Wafer Handling System is optimized for 1-step processes.
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Press Release Summary:
InLine Express transfers wafers from EFEM directly into process module without need for central vacuum chamber. It utilizes MagnaTran(TM) 7 robot and FabExpress EFEM for applications such as ash and etch. InLine Express features Express Lock 2 to 3 shelf load lock with built-in high-speed robotic arm. It is eDiagnostics-enabled, and can handle 400 data points every 20 milliseconds. Control system is fully compliant with 300mm SEMI standards.
Original Press Release:
Brooks Automation - Leader in 300mm Automation - Introduces InLine Express(TM) 300mm Wafer Handling System for Etch, Strip and CVD Processes
Brooks also introduces ExpressLink IX(TM) Contol Software for Automating the InLine Express Platform.
Chelmsford, MA - Brooks Automation, Inc. (NASDAQ: BRKS), a leading supplier of tool and factory hardware and software automation solutions for the global semiconductor industry, solidifies its position as the semiconductor automation technology leader with its InLine Express - a product that transfers wafers from an EFEM directly into a process module without the need for a central vacuum chamber, resulting in a
40% smaller footprint than a standard cluster tool. InLine Express offers best-of-breed components for unparalleled reliability, consistent high quality, and a full set of options to meet the factory interface requirements of fabs worldwide.
With InLine Express, Brooks now offers a broader range of architectures to optimize the cost/footprint/throughput equation for each type of application. InLine Express utilizes proven Brooks components such as MagnaTran(TM) 7 robot and the FabExpress(TM) EFEM to provide a handling system optimized for one-step process applications such as ash and etch. This allows OEM customers with multiple process products to use the same building blocks to create a handling tool tailored to their specific needs.
InLine Express features Brooks' innovative Express Lock(TM), a very small 2 to 3 shelf load lock with a built-in, high-speed robotic arm. It also features an integrated metrology interface that allows a process technology OEM to integrate third party metrology modules. The InLine Express platform features a
control system that is fully compliant with 300mm SEMI standards.
InLine Express is eDiagnostics-enabled and can handle 400 data points every 20 milliseconds. It is FabReady(TM) and designed to integrate seamlessly with the Brooks factory MES software. InLine Express can also link to Brooks' Advanced Process Control (APC) Suite for feed forward and feedback process control.
ExpressLink IX software features a supervisory graphical user interface for optimized and robust substrate transport. The ExpressLink family supports seamless integration with Brooks' rich library of software modules, including iLink(TM), software for implementing 200mm and 300mm SEMI standards, and iConnect(TM), software for enabling eDiagnostics. ExpressLink IX incorporates a standard programming interface that allows an OEM to integrate third-party metrology or process modules.
