Sanmina's Circuit Assembly Capabilities are suitable for military and aerospace applications.
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Press Release Summary:
Sanmina's Flex and Rigid Flex Circuit Assembly Capabilities combine laminates, mil-aero connectors and advanced circuit fabrication technologies. Using D38999, D-Sub Micro-D and blind mate connectors, Sanmina is able to provide data rates up to 10-15 gigabits/sec. Flex and Rigid Flex Circuit fabrication technology in defense and aerospace applications provide small factor and reduced weight and cost savings.
Original Press Release:
Sanmina Announces New High Speed Flex and Rigid Flex Circuit Assembly Capabilities for Aerospace Applications
Sanmina Corporation (Nasdaq: SANM), a leading manufacturing solutions company making some of the world's most complex and innovative electronic, optical and mechanical products, today announced that its Backplane and Cable Division has developed new flex and rigid flex circuit assembly capabilities for military and aerospace electronics equipment. This new technology combines the latest laminates, high performance mil-aero connectors and Sanmina's advanced circuit fabrication technologies. These advancements along with Sanmina's system design and manufacturing in AS9100C certified circuit facilities give Sanmina's customers a complete solution for the most advanced defense and aerospace applications.
Flex and rigid flex circuits have been used as a cost effective interconnect system in mission critical defense and aerospace equipment for many years. As these systems evolve and data rates increase, performance requirements for interconnect become more demanding. High performance connectors are used, including D38999, D-Sub Micro-D and blind mate connectors. Flex circuit laminate materials have also evolved and with Sanmina's advanced processes can now be used with these high speed connectors in demanding applications. The value of Sanmina's flex and rigid flex technology in these applications results in a smaller form factor, reduced weight and cost savings. Sanmina's new flex and rigid flex circuit fabrication technology is able to deliver data rates up to 10-15 gigabits/sec.
"Sanmina is proud to offer new technology to our customers that helps increase performance and reduce the size and weight of advanced military and aerospace products," said Alex Scroppo, Senior Vice President, Backplane and Cable Division. "We are pleased to be able to provide a complete technology and manufacturing solution to our defense and aerospace customers, a combination of services we believe to be unmatched in the industry."
Sanmina has been a technology innovator in high performance interconnect systems for many years. Sanmina offers a complete solution for backplanes, PCBs and flex circuits, including systems engineering, board design and layout, in-house laminate qualification, signal integrity, high speed connector analysis and failure analysis laboratories. Sanmina's global facilities are fully certified for defense and aerospace requirements including ITAR and AS9100C certifications, among others.
About Sanmina Corporation
Sanmina Corporation is a leading integrated manufacturing solutions provider serving the fastest growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, storage, industrial, defense, medical, energy and industries that include embedded computing technologies such as point of sale devices, casino gaming and automotive. Sanmina has facilities strategically located in key regions throughout the world. More information about the Company is available at www.sanmina.com.
CONTACT:
Gelston Howell,
1-408-964-3751
Web Site: http://www.sanmina.com
