, has tensile strength greater than 4,600 psi and tensile modulus greater than 500,000 psi. Single component system has service temperature range of -60 to +300°F, is solvent-free adhesive, and not oxygen inhibited.

High Strength Epoxy make repairs to 400°F.

High Strength Epoxy make repairs to 400°F.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jun 22, 2009 Aremco-Bond(TM) 2200 glass-fiber and Kevlar reinforced epoxy-novolac compound is suited for bonding ceramic and metal wear plates used to insulate chutes, ducts, and centrifuges, and repairing defects in corroded linings and stacks to 400°F. Tensile shear strength is 2,400 psi and flexural strength is 13,400 psi, and product is resistant to acids, alkalis, organic fluids, and salts. Electrical insulating properties include dielectric strength of 460 V/mil and volume resistivity of 1.0 x 1015.

Epoxy Potting Compound has low viscosity formulation.

Epoxy Potting Compound has low viscosity formulation.

Epoxies Etc.
Cranston, RI 02921-3407
Jun 10, 2009 Formulated for electronic potting and encapsulating applications, Type 20-3060 Epoxy flows quickly in and around electronic components, self levels, releases air bubbles, and provides smooth, glasslike finish. It offers electrical insulation, chemical resistance, and protection from environment. Potting compound is available in quarts, gallons, and 5 gal pails.

Conductive Electrical Adhesive suits applications to 500°F.

Conductive Electrical Adhesive suits applications to 500°F.

Cotronics Corp.
Brooklyn, NY 11232
May 21, 2009 Offering alternative to silver-filled, electrically conductive epoxies, nickel-filled Duralco 122 cures at room temperature in 16-24 hr at 75°F or can be fast cured in 10 min at 200°F. Resistant to moisture, chemicals, and solvents, 2-part epoxy bonds well to glass, ceramics, plastics, dissimilar materials, and metals, including steel, stainless, aluminum, and lead. It is suited for flexible circuits, semiconductors, EMI shielding, thermistors, wire tacking, and heating elements.

Thermal Conductive Epoxy Adhesive cures at room temperature.

Thermal Conductive Epoxy Adhesive cures at room temperature.

Master Bond, Inc.
Hackensack, NJ 07601
May 14, 2009 Exhibiting thermal conductivity and electrical insulation properties, EP21TCHT-1 offers service operating temperature range of 4 K to 400°F. It adheres to metals, ceramics, woods, vulcanized rubbers, and most plastics, and provides bonds resistant to water, fuels, and most organic solvents. NASA qualified for low outgassing applications, adhesive is suited for use in vacuum environments. Product has mix ratio of 100-60 by weight and light paste viscosity.

Halogen-Free Adhesives suit assembly of handheld electronics.

Halogen-Free Adhesives suit assembly of handheld electronics.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Apr 03, 2009 Loctite® line of halogen-free adhesives and sealants are formulated to contain less than 900 ppm bromine and chlorine as well as 1,500 ppm total halogens. Product range includes cyanoacrylates, light cure cyanoacrylates, epoxies, urethanes, UV acrylics, silicones, hot melts, two-part acrylics, and anaerobics used for bonding, sealing, gasketing, and mounting range of components. All meet IPC IEC No. 61249-2-21 requirements.

Clear Epoxy is for bonding and potting optical devices.

Clear Epoxy is for bonding and potting optical devices.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 21, 2008 Featuring viscosity of 700-800 cps, Master Bond EP29LP multi-purpose 2-part optical epoxy has low exotherm to peak of 120°F . It adheres to optical fibers, connectors, lenses, and glass and forms high strength bonds of more than 3,500 psi in shear. With temperature range of 60-250°F, epoxy has chemical resistance to water, fuels, acids, bases, and salts.

One Part Epoxy Adhesive works in -60 to +450°F temperatures.

One Part Epoxy Adhesive works in -60 to +450°F temperatures.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 10, 2008 Bonding to similar and dissimilar substrates, EP13 single-component epoxy adhesive requires no mixing and has unlimited working life at room temperature. It exhibits dimensional stability, is 100% reactive, and does not contain any solvents or diluents. Able to be applied to vertical surfaces without sagging or dripping, adhesive cures within 60-90 minutes at temperatures of 300 to 350°F. Readily machinable product, upon cure, obtains tensile shear strengths in excess of 3,500 psi.

Epoxy Adhesive suits specialized electronics applications.

Conductive Compounds, Inc.
Londonderry, NH 03053
Nov 04, 2008 Silver-filled, 2-part EP-600 attaches components, such as resistors, LEDs, and grounding wires to metal and plastic substrates where high temperature curing cannot be used. Electrically conductive product cures at temperatures from 20-140°C with cure times from 48 hr to 2-6 min, depending on temperature. Available in pre-weighed pouches, EP-600 works in high-speed automated dot dispense and screen printing production machines, as well as handheld dispensing equipment.

Electrically Conductive Epoxy offers low-temperature cure.

Electrically Conductive Epoxy offers low-temperature cure.

Conductive Compounds, Inc.
Londonderry, NH 03053
Oct 17, 2008 Silver-filled, 2-part epoxy adhesive (EP-600) is designed to attach electrical components to metal/plastic substrates. It accelerates manufacture of PTF circuits built on temperature-sensitive substrates and cures at temperatures from 20 to 140°C with times from 48 hr to 2-6 min; snap cure times are possible at higher temperatures. Elasticity allows for differences in thermal expansion properties of bonded components and for flexing/bending substrates without fracturing SMT joints.

Epoxy Grout is shippable as non-hazardous product.

Epoxy Grout is shippable as non-hazardous product.

Unisorb Installation Technologies
Jackson, MI 49204 1000
Oct 13, 2008 Available in pre-measured and proportioned kit sizes, Ship Safe Standard V-100 contains no regulated compounds according to USA, Canadian, and EU transportation agencies. Being free from hazardous material regulations eliminates fees associated with shipping hazardous classified epoxies. Product comes in 11 lb kit yielding 181.5 cu-in., 22 lb kit yielding 363.0 cu-in., and 55 lb kit yielding 907.5 cu-in.

Conductive Inks/Adhesives suit thin film photovoltaic cells.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Oct 01, 2008 Adhering to variety of transparent conductive oxides, Silver Conductive Inks and Adhesives operate in high humidity environments and provide optimal environmental aging. Inks are used in grid lines and buss bars printed onto TCO's in thin film solar cells, while adhesives connect multiple solar cells to build arrays. Two-component 118-09A/B187 ink offers 0.0005 W-cm volume resistivity, while single-component 123-39C adhesive features volume resistivity of 0.0003 W-cm.

Epoxy Resin and Accelerant create damp proof membrane.

Instarmac Group plc
Dordon B78 1SE  United Kingdom
Sep 29, 2008 Consisting of solvent free, 2-part epoxy resin system, DPM IT One Coat cures within 18-24 hr to provide waterproof surface membrane. Product prevents passage of moisture into subsequent layers, is pigmented blue for visual control over coverage uniformity, and is suitable for isolating moisture where relative humidity values are above 92%. Designed for use with damp proof membranes, DPM IT A Additive reduces curing times to as little as 3 hours after application.

Two Component Epoxy Adhesive cures at room temperature.

Two Component Epoxy Adhesive cures at room temperature.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 26, 2008 Available in ½ pint, pint, quart, gallon, and 5 gal kits, Master Bond EP30 features low viscosity, chemical resistance, dimensional stability, hardness, optical clarity, and electrical insulation properties. It is used in potting and encapsulating electronic components as well as in bonding optical elements, and has adhesion to metals, ceramics, glass, and plastics. EP30 has lap shear strength exceeding 3,000 psi for aluminum to aluminum bonds, and low shrinkage upon cure.

Epoxy Adhesive is designed for SMT stencil assembly.

Epoxies Etc.
Cranston, RI 02921-3407
Sep 05, 2008 Able to cure in 30 min @ 150°F, 10-3022 is used to bond polyester mesh to aluminum frames and stainless steel foil to polyester mesh. Adhesive forms impact-resistant bonds and retains strength after cleaning stencils. Featuring 2:1 by volume mix ratio, product also exhibits resistance to shock, vibration, and flexing. In addition to 50, 200, and 400 ml TriggerBond® dual barrel cartridges, 1 and 5 gal packages are available.

Epoxy Adhesive bonds sensors to CNC machine tools.

Epoxy Adhesive bonds sensors to CNC machine tools.

Aremco Products, Inc.
Valley Cottage, NY 10989
Sep 03, 2008 Suited for aerospace manufacturers, ASTM E-595 compliant Aremco-Bond(TM) 631 two part, modified epoxy has tensile shear strength of 3,000 psi as measured by ASTM D1002-94, volume resistivity and dielectric strength of 1.2 x 1,014 Wcm and 440 V/mil respectively, and maximum operating temperature of 204ºC. It features total mass loss of 0.75% at 125ºC, and collected volatile condensable materials of 0.35% at 25ºC. Epoxy is resistant to various acids, bases, salts, and organic fluids.

Adhesives have operating temperature range of -55 to 230°C.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Aug 04, 2008 Offered for variety of application techniques such as screen-printing, pad-printing, stencil application, and B-staged films, 118-06 series of single-component, electrically conductive, epoxy adhesives are also available as adhesive films, pre-cast on release liner at dry thicknesses ranging from 10-125 microns. B-staged adhesive films are already partially cured and can complete cure with exact amount of heat/pressure for specific period of time.

Epoxy Adhesive cures in 10-15 min at room temperature.

Epoxy Adhesive cures in 10-15 min at room temperature.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 01, 2008 USP Class VI- and FDA-approved, EP41SMED low-viscosity epoxy adhesive has 5:1 mix ratio by weight. Bonds are resistant to water, oil, and many organic solvents as well as cold sterilants, ETO, and gamma radiation. It contains no solvents or diluents, adheres to wide variety of similar and dissimilar substrates, and is available for use in pint, quart, gallon, and 5 gal container kits. Shelf life in original unopened containers is 6 months minimum.

Water-Borne Epoxy Coating creates fast-drying floor finish.

Water-Borne Epoxy Coating creates fast-drying floor finish.

Chemline Inc.
St. Louis, MO 63103
Jul 14, 2008 With mix ratio of 4A:1B, Monomid(TM) Epoxy Flooring System forms cleanable, high-gloss finish. It offers 5 mils DFT in one coat when applied over Monomid Clear Sealer and can be applied over various other primers for application on steel. Solution supports addition of anti-slip aggregate or sand and also offers moisture resistance. In 3 hr at 77ºF, coating dries to touch to form abrasion- and chemical-resistant finish. Use is suited for industries requiring low odor and VOC levels.

Epoxy-Based Shed Material suits composite insulators.

Huntsman Corp.
The Woodlands, TX 77380
Jul 09, 2008 Semi-flexible, cycloaliphatic epoxy material Araldite® S-HCEP is designed for producing sheds on reinforced fiber-core composite insulators used in medium- to high-voltage outdoor power applications. It exhibits intrinsic hydrophobicity, hydrophobicity transfer, and recovery. Requiring no stirring, degassing, or pre-heating, erosion resistant epoxy has 1:1 mix ratio by volume, permitting meter-mixing on same type of equipment used for liquid silicone rubber.




(Showing headlines 1 - 20)   more ....



 Latest Products in the News


Huntsman Corp.  - April 21, 2008
Huntsman Introduces New Araldite® Epoxy Insulating Systems at IEEE - PES

Ticona Engineering Polymers  - June 12, 2007
RJR Polymers Extends Epoxy Technology to Adhere Vectra® LCP in Electronic Packaging

National Adhesives  - May 9, 2007
Bondmaster Epoxy Adhesives for Motors Now Available in Cartridge Sizes

Henkel Loctite Corporation  - August 8, 2006
New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages


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