Packaged IC Component Inspector features dual taper output.
Press Release Summary:
ICOS® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 µm, unit can also capture surface defects down to 40 µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.
Original Press Release:
KLA-Tencor(TM) Introduces the ICOS® CI-T620 Packaged IC Component Inspector
New Tool Features Dual Taper Output to Help Lower Total Cost of Ownership
MILPITAS, Calif. - Today KLA-Tencor Corporation(TM) (Nasdaq: KLAC), the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, introduced the newest addition to its Component Inspector series, the ICOS® CI-T620--a high-performance component inspector system for tape and reel*. The CI-T620 is a fully automated optical inspector of integrated circuit (IC) packages for 3D measurements and package quality with dual tapers for improved output. The new system is designed to offer superior inspection accuracy, reduced cost of ownership (CoO), and increased flexibility.
The new ICOS CI-T620 is designed to offer customers:
- Superior inspection: Enhanced tool accuracy through 3D metrology inspection down to 5 micrometers and high-resolution imaging to capture surface defects down to 40 micrometers
- Reduced CoO: Faster package changeover (<5 minutes) and a throughput increase of up to 80 percent, compared to prevailing industry methods, thereby reducing the total cost of ownership
- Inspection flexibility: A complete portfolio of unique 2D and 3D inspection capabilities supported by KLA-Tencor's proprietary technology, and compatibility with a broad range of packages and sizes--including the largest package size range of 3x3 to 42.5 x 42.5mm
"The CI-T620 demonstrates our commitment to innovation in packaged IC component defect inspection," said Jeff Donnelly, group vice president of the Growth and Emerging Markets division at KLA-Tencor. "We've built on the overwhelming success of the existing CI platform, with more than 2,000 tools installed to-date worldwide, by creating the industry's most intuitive and flexible component inspection tool."
KLA-Tencor's component inspector system will be introduced at SEMICON China, taking place March 15-17 at the Shanghai Convention and Exhibition Center. All component inspection tools are backed by KLA-Tencor's global, comprehensive service network. For more information on the ICOS CI-T620 back end IC component inspector, please visit the product web page at: www.kla-tencor.com/back-end-defect-inspection/icos-ci-t620-component-inspector.html.
*Tape and reel is a process of packing surface mount devices by loading them into individual pockets within a pocket tape or carrier tape. The units are sealed in the carrier tape with a cover tape, usually by heat or pressure. The carrier tape is wound around a reel for convenient handling and transport. The reel is enclosed in a reel box before it is finally shipped to the customer. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to dramatically increase units per hour.
About KLA-Tencor:
KLA-Tencor Corporation (NASDAQ: KLAC), a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, data storage, LED, photovoltaic, and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for over 30 years. Headquartered in Milpitas, California, KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com.
