Ashland Performance Materials    Dublin, OH 43017
May 16, 2013 Arocure™ 100% solids, UV-curable, hot melt pressure sensitive adhesives (PSAs) offers means to create thicker adhesive film for specialty tape applications. Aroset UV-curable hot melt PSAs can be melted and applied at temperatures >100°C, and adhesive film is cured by exposing to UV radiation. No drying ovens or incinerators are required, and instantaneous cure promotes productivity. By controlling polymer design, PSAs with different balances of adhesion and cohesion can be developed.

Rogers Corp., High Performance Foams Div. - PORON Urethanes    Woodstock, CT 06281
May 14, 2013 Intended for OEMs that design and manufacture smartphones and tablets, PORON® Foam Tape offers solution for display bonding and impact protection. Product combines bond strength, compression set resistance, and dimensional stability to prevent window floating. In addition, tape delivers optimized water-sealing performance, passing Rogers IPX7 simulation test under zero compression.

Engineered Material Systems    Delaware, OH 43015
May 08, 2013 Designed to make contact from vias or other conductors on crystalline silicon solar cells to back contact sheet, DB-1588-2 Conductive Adhesive is stress absorbing to withstand rigors of thermal cycling. Product features optimal conductive stability to back contact metallizations during damp heat exposure, and is designed to cure through encapsulant lamination and cure process.

Engineered Materials Systems Inc.    Delaware, OH 43015
May 08, 2013 Featuring high glass transition temperature to facilitate wire bonding, CA-105 Die Attach Adhesive is suitable for attaching LEDs and other small semiconductor die to silver and copper lead frames. Product has dispensing open time greater than 24 hours, measured as 25% increase in viscosity, while maintaining optimized rheology for pin transfer or needle dispensing.

Indium Corporation    Clinton, NY 13323
May 03, 2013 Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance.

Master Bond, Inc.    Hackensack, NJ 07601
May 02, 2013 Compliant with UL 94V-0 specification, EP21FRNS-2 epoxy has non-halogen filler and suits potting, encapsulation, and casting applications. Moderate viscosity epoxy features 1:1 mix ratio by weight and withstands exposure to chemicals, water, fuels, lubricants, and acids. Serviceable over -51 to +90°C temperature range, product bonds metals, glass, ceramics, and many plastics. It is available in ½ pint, pint, quart, and 1 and 5 gal kits and in syringes, bubble packs, and gun dispensers.

Permabond    Somerset, NJ 08873
Apr 30, 2013 Manufactured in compliance with FDA CFR 175.105 and 175.300, two-component Epoxy Adhesives offer shock and impact resistance coupled with environmental and temperature resistance. Range cures at room temperature or can be heated for faster cure. Available in various viscosities, gap filling capabilities, and working times, adhesives are suitable for food contact applications, including bonding filter components and bonding and sealing appliances and food handling equipment.

H.B. Fuller Co., North America    St. Paul, MN 55110
Apr 26, 2013 Offered in 3 options, Flextra® water-based dry bond hybrid laminating adhesives are suited for flexible packaging in food/industrial markets. Flextra® PD2243, used for stand-up pouches, offers clarity on various films and high bond strength as well as chemical and heat resistance, while Flextra PD2167 provides good bond strength, clarity, and gravure cylinder cell release for optimized transfer and clean-up. Base product, Flextra PD2207, is suitable for bakery, snack, and confectionery packaging.

H.B. Fuller Co., North America    St. Paul, MN 55110
Apr 26, 2013 Offering line speeds to 1,200 fpm, solvent-free Flextra Fast SFA8605 enables shipping of goods in as little as 2 days, with slitting in as little as 6 hr, pouching/zipping in one day, and PAA decay in as few as 2 days. Solvent-based Flextra Fast SB7200/XAS2283, exhibiting optimized green bond strength and heat resistance, enables shipping of goods in 3 days, with slitting in as little as 4 hr and pouching and zipping in as little as 24–48 hr.

Permabond    Somerset, NJ 08873
Apr 26, 2013 Composite Bonding Adhesives include single- and 2-part epoxy adhesives designed for use on substrates such as GRP, FRP, and carbon fiber as well as variety of metal and plastic surfaces. Modified Epoxy hybrid technology, also included in range, offers soft and flexible bonds with high elongation and peel strength. Low shrinkage characteristics make them suitable for bonding thin gauge composites or metal skins which may be affected by witness marks/print through with regular adhesives.

Pres-On Products, Inc.    Addison, IL 60101
Apr 24, 2013 Available coated on one or both sides with specially formulated acrylic adhesive, SG6600/6700 Series HD Tapes bond instantly to vinyl, plastics, powder paints, bare metal, and glass, eliminating slippage. Adhesive has service temperature range up to 180°F and resists water and humidity. Manufactured from high-density open cell urethane that resists fungi and oxidation, tapes offer tensile strength of 400 psi and tear strength, as measured by ASTM standard, of 40 pli.

Henkel AG & Co. KGaA    Düsseldorf   Germany
Apr 16, 2013 Designed to address harsh environmental conditions, Loctite Ablestik ICP 4000 Series withstands operating temperatures up to 200°C. Materials are single component, silver-filled, silicone-based adhesives with flexibility that allows for compensation of common CTE mismatches and ability to survive in extreme vibration over extended periods of time. Adhesives also exhibit very low outgassing and bleed during cure.

Sika Corp.    Lyndhurst, NJ 07071
Mar 14, 2013 Weather-resistant Sikaflex®-295i UV features i-Cure® (intelligent curing) technology, which is chemical base for cross linking technology for polyurethane sealants and adhesives. Developed for use in bonding applications for polycarbonate and acrylic (PMMA) windows, this single-component polyurethane adhesive and sealant does not include any added solvents and has minimized VOC chemical base, according to US EPA Method 24.

Engineered Material Systems    Delaware, OH 43015
Mar 07, 2013 Suitable for attaching semiconductor die in temperature-sensitive devices, DB-1568-1 is more than 90% cured after 30 min at 80°C, but has dispensing work life greater than 48 hr, while maintaining optimized rheology for stencil printing. Material can also be fast cured in 1 min at 180°C. Providing damp heat resistance, conductivity stability, and extreme flexibility, adhesive withstands stresses induced in flexible electronics and display applications.

Dymax Corp.    Torrington, CT 06790
Mar 04, 2013 Intended for glass-to-glass and glass-to-metal applications, Ultra Light-Weld® 431 can be used in high-temperature and high-moisture environments while maintaining adhesion and flexibility. Product bonds upon exposure to UV/Vis light for immediate use in assembly process, and minimal shrinkage reduces stress on bond line or larger cured surfaces. This adhesive may also be considered for use in bonding various plastics, ceramic, and FR4.

Adhesives Technology Corp.    Pompano Beach, FL 33064
Feb 25, 2013 To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed, epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties, product is suitable for overhead and vertical repairs, and can also be used on damp to wet surfaces.

Epoxyset, Inc.    Lincoln, RI 02865
Jan 29, 2013 Used for bonding in electronics and aerospace components requiring resistance of up to 400°F, halogen-free Epoxyohm 97M (EO-97M) is formulated using pure silver powders and latent curing agent. All constituents are electrically and thermally conductive. Silver-filled epoxy adhesive exhibits volume resistivity of below 0.0004 Ω-cm when cured and tensile strength of 1,500 psi (Al to Al) and complies with REACH as well as RoHS standards.

Ashland Performance Materials    Dublin, OH 43017
Jan 28, 2013 When used with Pliogrip™ 1080 activator, Pliogrip 1100 two-part methacrylate structural adhesive provides 120–180 min of work time while maintaining minimum of 45 min of work time at 97°F. Body- and gap-filling capabilities, along with sag resistance, meet requirements for bonding of large composite components in boat applications. Offered in 50 gal drums, adhesive may be used with Pliogrip 1040, 1060, or 1080 activators.

Engineered Materials Systems Inc.    Delaware, OH 43015
Jan 24, 2013 Designed for attaching semiconductor die in temperature-sensitive devices, 561-50 Low Temperature Cure Adhesive is suited for smart cards, camera modules, and flex circuits. Electrically conductive product is more than 90% cured after 30 min at 80°C, but has dispensing work life greater than 48 hr, while maintaining optimized rheology for dispensing, damp heat resistance, and conductivity stability. Also, flexible material can be fast cured in 1 min at 180°C.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jan 23, 2013 Available in 7 ½ x 1 ¼ x 5/8 in. bars, Crystalbond™ 590 offers thermal and mechanical stability and is used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations. Application is accomplished by preheating mounting plate to 300°F, melting and spreading adhesive in uniform layer, positioning part, and allowing assembly to cool. After machining, Crystalbond is dissolved in ultrasonic bath using isopropyl alcohol.