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Adhesives & Sealants -> Epoxy Compounds


Epoxy Compounds




(Showing headlines 1 - 20)   more ....
UV Cure Adhesive suits microelectronic assembly applications.

UV Cure Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Apr 08, 2014 Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Epoxyset, Inc.    Lincoln, RI 02865
Mar 10, 2014 Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations.

Flooring/Wall Products target restaurant industry professionals.

Stuart Dean Co., Inc.    New York, NY 10001
Feb 21, 2014 Used for floor and wall resurfacing, restoration, and protection, HardCore system creates durable floors and walls over new or damaged concrete and other substrates. System includes application of 5 products in various combinations: HardShield water-based, clear epoxy sealer; HardFlor heavy-duty, ¼ in. bonded industrial flooring surfaces; HardCote customizable coating for walls; HardCure high-bond epoxy primer; and HardCove 100% total solids, trowelable epoxy.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jan 31, 2014 Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP.

Epoxy Adhesive suits microelectronic assembly applications.

Epoxy Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Jan 14, 2014 Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.

Thermally Conductive Epoxy serves applications up to 572°F.

Thermally Conductive Epoxy serves applications up to 572°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Nov 25, 2013 Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr with final cure at 200°F in 2 hr. Cured material exhibits thermal conductivity of 12.5 Btu-in/hr-ft²-°F and dielectric strength of 50 V/mil. Respective tensile shear and flexural strengths are 1,800 and 15,500 psi, and Shore D Hardness is 87.

Epoxy Potting Compound provides chemical resistance.

Epoxyset, Inc.    Lincoln, RI 02865
Nov 08, 2013 Stable from -55 to 200°C for potting applications, EPOXICAST EC-1027E withstands thermal cycling and thermal shock, and does not shrink, crack, or delaminate under extreme conditions. Product also provides resistance to ammonia related electrical shorting of encapsulated sensors. Two-part, heat cure only compound comes in various sizes ranging from pint kits to 5-gallon kits.

Thermally Conductive Epoxy is also electrically insulative.

Thermally Conductive Epoxy is also electrically insulative.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 29, 2013 Used for such applications as bonding, sealing, glob top, and die attach, Supreme 3HTND-2GT is thermally stable, with service range of -100 to +400°F; dimensionally stable; and capable of withstanding thermal cycling and shocks. Single-component system does not require mixing and bonds to various substrates used in electronics, including metals, composites, ceramics, and plastics. Able to be readily applied to defined area, system cures in 20–30 min at 250°F or in 5–10 min at 300°F.

Non-Drip Epoxy can be used in indirect food applications.

Non-Drip Epoxy can be used in indirect food applications.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 03, 2013 With thick paste consistency, Master Bond® EP21NDFG bonds to diverse substrates – metals, composites, glass, ceramics, rubbers, plastics – and will not run or sag even when applied to vertical surfaces. Bonds resist thermal cycling as well as chemicals, including water, oils, fuels, acids, bases, and salts. This 2-component, room temperature cure epoxy has non-critical one to one mix ratio by weight or volume, and properties of cured system can be adjusted by altering mix ratio.

ESD Floor Finish enhances industrial environment safety.

SelecTech    Taunton, MA 02780
Aug 28, 2013 Created for industrial areas and open area environments requiring static protection, EpoxyStyle ESD 2-part epoxy floor finish becomes dry to touch within 5–7 hr after application and is ready for traffic 10–12 hr after application. Chemical- and abrasion-resistant product complies with Ozone Transport Commission and California VOC regulations, may be installed over old VCT and concrete, and provides uniform matte finish; gloss can be attained when used with DuraShield ESD finish.

Two-Part Epoxy offers protective barrier for rock crushers.

Adhesives Technology Corp.    Pompano Beach, FL 33064
Aug 02, 2013 Formulated without Nonylphenol or Butyl Glycidyl Ether, 2-component Rok-Tite Backer Epoxy is used for wear protection of gyratory and cone rock crushers. Impact-resistant product has compressive strength of 16,725 in just 24 hr. Providing complete zero-gap coverage, low-odor epoxy is non-flammable and solvent-free with 0 g/L of VOC content. It is available in sustainable packaging system comprised of Easy-Open Tear Tab Pails, Easy-Mix System, and No Mess/No Cleanup containers.

Epoxy Adhesive/Sealant/Coating cures over 170-175°F range.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 16, 2013 Able to cure in 20–30 min at 170 to 175°F or 10–15 min at 250°F, Supreme 3HT-80 does not require any mixing prior to use, has unlimited working life, and can be stored in conventional refrigerators. Single-component, 100% reactive system, offering optimal properties when cured at 250°F, bonds to various substrates — metals, composites, glass, ceramics, vulcanized rubbers, plastics — and does not contain any diluents or solvents. Cured system serves as electrical insulator.

Medical Grade Epoxy has high glass transition temperature.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 12, 2013 Used for bonding, sealing, and coating, Master Bond UV10TKMed passes USP Class VI testing and meets requirements of ISO 10993-5 for cytotoxicity. One-part, optically clear system has service temperature range of -60 to +450°F and glass transition temperature that exceeds 140°C. Resistant to repeated sterilization, this 100% reactive product cures readily in 20–30 sec when exposed to UV light source emitting 320–365 nm with energy output as low as 20–40 mW/cm².

UV Cure Adhesive suits microelectronic assembly applications.

UV Cure Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
May 31, 2013 Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain antimony. Product offers minimal stress, shrinkage, and glass transition temperature values.

Epoxy Crack Injection System provides efficient repair solution.

Adhesives Technology Corp.    Pompano Beach, FL 33064
May 23, 2013 Epoxy Crack Injection System includes Crackbond LR321, Crackbond SLV302, or Crackbond LR321G resins, depending on required viscocity, plus Miracle Bond capping paste and port system. It has latex storage pod, delivering constant pressure for automated injection, which holds up to 1.4 oz of resin. Product's leak control valve keeps resin in and allows air and water to escape. Mounting base, and checking window for installer to view and confirm flow of resin, is also included.

Two Part, Flame-Retardant Epoxy cures at room temperature.

Two Part, Flame-Retardant Epoxy cures at room temperature.

Master Bond, Inc.    Hackensack, NJ 07601
May 02, 2013 Compliant with UL 94V-0 specification, EP21FRNS-2 epoxy has non-halogen filler and suits potting, encapsulation, and casting applications. Moderate viscosity epoxy features 1:1 mix ratio by weight and withstands exposure to chemicals, water, fuels, lubricants, and acids. Serviceable over -51 to +90°C temperature range, product bonds metals, glass, ceramics, and many plastics. It is available in ½ pint, pint, quart, and 1 and 5 gal kits and in syringes, bubble packs, and gun dispensers.

Epoxy Adhesives bond and seal food processing equipment.

Permabond    Somerset, NJ 08873
Apr 30, 2013 Manufactured in compliance with FDA CFR 175.105 and 175.300, two-component Epoxy Adhesives offer shock and impact resistance coupled with environmental and temperature resistance. Range cures at room temperature or can be heated for faster cure. Available in various viscosities, gap filling capabilities, and working times, adhesives are suitable for food contact applications, including bonding filter components and bonding and sealing appliances and food handling equipment.

Bonding Adhesives bond all types of composite materials.

Bonding Adhesives bond all types of composite materials.

Permabond    Somerset, NJ 08873
Apr 26, 2013 Composite Bonding Adhesives include single- and 2-part epoxy adhesives designed for use on substrates such as GRP, FRP, and carbon fiber as well as variety of metal and plastic surfaces. Modified Epoxy hybrid technology, also included in range, offers soft and flexible bonds with high elongation and peel strength. Low shrinkage characteristics make them suitable for bonding thin gauge composites or metal skins which may be affected by witness marks/print through with regular adhesives.

Multi-Purpose Repair Epoxy offers syringe-style packaging.

Adhesives Technology Corp.    Pompano Beach, FL 33064
Feb 25, 2013 To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed, epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties, product is suitable for overhead and vertical repairs, and can also be used on damp to wet surfaces.

High-Temperature Epoxy Adhesive is electrically conductive.

Epoxyset, Inc.    Lincoln, RI 02865
Jan 29, 2013 Used for bonding in electronics and aerospace components requiring resistance of up to 400°F, halogen-free Epoxyohm 97M (EO-97M) is formulated using pure silver powders and latent curing agent. All constituents are electrically and thermally conductive. Silver-filled epoxy adhesive exhibits volume resistivity of below 0.0004 Ω-cm when cured and tensile strength of 1,500 psi (Al to Al) and complies with REACH as well as RoHS standards.




(Showing headlines 1 - 20)   more ....



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