Epoxy Compounds

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Sherwin-Williams Announces Water & Wastewater Impact Award Winners

September 29, 2016

Short Elliott Hendrickson; Champion Coatings; Wapasha Construction; and the city of Austin, Minnesota, take top spot in inaugural program honoring project excellence using Sherwin-Williams Protective Marine Coatings CLEVELAND, OHIO – Short Elliott Hendrickson Inc. (SEH®), Champion Coatings, and Wapasha Construction took top honors in the inaugural Sherwin-Williams Impact Award program for... Read More

Adhesives & Sealants, Electrical Equipment & Systems

Rugged Epoxy Encapsulated Package Option for VPT Series

September 20, 2016

BLACKSBURG, VA – VPT® Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI) today announced the availability of a fully encapsulated epoxy package option for its VPT Series of high-reliability DC-DC converters, EMI filters and accessory products. The epoxy packaging allows for aqueous cleaning processes often required in higher volume circuit board production applications. Additionally, the epoxy... Read More

Adhesives & Sealants

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

September 1, 2016

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well... Read More

Adhesives & Sealants

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

July 12, 2016

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K) and a volume resistivity... Read More

Adhesives & Sealants

Epoxy Adhesives target pipeline coatings.

July 5, 2016

Designed for repairing high pressure pipelines, KALFIX 911 and KALFIX 913 are pressure transfer fillers offering extreme adhesion, even to underwater surfaces. For pipeline coating or cold weather use, KALFIX 563 epoxy and curing agent is able to displace water for permanent bond to all substrates with minimal substrate preparation. KALFIX 206, combining liquid epoxy resin and high temperature curing agent, has high heat distortion and cures to hard and dust-free condition at normal temperatures. Read More

Adhesives & Sealants

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

June 22, 2016

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out”... Read More

Adhesives & Sealants

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

May 13, 2016

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also... Read More

Adhesives & Sealants, Paints & Coatings

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

February 24, 2016

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which... Read More

Adhesives & Sealants, Paints & Coatings

Anti-Slip Paints withstand tough industrial applications.

February 19, 2016

By providing textured coating, Good Grip® Anti-Slip Paints eliminate dangerous, slick surfaces almost anywhere in just one coat. Epoxy resin formula adheres to wood, fiberglass, cement, and most materials. Paints dry tack-free in 60 minutes, are fully cured in 24 hours, and are resistant to oil, gas, and most chemicals. Meeting OSHA recommended static coefficient of friction, paints are suitable for interior or exterior use on floors, stairs, ladders, ramps, tool handles, and railings. Read More

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Epoxy Potting Compound resists thermal shock and cycling.

January 19, 2016

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance properties. Applications include electronic potting and encapsulating, casting, coating, and electrical varnishes. Read More

Adhesives & Sealants

One-Component Epoxy Adhesive meets NASA outgassing specifications.

January 14, 2016

Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TC contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates and offers 2,200–2,400 psi tensile lap shear strength, 6,000–7,000 psi tensile strength, and 22,000–24,000 psi compressive strength. Read More

Adhesives & Sealants

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life

December 16, 2015

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli,... Read More

Adhesives & Sealants

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications

November 4, 2015

Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of "shadowing" issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat. Formulated for... Read More

Adhesives & Sealants, Chemical Processing & Waste Management, Materials & Material Processing, Services

Dow to Showcase New Innovations at 2015 Western Coatings Symposium

October 28, 2015

Industry experts from Dow introduce new technologies and present broad portfolio of architectural and industrial coatings technology at the 2015 Western Coatings Symposium PHILADELPHIA – Dow Coating Materials (DCM) and Dow Microbial Control (DMC), business units of The Dow Chemical Company (NYSE: DOW), will discuss and showcase new and time-tested innovations in Las Vegas, Nevada Oct. 25-28... Read More

Adhesives & Sealants

High Temperature Resistant, One Component Epoxy Cures at 200-220°F

October 14, 2015

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other high-tech... Read More

Adhesives & Sealants

Non-Drip Epoxy Paste cures optically clear.

September 1, 2015

Formulated to cure optically clear in thin sections, even though Part A is translucent and Part B is light amber, 2-component EP21NDCL is suited for bonding, sealing, and coating applications. Product has 1:1 mix ratio by weight or volume, which can be adjusted to deliver different properties. Curing at room temperature, paste provides high tensile lap shear, tensile, and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi, and 12,000-13,000 psi, respectively. Read More

Adhesives & Sealants

One-Component No Mix Epoxy features rapid cure properties.

August 18, 2015

Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45–50 min at 175°F or 25–30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and beyond ½ in. deep. Epoxy is resistant to water, oils, fuels, and other chemicals. Read More

Adhesives & Sealants

High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements

July 22, 2015

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a... Read More

Adhesives & Sealants

Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.

July 15, 2015

With 90 min work life, SetWORX 90 toughened, 2-part epoxy adhesive bonds to such diverse substrates as metals, glass, ceramics, wood, and plastics. This Bishphenol A (BPA)-free system, offered in dual cartridges that let operator mix and dispense without weighing and mixing concerns, operates at elevated temperatures and maintains bond strength. Product comes in 50, 200, and 400 mL cartridges with various static mixers. Read More

Adhesives & Sealants

Structural Bonding Epoxy has high-strength, one-part formula.

July 1, 2015

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offers respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000–550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable epoxy has unlimited working life at room temperature, can serve as electrical insulator, and bonds to diverse substrates. Read More