Metrology Tools measure thin transparent films.
Press Release Summary:
Utilizing FOCUS(TM) beam ellipsometry, S3000(TM) (300 mm) and S2000(TM) (200 mm) measure transparent films throughout device fabrication process. Laser light sources are used for optimal accuracy, stability, spot size, and tool-to-tool matching. Also provided, optional deep UV and visible reflectometry capabilities offer flexibility in addressing various applications throughout fabrication. Built on Vanguard(TM) platform, products incorporate Cognex® PatMAX® geometric pattern-matching technology.
Original Press Release:
Rudolph Announces New S3000 and S2000 Metrology Tools
Ellipsometry-based system offers optimized price and performance for fab-wide transparent film applications
Flanders, New Jersey (June 5, 2006)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis for semiconductor manufacturing, announced today its new S3000(TM) and S2000(TM) ellipsometry-based metrology systems designed to provide high throughput, cost-effective measurements of thin transparent films throughout the device fabrication process. The S3000 (300 mm) and S2000 (200 mm) are engineered to provide ellipsometry at optimized price and performance for transparent film metrology applications in the thin film, CMP, etch and lithography modules. Rudolph pioneered FOCUS(TM) beam ellipsometry for thin film metrology-its ultra-II(TM) offers the accuracy and repeatability required for the most demanding front-end diffusion processes.
"We believe these systems provide a value-engineered solution that exceeds the metrology requirements for the majority of transparent film processes outside the diffusion area," said Chris Morath, director of metrology product management at Rudolph. "The S3000/2000 is designed to deliver these benefits at a lower price than instruments developed to meet performance requirements for extreme diffusion applications, such as ultra-thin gates. This robust process solution should directly contribute to improved profitability for our customers."
The S3000/2000 systems use Rudolph's fifth-generation FOCUS beam ellipsometry, incorporating long-life laser light sources for high accuracy, long-term stability, small spot size and easy tool-to-tool matching. The systems also provide optional deep UV and visible reflectometry capabilities to flexibly address a broad range of applications throughout the fab.
Built on Rudolph's established Vanguard(TM) platform, the S3000/2000 incorporate an easy-to-use Microsoft Windows XP® based interface. Rudolph-proprietary and Cognex® PatMAX®geometric pattern-matching technology provides superb robustness for patterned wafer applications in the etch and CMP modules with low image contrast or a large degree of color variation. For additional cost savings, optional integrated stress/bow measurements eliminate the need for a separate instrument.
The S3000/2000 systems are available immediately for shipment.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
