Solder Dispensing Formulation suits mechanical soldering.
Press Release Summary:
Designed for gap filling and application on vertical surfaces, Model SAC305 no-drip solder paste dispensing formulation wicks around metal surfaces such as silver, silver-plated, nickel, brass, and copper to produce solder joints. Featuring lead-free, no-clean formulation, product helps customers solder joint around heat tube (or heat sink) container.
Original Press Release:
EFD® Introduces a No-Drip, SAC305 Solder Paste Formulation
Engineered Fluid Dispensing that increase throughput,
improve yields, and reduce soldering production costs.
August 17, 2007 East Providence, RI, USA -- EFD, Inc., a subsidiary of Nordson Corporation (NASDAQ: NDSN) introduces a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces.
The new formulation was created to help customers solder a perfect joint around a heat tube (or heat sink) container. Research found that competitors' formulations would drip down the container during the reflow process and create an insufficient solder joint. In contrast, EFD's no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints.
EFD's products are available through their worldwide network operating in over 30 countries. For more information, contact EFD at 800-338-4353, +1-401-434-1680 or visit www.efd-inc.com.
EFD, Inc. is a wholly owned subsidiary of Nordson Corporation. Since 1963 EFD has designed and manufactured precision dispensing devices for applying controlled amounts of the adhesives, sealants, lubricants and other assembly fluids used in almost every manufacturing process.
Contact:
Liz Mitchell
Marketing Programs Manager
401.434.1680, x1162
lmitchell@efd-inc.com
