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Adhesives & Sealants -> Adhesives Products, Equipment & Services -> Other


(Showing headlines 1 - 20)   more ....
High Temperature Adhesive suits applications to 2,300°F.

High Temperature Adhesive suits applications to 2,300°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jun 09, 2014 Formulated for bonding and coating mica, glass-ceramics, and metals, Ceramabond™ 632 features dielectric strength of 150 V/mil at room temperature, coefficient of thermal expansion of 4.7 ppm/°F, and viscosity of 10,000–25,000 cp. Specific gravity is 1.45–1.50 g/cc and pH is 11.0. Applied using brush, syringe, or pneumatic dispenser, mica-filled adhesive sets rapidly at room temperature and step cures at 200°F and 500°F for 2 hours each. Cured material resists most acids, solvents, and fuels.

Thermally Conductive Epoxy serves applications up to 572°F.

Thermally Conductive Epoxy serves applications up to 572°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Nov 25, 2013 Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr with final cure at 200°F in 2 hr. Cured material exhibits thermal conductivity of 12.5 Btu-in/hr-ft²-°F and dielectric strength of 50 V/mil. Respective tensile shear and flexural strengths are 1,800 and 15,500 psi, and Shore D Hardness is 87.

Professional Glue Gun accelerates tackstrip, trim installation.

Professional Glue Gun accelerates tackstrip, trim installation.

Taylor Tools    Denver, CO 80239
Aug 27, 2013 Designed for installation of tackstrip and metal carpet trim, HOTSHOT™ glue guns feature 250 W heaters for accelerated start-up and output of up to 5 1/2 lb of glue per hour (one stick per minute). Detachable stand, full-hand trigger, and Hi-Flow Tip are also standard. Additionally, 828T model includes adjustable thermostat for varying glue formulations and applications. HOTSHOT ½ in. acrylic formulated glue sticks feature 100 lb/ft shear value.

Vitrified Grinding Wheels incorporate abrasive bond.

Vitrified Grinding Wheels incorporate abrasive bond.

Saint-Gobain Abrasives, Inc.    Stafford ST16 1EA  United Kingdom
Jun 14, 2013 While extremely porous, Vitrium3 Bond adheres strongly to grains, allowing grinding wheels to be used safely at speeds up to 80 m/sec. Wheel form retention and radius accuracy are optimized, minimizing dressing time and wear on diamond dresser and wheel. Free flow of coolant through porous matrix results in efficient chip clearance, avoiding wheel loading and clogging. Grinding burn is practically eliminated, and so too are residual stresses and metallurgical change in surface of component.

Loose Leaf Ring Binders  open and close 250,000 times.

Loose Leaf Ring Binders open and close 250,000 times.

Advanced Looseleaf Technologies Inc.    Dighton, MA 02715
Jun 21, 2011 Featuring one-piece construction, Advanced Looseleaf Turned Edge Binders are made from laminated litho wrapped board featuring full-color graphics and sculpted DuraScore(TM) Hinges that can be positioned anywhere for optimum durability. Binders are made to order with curved or flat spines and round- or D-rings. Applications include training and service manuals as well as guest services and real estate presentations.

Photovoltaic Metallization Pastes boost solar cell efficiency.

Photovoltaic Metallization Pastes boost solar cell efficiency.

DuPont Microcircuit Materials    Research Triangle Park, NC 27709
Jun 22, 2010 DuPont(TM) Solamet® PV16x series photovoltaic metallizations are frontside metallization pastes that can raise efficiency of crystalline silicon solar cells by up to 0.4%. Products are capable of contacting shallow emitters of up to 85 W/square as well as deep emitters. Featuring low-contact resistance, they are available in options suitable for various printing requirements, including fine lines of less than 80 µm, with high aspect ratio patterning to improve line conductance.

Photovoltaic Metallization Paste is lead free.

DuPont Microcircuit Materials    Research Triangle Park, NC 27709
Sep 30, 2009 Targeted at PV cell and module manufacturers, environmentally friendly DuPont(TM) Solamet® PV173 photovoltaic metallization paste for crystalline silicon solar cells provide high adhesion, and enable advanced fine line designs down to 80 microns. It is compatible with lead free Solamet® PV502 and PV505 tab silver pastes, and PV38x aluminum pastes.

Lubricants and Sealants are offered with 7 oz plungers.

MPT Industries    Dover, NJ 07801
May 22, 2009 OC Five Paste and OC Seven Grease are available with plungers that facilitate precise application and provide leak-tight seals for cylinder threads, valves, regulators, o-rings, gaskets, and more. Both products are suitable for use in critical applications, where compatibility with oxygen, resistance to aggressive chemicals, and service failure cannot be tolerated. Their properties remain unaltered in temperatures ranging from cryogenic to over 450°.

Hot Melt Adhesive bonds carpet tack strips.

PAM Fastening Technology, Inc.    Charlotte, NC 28208
May 22, 2009 Suitable for use with HB 220 Hot Melt Glue Gun, Series UX 8012 creates non-toxic bond between carpet tack or metal clips and finished concrete, fiber cement backer, or wood before stretching carpet over floor. One inch glue strip is used for each 4 ft of carpet tack or metal strip. With open time of 40 sec, adhesive must be applied at 390°F to achieve max bond strength. Product dries firm but has rubber like quality that prevents brittleness.

Hot Melt Adhesive repairs knots and damaged wood.

Power Adhesives, Ltd.    Charlotte, NC 28209
May 20, 2009 Containing no harsh solvents, non-flammable KNOT-TEC(TM) Wood Repair System Starter Kit consists of 12 glue sticks, TEC(TM) 250 hot melt adhesive applicator, silicon release mat, 2 metal heat sink blocks, and DVD. TECBOND(TM) 7718 glue sticks are supplied in black, light beige, amber, and cola to match any color wood. Glue gun reaches operating temperature of 380°F in 5 min, and after filling wood or knot with molten adhesive, heat sink block pushes adhesive into area and forms flat smooth finish.

Single-Part Paste bonds specialty halogen lamps.

Single-Part Paste bonds specialty halogen lamps.

Aremco Products, Inc.    Valley Cottage, NY 10989
May 11, 2009 Suited for automatic dispensing in high-speed production systems, water-based Ceramabond(TM) 835 bonds aggressively to ceramics, glasses, and metals. This zirconia-based, ceramic adhesive exhibits typical properties such as operating temperature resistance of 3,000°F, dielectric strength of 200 V/mil, and tensile-shear strength of 500-600 psi after exposure to 1,000°F. Inert material, which is resistant to moisture and thermal shock, exhibits no outgassing upon curing.

Sprayable Mastic targets joints where movement is required.

Sprayable Mastic targets joints where movement is required.

Hilti, Inc.    Tulsa, OK 74121
Aug 28, 2008 For firestopping top of wall, expansion, and edge of slab/curtain wall joints, CP 672 Fast Cure Speed Spray is paintable and designed for use with concrete floor assemblies. Applicable by spray or brush, water-based mastic makes spills and over-spray quick to clean up. Containing no halogens, solvents, or asbestos, spray meets LEED requirements for indoor environmental quality. Product can be applied with SprayTech EPX 2355 or EPX 2555 sprayers.

Dipping Paste combines solder spheres and flux vehicle.

Almit Technology Ltd    East Sussex RH18 5DW  United Kingdom
May 30, 2008 Comprising of Sn96.5/Ag3.0/Cu0.5 with solder powder size of 4-24 microns, LFM 48 N paste suits package warpage and package-on-package fluxing applications during reflow. Paste delivers consistent dipping transfer characteristics coupled with strong tack performance to hold large devices firmly in position on high speed Pick and Place systems. It features designed Open Time in dipping tray of 8 hr (at 23°C and 50% RH) and up to 8 hr process window time between dipping and reflow.

Adhesive System is solvent-free and has no shelf-life.

Power Adhesives, Ltd.    Charlotte, NC 28209
Feb 15, 2008 Suited for securing and positioning reinforcement materials in vacuum infusion processes, VAC-TAC(TM) aerosol adhesive system consists of Powder Adhesives TEC 6300 spray hot melt glue gun, 20 ft of hose, and VAC-TAC(TM) adhesive in hot melt cartridge form. System holds even large composite material structures in place as well as typical vacuum processing products including reinforced fabrics, foam, balsa, bleeders, breathers, peel plies, and release films.

Mold Repair Paste comes in 50 ml dual-barrel cartridges.

Prairie Technology Group Inc.    Hutto, TX 78634
Nov 02, 2007 Formulated to produce long-lasting repairs to fiberglass molds, RAPID PATCH repair paste can be feathered out after curing for less than 20 minutes at 75ºF. It chemically bonds to damaged mold sections, and offers sag resistance even when applied to vertical surfaces. Based on methylmethacrylate (MMA) chemistry, fast-curing paste can also be used for filling plastic, steel, and aluminum substrates that require patching.

Conductive Pastes suit display and solar cell applications.

Five Star Technologies Ltd.    Cleveland, OH 44142
Oct 16, 2007 Targeted at display bus bar electrodes, ElectroSperse D-110, D-112, and D-114 are screen-printable pastes that deliver adhesion when fired onto indium tin oxide or fluorine-doped tin oxide-coated glass. Type D-114 achieves sheet resistivity of 1.2-1.8 mW/sq, while D-112 and D-114 achieve 2-3 and 4-5 mW/sq, respectively. Lead-free products are RoHS and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) compliant.

Die Attach Paste works with small die on copper leadframes.

Henkel Corporation    Madison Heights, MI 48071
Aug 16, 2007 Formulated for manufacturing flexibility through ease of set-up and consistent performance, Hysol® QMI708(TM) is developed to attach die 2.5 x 2.5 mm and smaller in QFN and SOIC packages using copper finished leadframes. Conductive product exhibits minimal bondjoint resistance, minimizing energy drainage. Properties of this material allow for wide dispense window, and product dispenses without tailing.

Adhesive Paste suits flip chip image sensor applications.

Henkel Consumer Adhesives, Inc    Avon, OH 44011-1355
Jan 23, 2007 Hysol® FP5110 offers adhesion to 2- and 3-layer flexible printed circuits by bonding to polyimide and epoxy adhesive material. It provides an alternative to mechanical soldering by bonding bumps to substrate through lead-free compatible thermal compression process that eliminates need for flux application, reflow, and cleaning. Other features include 10 sec SnapCure at 180°C, storage requirements of -15°C, and compatibility with ultrasonic bonding processes.

Adhesive Paste suits stacked die applications.

Henkel Corporation    Rocky Hill, CT 06067
Aug 18, 2006 Designed to meet requirements of semiconductor firms, Hysol® QMI536NB can be used on all levels of stacked die. Non-conductive, PTFE-filled paste exhibits low resin bleed and is lead-free compatible. After multiple exposures to 260°C+ reflow temperatures, Hysol QMI536NB's provides resistance to delamination and popcorning. Product is suited for variety of materials, including solder resist, bare silicon, and multiple die passivations.

Tack Boards protect parts during shipping.

Tack Boards protect parts during shipping.

Pres-On Products, Inc.    Bolingbrook, IL 60440
Oct 18, 2005 Manufactured to specifications of shape and size, PRES-PAK pressure-sensitive adhesive boards provide peel-and-stick solution for shipping tiny electronic components, springs, glass pieces, wireforms, and irregular-shaped plastic parts. Boards are available with single- or double-coated adhesive on corrugated, chipboard, and light tag materials. They eliminate need for separate containers, because all parts of final product can be put onto one board, regardless of shape or size.

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