Thermally Conductive Epoxy suits die attach applications.
Press Release Summary:
Adhering to metals, ceramics, and silicon dies, Supreme 3HTND-2DA cures in 5–10 min at 150°C, offers die shear strength of 19–21 kg-f, and is serviceable from -100 to +400°F. One-part, electrically insulative epoxy passes NASA low outgassing test specifications and has low ionics, particularly chlorine at <15 ppm. As toughened system, product can withstand rigorous thermal cycling and shock. Supreme 3HTND-2DA comes in syringes and can be applied to defined area without running.
Original Press Release:
Thermally Conductive, Electrically Insulative One Part Epoxy for Die Attach Applications
Formulated for die attach applications, Master Bond Supreme 3HTND-2DA is a fast curing, high performance one component epoxy system. It cures in 5-10 minutes at 150°C and has unlimited working life at room temperature. It is available in syringes and has a shelf life of 6 months when stored at 40-50°F.
Supreme 3HTND-2DA has a die shear strength of 19-21 kg-f and performed very well in 85/85 testing. This epoxy has excellent adhesion to metals, ceramics and silicon dies. It is serviceable over the wide temperature range of -100°F to +400°F. As a toughened system, it offers the ability to withstand rigorous thermal cycling and shock.
In accordance with die attach application requirements, this product passes NASA low outgassing test specifications. Supreme 3HTND-2DA has low ionics, particularly chlorine (<15 ppm). It also features dimensional stability, superior thermal conductivity, electrical insulation properties and a glass transition temperature of 100-105°C.
Unlike many other die attach systems, Supreme 3HTND-2DA is not premixed and frozen, but it requires refrigeration for storage. This system dispenses smoothly or without any tailing. It well suited for automatic dispensing equipment. With a viscosity of over 300,000 cps (thixotropic), it can be applied to a defined area without running.
Master Bond Toughened Epoxy Compounds
Master Bond Supreme 3HTND-2DA is a NASA low outgassing system for die attach applications featuring thermal conductivity, high temperature resistance and toughness. Read more at http://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983; Fax: +1-201-343-2132; Email: technical@masterbond.com.
