Product News: Computer Hardware & Peripherals
USB 3.0 to NAND Flash Controllers offer 280 MBps data transfer.
Press Release Summary:
December 17, 2012 - Utilizing 19 nm, 20 nm, and 21 nm NAND flash technologies, 2-channel VIA VL752 and single-channel VIA VL753 have been certified by USB Implementers Forum for SuperSpeed operation. Units feature flexible bad block management, support for 200 MHz DDR NAND Flash, and optimized ECC engine for data integrity. To enable small form factor designs, VIA VL752 is housed in 8 x 8 mm QFN68 package, while VIA VL753 comes in 6 x 6 mm QFN48 package.
Original Press Release
VIA Labs Announces Next-Generation USB 3.0 to NAND Flash Controllers, VIA VL752 and VIA VL753
Press release date: December 11, 2012
Taipei, Taiwan - VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its two latest USB 3.0 device controllers, the VIA VL752 and VIA VL753 SuperSpeed USB 3.0 to NAND flash controllers. The VIA VL752 and VIA VL753 deliver enhanced performance using the latest NAND flash technologies including 19nm, 20nm and 21nm geometries and have been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.
The two-channel the VIA VL752 and single-channel VIA VL753 offer data transfer speeds up to 280MB/s, flexible bad block management, support for the latest 200MHz DDR NAND Flash, and a robust ECC engine for greater data integrity. The package sizes from the previous generation of VIA Superspeed USB to NAND flash controllers have been reduced to a QFN68 8 x 8mm package for the VIA VL752 and a QFN48 6 x 6mm package for the VIA VL753 to enable the smallest form-factor designs.
"The VIA VL752 and VIA VL753 USB to NAND Flash controllers give the best user experience by improving both performance and reliability,” said Gibson Chen, VP of Sales, VIA Labs, Inc. "With the smaller package sizes, it is even easier for manufacturers to integrate them into new product designs as well as the smallest modular form-factors."
VIA Labs will be showcasing all of their latest USB 3.0 device controllers including the VIA VL752 and VIA VL753 in The USB Tech Zone at the upcoming 2013 International CES in Las Vegas from January 8-11. The USB Tech Zone will be located in LVCC, South Hall 3, Booth #31431.
The VIA VL752 and VIA VL753 USB 3.0 to NAND Flash controllers are available now in MP; for pricing and sample requests, please contact your local VIA Labs sales representative or send an email to: firstname.lastname@example.org
About VIA Labs, Inc.
VIA Labs, Inc is the foremost supplier of USB 3.0 integrated chip controllers that are driving adoption of the new SuperSpeed USB specification. A wholly owned subsidiary of x86 processor platform provider, VIA Technologies, Inc., VIA Labs leverages its experience in high-speed serial link interfaces, in-house PHY design, and complete system integration to offer customers industry leading technology along with guaranteed high quality and implementation support. www.via-labs.com
VIA Labs PR Contact
International: Richard Brown
Phone: (886)-2-2218-5452 #6201