Product News: Electronic Components & Devices
Semiconductor Chip shows vehicle movement in 3 dimensions.
Press Release Summary:
February 18, 2014 - Integrating 3D Automotive Dead Reckoning technology, Model UBX-M8030-Kx-DR can calculate vehicle's position, speed, and elevation in areas of poor or no satellite visibility, such as urban environments, stacked highways, and parking garages. Technology aids traditional GNSS navigation systems by blending them with individual wheel speed, gyroscope, and accelerometer information to maintain accurate 3D positioning. Housed in 5 x 5 mm QFN package, chip is self-calibrating and AEC-Q100 qualified.
Original Press Release
u-blox Introduces Breakthrough 3D Automotive Dead Reckoning
Press release date: February 7, 2014
THALWIL, Switzerland, -- Swiss u-blox, a global leader in wireless and positioning modules and chips, introduces its next-generation semiconductor technology dedicated to advanced in-dash navigation, emergency call (i.e. eCall / ERA-GLONASS), usage-based insurance (UBI), road-pricing, and stolen vehicle recovery systems.
The u-blox UBX-M8030-Kx-DR chip integrates a radical new technology, "3D Automotive Dead Reckoning" (3D ADR) which enables it to calculate a vehicle's position, speed, as well as elevation in areas of poor or no satellite visibility, a common scenario in high-density urban environments, stacked highways, or parking garages.
The new chip is yet another proof of u-blox' position as the leading provider of positioning technology for automotive applications, already adopted by major car manufacturers globally.
"Drivers expect car navigation systems to be fast, accurate, and work everywhere, regardless of satellite visibility. As cities expand, construction of more tunnels, multi-level overpasses and park garages is increasing. Our solution meets this challenge head-on; regardless of satellite visibility, our 3D ADR chip shows movement in three dimensions to maintain continuous and accurate positioning in tunnels, stacked highways, multi-level or underground parking facilities," said Thomas Nigg, VP product marketing at u?blox.
The technology aids traditional GNSS navigation systems such as GPS, GLONASS and BeiDou by blending them with individual wheel speed, gyroscope and accelerometer information to maintain accurate 3D positioning even when satellite signals are completely lost.
The UBX-M8030-Kx-DR chip is self-calibrating to compensate for sensor aging and temperature effects. It is compatible with virtually all vehicles and drive trains (i.e. front-, rear-, all-wheel drive), and supports a variety of sensor combinations. Sensor information can be derived from the vehicle's sensors for the most cost-efficient implementation, or from external sensors for after-market solutions. The chip is AEC-Q100 qualified and is produced in ISO/TS Automotive certified production sites.
The chip requires minimum host integration or customization resulting in no risk, low cost, and fast time-to-market. Installation is uncritical thanks to automated software calibration. 3D ADR is accurate even at low speeds.
The chip allows for easy testing, simple and modular production set-up, and minimal BOM. The chip comes in a 40-pin QFN package measuring only 5 x 5 mm and includes I(2)C, SPI, UART and USB interfaces.
Contact u-blox for more information.
Swiss-based u-blox (SIX:UBXN) is the global leader in positioning and wireless semiconductors for the consumer, industrial and automotive markets. Our solutions enable people, vehicles and machines to locate their exact position and wirelessly communicate via voice, text or video. With a broad portfolio of chips, modules and software solutions, u-blox is uniquely positioned to enable OEMs to develop innovative personal, professional and M2M solutions quickly and cost-effectively. With headquarters in Thalwil, Switzerland, u-blox is globally present with offices in Europe, Asia-Pacific and the USA.
CONTACT: Thomas Nigg, VP Product Marketing, Phone: +41 44 722 7470, E-mail: email@example.com