Aremco Products, Inc.    Valley Cottage, NY 10989
Feb 07, 2012 Consisting of unfilled, 100% solids epoxy system, Aremco-Bond(TM) 526N can be used continuously at temperatures to 570°F. Product features volume resistivity of 4.0 x 10¹⁴ W-cm, dielectric strength of 450 V/mil, and dielectric constant of 3.01 at 1.0 Hz. Flexural and tensile strengths are 16,000 and 2,800 psi, respectively. With 1:1 mix ratio, epoxy provides mixed viscosity of 4,000 cP and pot life of 2.5 hr. Product adheres to ceramics, glass, metals, and plastics substrates.

Master Bond, Inc.    Hackensack, NJ 07601
Jan 13, 2012 Suited for medical applications, silver-filled EP3HTSMED is 100% reactive with tensile shear strength exceeding 1,000 psi and volume resistivity less than 0.001 Wcm. Thixotropic paste requires no mixing and needs only contact pressure during heat cure of 20-40 min at 300°F or 40-90 min at 250°F. Serviceable over temperature range of -60 to 400°F, electrically conductive product is resistant to severe thermal cycling as well as water, fuels, oil, and most organic solvents.

Henkel Corporation    Rocky Hill, CT 06067
Jan 05, 2012 Packaged in 90 mL reusable dual-cartridge dispenser, Loctite® Nordbak® 7255(TM) protects metal surfaces on industrial equipment from wear, abrasion, and corrosion. Two-part, solvent-free, thixotropic epoxy creates smooth, low-friction surfaces and may be used in overhead applications. Suitable for large surfaces and complex or intricate areas, coating can protect tank linings, mixing vessels, pump housings, impellers, chutes, troughs, and centrifuge components.

Master Bond, Inc.    Hackensack, NJ 07601
Nov 22, 2011 Formulated for bonding, sealing, and coating, UV16 single-component, no-mix system cures in 1 min or less at room temperature with commercial UV light sources. This 100% reactive epoxy, uninhibited by oxygen, does not release any solvents or volatiles during cure. Cured in thicknesses up to 0.125 in. with 2%-3% shrinkage rate, solution delivers tensile strength exceeding 4,100 psi and Shore D hardness greater than 75. Product has viscosity of 200-400 cps and adheres to array of substrates.

Creative Materials Inc.    Ayer, MA 01432
Oct 11, 2011 Available as paste, film, or pressure-sensitive tape, Anisotropic Conductive Adhesives are conductive in Z-axis and non-conductive in X- and Y-axis. During curing process, particles in adhesive become stacked in vertical configuration, providing conductivity for component that is mounted to surface, while remaining electrically insulating on X and Y axes. Applications include RFID manufacture, flat panel displays, and assembly of semiconductor modules.

Epoxy Technology, Inc.    Billerica, MA 01821
Sep 16, 2011 Designed to meet extensive certification requirements of Test Method 5011 in MIL-STD 883, EPO-TEK®H20E- MP and EPO-TEK® EK1000-MP deliver optimal thermal management and electrical conductivity. Single component, silver-filled EPO-TEK EK1000-MP is formulated with shiny finish to maximize device reflectivity. Both products are suited for solar modules and concentrators, LEDs, and high reliability military devices.

ITW Devcon    Danvers, MA 01923
Sep 12, 2011 With 4 min working time and ability to achieve functional cure in 30 min, DFense Blok(TM) Quick Patch is formulated for emergency repairs to processing equipment, even in severe conditions, and suited for patching of holes, leaks, and cracks. Alumina ceramic bead-filled epoxy compound protects against wear, abrasion, and corrosion and helps extend equipment service life. Non-sagging product can be used at thicknesses up to 1 in. on vertical surfaces and ¾ in. on overhead surfaces.

Henkel Corporation    Rocky Hill, CT 06067
Aug 19, 2011 Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, Loctite® 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, Loctite® 3382(TM) sets up in 5-7 hours, emits no caustic odor, and will not corrode equipment.

ITW Devcon    Danvers, MA 01923
Jul 06, 2011 DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45° angle. With working time of 25 min, non-sagging compound can be applied by trowel at thicknesses of ¾ in. on vertical surfaces and ½ in. on overhead surfaces. Functional cure occurs in 4-5 hr.

Aremco Products, Inc.    Valley Cottage, NY 10989
May 03, 2011 Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 10¹⁵, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight, Aremco-Bond 2315 cures in 2 hours at 160°F plus 2 hours at 300°F.

Master Bond, Inc.    Hackensack, NJ 07601
Apr 20, 2011 Formulated with blend of polymeric and inorganic materials, 100% reactive EP30LTE-LO is used for bonding, sealing, casting, and coating applications. This 2-component epoxy exhibits dimensional stability and is serviceable over -60 to +250°F range. CTE is 12x10^-6 in./in./°C, and shrinkage rate is less than 0.0002 in./in. Producing bonds with tensile strength over 5,000 psi, electrically insulative product bonds to metals, glass, ceramics, wood, vulcanized rubbers, and plastics.

Master Bond, Inc.    Hackensack, NJ 07601
Mar 25, 2011 Serviceable over wide range of 4 K to 250°F, Polymer System EP37-3FLF cures at room temperature in 2-3 days or faster at elevated temperatures. Optically clear, 2-component epoxy offers non-critical 1:1 mix ratio and low mixed viscosity of 1,400-1,500 cps. With bond shear strength exceeding 2,000 psi and T-peel strength of 25 pli, flexible epoxy bonds to metals, glass, ceramics, rubber, and many plastics, and may serve as potting, encapsulating, and casting system.

Master Bond, Inc.    Hackensack, NJ 07601
Mar 03, 2011 Used for coating, lining, bonding, or sealing, EP21AR withstand acidic environments - including immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over one year. This 2-component epoxy, with dielectric strength of 400 V/mil, also acts as electrical insulator and is serviceable from -60 to +275°F. It produces abrasion-resistant bonds with tensile strength over 10,000 psi, shear strength exceeding 2,700 psi, and compressive strength greater than 14,000 psi at 75°F.

Creative Materials Inc.    Ayer, MA 01432
Mar 01, 2011 Formulated for use in manufacture of computer components and LEDs, 109-12 Thermally Conductive Low-Stress Epoxy is resistant to thermal-cycling and exhibits minimal shrinkage during cure. Thermal adhesive, used to interface between heat-producing component and heat-sink in electronics designs, has viscosities of 500,000 cps at room temperature or 60,000 at 50°C. This reduces air entrapment, required amount of applied product, and thermal resistance.

Master Bond, Inc.    Hackensack, NJ 07601
Jan 20, 2011 Formulated for structural applications in extreme environments with temperatures from -80 to +425°F, Master Bond Supreme 33 bonds to metals, glass, ceramics, wood, vulcanized rubbers, and many plastics. Toughened 2-component adhesive resists thermal cycling, thermal shock, and impact as well as water, oil, and many organic solvents. Designed to cure at room temperature in 48-72 hr, 100% reactive epoxy achieves shear strength over 2,500 psi and tensile shear strength greater than 7,500 psi.

Master Bond, Inc.    Hackensack, NJ 07601
Jan 14, 2011 Designed to bond to similar and dissimilar substrates, Master Bond EP13ND requires no mixing, has unlimited working life at room temperature, and features service operating temperature of -60 to 450°F. Product cures at temperatures of 300-350°F in 60-90 minutes. Upon cure, adhesive obtains tensile shear strengths in excess of 3,500 psi at 75°F. Formula is 100% reactive, does not contain solvents or diluents, and offers resistance to fuels, acids, bases, oils, and many solvents.

Master Bond, Inc.    Hackensack, NJ 07601
Dec 15, 2010 With thermal conductivity over 22 BTU/in/ft²/hr/°F and serviceability from -60 to +400°F, EP21ANHT helps mitigate issues associated with tightly packed components and miniaturized electronic circuits. This 2-component adhesive, sealant, and coating has 1:1 mix ratio by weight or volume and cures at room or elevated temperatures. Also able to act as electrical insulator, cured adhesive exhibits dielectric strength over 400 V/mil and tensile shear strength over 1,000 psi.

Henkel Corporation    Rocky Hill, CT 06067
Nov 17, 2010 Designed to meet UL-674 requirements for explosion-proof motors, Loctite® E-40EXP(TM) maintains more than 85% of its compression strength following exposure to 13 harsh chemicals. Two-component compound is used to pot and seal wire conduits, isolating electric motor from hazardous vapors and chemicals that could cause explosion. Curing in approximately 2 hours at room temperature, material will not expand and experiences very little shrinkage, facilitating accurate dispensing.

Master Bond, Inc.    Hackensack, NJ 07601
Nov 12, 2010 Formulated for applications subject to temperature cycling, vibration, and mechanical shock, EP21TDCHT-LO withstands cryogenic temperatures and meets NASA low outgassing specifications. It offers 1:1 mix ratio by weight or volume and cures at room temperature or more rapidly at elevated temperatures. Properties include 4K to +350ºF service temperature range, shear strength exceeding 2,500 psi, peel strength of greater than 20 pli, and Shore D hardness of greater than 60.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 22, 2010 Developed for coating and lining storage tanks, piping, scrubbers, and processing equipment in chemical industry, Master Bond EP21ARHT produces bond strength greater than 2,200 psi once fully cured. Also used in electronic, electrical, and metalworking industries, product can withstand immersion in 96-98% sulfuric acid and 20% hydrochloric acid for more than 1 year. Epoxy features dielectric strength of 440 V/mil and can be thermally cycled over temperature range of -60 to +400°F.