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Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics. Surfaces primed with X21Med are... Read More
Offering pull strength up to 180g at room and high temperatures, SMT 256EP Encapsulant Adhesive Paste improves solder joint strength. Used for mass production via dispensing or printing, unit is suitable for high temperature applications up to 300°C and package level applications.Read More
Polyset, a leading manufacturer of polymer materials, offers a lightweight epoxy paste patching material. Designed for overhead and vertical applications, Ply-Seal® Epoxy Paste has excellent adhesion to most construction materials.
Ply-Seal® Epoxy Paste is a 100% solids, two-component, moisture insensitive, lightweight, thixotropic, waterproof, epoxy paste patching material that meets... Read More
Dosing of abrasive thermal pastes in cyclic operation The ultimate stress test for stator materials Abrasive thermal pastes are found in a range of applications. In the production of LEDs and circuit boards in the electronics industry and in the area of control systems in automotive applications - to name but a few examples. Through the regulation of thermal resistance, these pastes, referred to... Read More
ElectrolubeÂ manufactures electro-chemical products for the electronics industry. These include thermal management products, compounds, coatings, lubricants and cleaning agents. With its expansive product range of formulated chemical products, Electrolube supplies manufacturers of electronic, industrial and domestic devices for a variety of industries, thus offering the ‘complete solution’... Read More
Designed for minimally prepared sound rusted steel and previously coated surfaces, Series 118 Uni-Bond Mastic provides rust-inhibitive tie coat that can be used with acrylic and solvent-borne urethane and fluoropolymer finish coats. It is possible to apply 6–8 mils dry film thickness per coat. Single component product sprays on easily with dry-fall characteristics that minimize potential for... Read More
Available in 3 strengths, Resbond™ 907TSG provides high-temperature, thermally stable, electrically insulating, and chemical-resistant seals up to 2,100Â°F. ProductÂ comes in Blue Standard for general purpose use, Red High Strength for vibrating applications, and Gold High Strength to fill large gap widths. Packaged in 4 oz applicator bottles, gel goes exactly where is is applied and cures... Read More
Heraeus to Introduce SOL9631 Series and New Double Printing Pastes at the European Photovoltaic Solar Energy Conference and ExhibitionSep 15, 2015
Heraeus to highlight new metallization pastes for conventional and advanced cell design solar cells HANAU, Germany, - The Heraeus Photovoltaics Global Business Unit will be attending the 29th European Photovoltaic Solar Energy Conference and Exhibition [EU PVSEC 2015 at the Congress Center Hamburg, in Hamburg, Germany from September 15th - 17th 2015. Exhibiting in... Read More
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Master Bond EP48TC has thermal resistance of 5–7 x 10–6 K•m2/W, which enables thermal conductivity of 20–25 BTU•in/ft2•hr•Â°F. Applied in bond lines as thin as 10–15 microns, epoxy paste has tensile lap shear strength from 900–1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75Â°F is 90–120 min. Curing at room... Read More
Heraeus Features Award-winning SOL9620 and SOL9621 Series at PV Taiwan 2014, the Taiwan International Photovoltaic ExhibitionOct 27, 2014
TAIPEI - The Heraeus Photovoltaics Business Unit will be exhibiting at this year's PV Taiwan 2014 photovoltaic exhibition from October 22nd -- 24th in Taipei, Taiwan. Heraeus, featuring their line of metallization pastes for conventional and advanced solar cell designs in Hall 1, Booth A0708. Heraeus will feature their award winning SOL9620 and SOL9621 Series of front-side metallization... Read More
Formulated for bonding and coating mica, glass-ceramics, and metals, Ceramabond™ 632 features dielectric strength of 150 V/mil at room temperature, coefficient of thermal expansion of 4.7 ppm/Â°F, and viscosity of 10,000–25,000 cp. Specific gravity is 1.45–1.50 g/cc and pH is 11.0. Applied using brush, syringe, or pneumatic dispenser,Â mica-filled adhesive sets rapidly at room... Read More
Treviso, Italy - Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems, a leading supplier of conductive interconnect materials for photovoltaic applications, have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines. The companies will... Read More
Collaboration on Materials Continues to Enhance Solar Cell Efficiency RESEARCH TRIANGLE PARK, N.C. –Â DuPont™ SolametÂ® PV18x series photovoltaic metallization paste is helping REC, a leading global provider of solar energy solutions, to develop its most powerful solar panels to date. The achievement is the result of collaboration over the last four years that has focused on optimizing... Read More
Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr withÂ final cure at 200Â°F in 2 hr. Cured material exhibitsÂ thermal conductivity of 12.5 Btu-in/hr-ftÂ²-Â°F and dielectric strength of 50 V/mil.... Read More
Nordson EFD to Exhibit Multiple Technologies for Improving Efficiency and Profitability in Electronics Manufacturing ProcessesNov 11, 2013
Company will showcase a range of innovative fluid dispensing solutions at Jisso/Protec Japan 2012 trade show TOKYOÂ – Nordson EFD, a subsidiary of Nordson Corporation (Nasdaq: NDSN), will be demonstrating their latest fluid dispensing technologies for improving electronics manufacturing processes at Jisso/Protec Japan 2012, to be held in Tokyo June 13-15. Nordson EFD products, including their... Read More
Heraeus provides Taiwan with local customer service supported by global resources. TAIPEIÂ — The Heraeus Photovoltaics Business Unit will be exhibiting at this year's PV Taiwan 2013 photovoltaic exhibition from October 30th - November 1st in Taipei, Taiwan. Heraeus will feature their line of metallization pastes for conventional and advanced solar cell designs in Hall 1, Booth A0910. Jason... Read More
Torrington, Connecticut -- Dymax Market Segment Manager Virginia Read will give a technical presentation at the upcoming Assembly Show, October 28 to 30 in Rosemont, IL (www.theassemblyshow.com). Ms. Read’s presentation, “Is LED Technology in Your Future?” will be held at 2:15 p.m. on Tuesday, October 29, as part of the Showcase Theater. She will demonstrate the savings an optimized... Read More
Â Heraeus to showcase new metallization pastes for higher efficiency solar cells at a lower cost per Wp HANAU, GermanyÂ – The Heraeus Photovoltaics Business Unit will be attending the exhibition of EU PVSEC 2013 in Paris, Parc des Expositions Paris Nord Villepinte, hall 2, booth 2/C3, from October 1-3, 2013. Heraeus will be highlighting several of their newest products in their current... Read More
Designed for installation of tackstrip and metal carpet trim, HOTSHOT™ glue guns feature 250Â W heaters for accelerated start-up and output of up to 5 1/2 lb of glue per hour (one stickÂ per minute). Detachable stand, full-hand trigger, and Hi-Flow Tip are also standard. Additionally, 828T model includes adjustable thermostat for varying glue formulations and applications. HOTSHOT Â½ in.... Read More
While extremely porous, Vitrium3 Bond adheres strongly to grains, allowing grinding wheels to be used safely at speeds up to 80 m/sec. Wheel form retention and radius accuracy are optimized, minimizing dressing time and wear on diamond dresser and wheel.Â Free flow of coolant through porous matrix results in efficient chip clearance, avoiding wheel loading and clogging. Grinding burn is... Read More