Adhesives Technology Corp.    Pompano Beach, FL 33064
May 23, 2013 Epoxy Crack Injection System includes Crackbond LR321, Crackbond SLV302, or Crackbond LR321G resins, depending on required viscocity, plus Miracle Bond capping paste and port system. It has latex storage pod, delivering constant pressure for automated injection, which holds up to 1.4 oz of resin. Product's leak control valve keeps resin in and allows air and water to escape. Mounting base, and checking window for installer to view and confirm flow of resin, is also included.

Master Bond, Inc.    Hackensack, NJ 07601
May 02, 2013 Compliant with UL 94V-0 specification, EP21FRNS-2 epoxy has non-halogen filler and suits potting, encapsulation, and casting applications. Moderate viscosity epoxy features 1:1 mix ratio by weight and withstands exposure to chemicals, water, fuels, lubricants, and acids. Serviceable over -51 to +90°C temperature range, product bonds metals, glass, ceramics, and many plastics. It is available in ½ pint, pint, quart, and 1 and 5 gal kits and in syringes, bubble packs, and gun dispensers.

Permabond    Somerset, NJ 08873
Apr 30, 2013 Manufactured in compliance with FDA CFR 175.105 and 175.300, two-component Epoxy Adhesives offer shock and impact resistance coupled with environmental and temperature resistance. Range cures at room temperature or can be heated for faster cure. Available in various viscosities, gap filling capabilities, and working times, adhesives are suitable for food contact applications, including bonding filter components and bonding and sealing appliances and food handling equipment.

Permabond    Somerset, NJ 08873
Apr 26, 2013 Composite Bonding Adhesives include single- and 2-part epoxy adhesives designed for use on substrates such as GRP, FRP, and carbon fiber as well as variety of metal and plastic surfaces. Modified Epoxy hybrid technology, also included in range, offers soft and flexible bonds with high elongation and peel strength. Low shrinkage characteristics make them suitable for bonding thin gauge composites or metal skins which may be affected by witness marks/print through with regular adhesives.

Adhesives Technology Corp.    Pompano Beach, FL 33064
Feb 25, 2013 To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed, epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties, product is suitable for overhead and vertical repairs, and can also be used on damp to wet surfaces.

Epoxyset, Inc.    Lincoln, RI 02865
Jan 29, 2013 Used for bonding in electronics and aerospace components requiring resistance of up to 400°F, halogen-free Epoxyohm 97M (EO-97M) is formulated using pure silver powders and latent curing agent. All constituents are electrically and thermally conductive. Silver-filled epoxy adhesive exhibits volume resistivity of below 0.0004 Ω-cm when cured and tensile strength of 1,500 psi (Al to Al) and complies with REACH as well as RoHS standards.

H.B. Fuller Co., North America    St. Paul, MN 55110
Jan 17, 2013 Intended for electronics manufacturing, FH1438AB 2-part epoxy resin features durometer value of 70 Shore 00, providing protection to surface mount components during wide range of temperature cycles. Flexible potting compound is also formulated with resistance to age hardening, which provides consistent durometer measurement over time while maintaining resistance to salt water and Fuel C. Product adheres to aluminum, most plastics, and Viton® fluoroelastomer with no primer requirements.

Epoxyset, Inc.    Lincoln, RI 02865
Dec 11, 2012 Available in pints, quarts, and gallons as well as dual cartridges, EB-316M 2-part, room temperature curing epoxy exhibits 65–75 Shore D hardness, 25 T-peel strength (piw), and 3,200 psi lap shear strength at 25°C. Colors and 1:1 mix ratio between Part A and Part B make this product suitable for lab, production, or field use. Resistant to shock, vibration, and flexing, epoxy exhibits less than 0.8% total mass loss and can be used to bond metals, woods, plastics, rubbers, and masonry.

Mereco Technologies Group Co.    West Warwick, RI 02893 2927
Dec 10, 2012 Comprising 2-component epoxies with 86 Shore D hardness, Mereco 3500 Series produces hard, smooth, and clean polishing surface for terminating single- and multi-mode fiber optic connectors and fiber optic bundle potting, encapsulating glass fibers in ferrules, and bonding to variety of substrates, including most metals, glass, plastic, and ceramic. Six formulations are available with varying viscosity, working life, and cure time, with or without color change.

Aremco Products, Inc.    Valley Cottage, NY 10989
Nov 14, 2012 Offering tensile shear strength of 4,560 psi, Aremco-Bond™ 2300 consists of 100% solids epoxy mixed in ratio of 10 parts resin to 1 part hardener by weight. Mixed viscosity is 5,000 cP and pot life for 100 g mass is approximately 45 min. Milky-clear product provides resistance to acids, alkalis, organic fluids, and salts. Supplied in pint, quart, and gallon kits, adhesive is suited for bonding engineered thermoplastics, ceramic wear tiles, and sheet molding compounds.

Aremco Products, Inc.    Valley Cottage, NY 10989
Sep 26, 2012

Mixed in ratio of 1 part base resin to 1 part activator by weight, Aremco-Bond™ 860 exhibits optimal adhesion to high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. Aluminum nitride filled epoxy cures in 24 hr at room temperature or in 2 hr at 200°F. After curing, product exhibits thermal conductivity of 8.5 Btu-in./hr-ft²-°F and dielectric strength of 250 V/mil. Epoxy is intended for electrical and electronic bonding applications.

Epoxyset, Inc.    Lincoln, RI 02865
Sep 07, 2012 Offered in 2-part kits or premixed and frozen syringes, Epoxibond 112LC-1 bonds ceramic, glass, plastic, metal, and other substrates that require heat and chemical resistance. Clear, unfilled, 100% solids epoxy system exhibits tensile strength of 2,200+ psi, has 90+ shore D hardness, and can snap cure at 150°C or higher. With pot life of 6+ hr, halogen-free product can also be used to pot or encapsulate small electronic components as well as seal or coat parts for chemical resistance.

Aremco Products, Inc.    Valley Cottage, NY 10989
Aug 15, 2012 Able to be used in applications to 400°F, Aremco-Bond(TM) 820 is suited for general-purpose bonding of ceramics, glass, plastics, metals, and other substrates. This clear, unfilled, 100% solids epoxy system mixes in 1:1 ratio, providing mixed viscosity of 12,000 cps and cure time of 45 min at room temperature. Along with respective flexural and tensile shear strengths of 8,000 and 1,200 psi, properties include 860 V/mil dielectric strength and 70 Shore-D hardness.

Epoxies Etc.    Cranston, RI 02921-3407
Aug 14, 2012 Able to withstand stretching, impact, and heating/cooling, 50-3122 is formulated to maintain optimal peel and shear strength over -60 to +205°C range. This 100% solids system, in addition to offering electrical insulation, is resistant to vibration, stress fatigue cracking, and chemicals. Product does not require any mixing and cures in 5 min to 2 hr depending on cure temperature. Areas of use include electronic, electrical, aerospace, automotive, and industrial applications.

Permabond    Somerset, NJ 08873
Aug 08, 2012 Developed to bond engineering materials such as composites, thermoplastics, metals, and ceramic materials, Permabond ET5401 can survive 285°F continuously while maintaining its performance characteristics. Exposure to higher temperatures for short periods is possible, providing adhesive is not overly stressed. Exposure to 175°F for 1 hr increases adhesive strength and long-term structural performance. Structural epoxy adhesive is suited for bonding dissimilar materials.

Master Bond, Inc.    Hackensack, NJ 07601
Jul 26, 2012 Able to adhere to metals, glass, ceramics, and plastics and withstand temperatures from 4K to +400°F, Supreme 10HT exhibits tensile shear strength in excess of 3,600 psi and T-peel strength up to 30 pli. Flexibility and toughness foster resistance to thermal cycling, mechanical shock, vibration, and stress fatigue cracking. Able to withstand exposure to variety of chemicals, single-part system eliminates mixing and cures in 60-75 minutes at 250°F. Cured epoxy acts as electrical insulator.

DELO Industrial Adhesives    Windach   Germany
Jul 03, 2012 Designed to bond tiny chips to defined positions on RFID antenna, DELOMONOPOX AD268 adheres to variety of flexible and rigid substrates, including PET, polyimide, FR4, copper, aluminum, and silver. Anisotropic epoxy resin cures in 6 seconds at 190°C with thermode, enabling up to 20,000 microchips to be bonded per hour on flip-chip production system.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jun 29, 2012 With tensile shear strength of 2,350 psi and flexural strength of 11,800 psi, Aremco-Bond(TM) 2150 is suited for bonding ceramic wear tiles used to line chutes, ducts, centrifuges, and other components that experience high abrasion and erosion. Ceramic-filled, black pigmented, 100% solids epoxy operates at up to 400°F and is resistant to acids, alkalis, organic fluids, and salts. Curing occurs at room temperature within 24 hours or in 30 minutes at 200°F.

Engineered Materials Systems Inc.    Delaware, OH 43015
Jun 21, 2012 Non-conductive 535-10M-1 is flexible epoxy adhesive that suits disk drive, camera module, optoelectronic, and circuit assembly applications. Product is designed to eliminate any crowning (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in head stack assembly. Also, this antimony-free adhesive can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.

Epoxyset, Inc.    Lincoln, RI 02865
Jun 20, 2012 Suited for semiconductors and transistors, EB-350-3LV exhibits stability at room temperature and accelerated curing at elevated temperatures. Single-component, low-viscosity epoxy encapsulant, with its flame out properties, will meet UL-94VO testing and has glass transition temperature of 140°C. Supplied in pint, quart, and gallons as well as 10 oz Semco cartridges, product withstands thermal shock when fully cured and offers continuous service up to 180°C.