Low-profile Connectors target mobile device battery packs.
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Press Release Summary:
Featuring space-saving design with stacking height of 0.7 mm and depth of 2.6 mm, hybrid BM25 Series is rated up to 9 A per pin for power contacts and 1 A per pin for signal contacts. Board-to-FPC connectors offer contact resistance as low as 5 mΩ or below for power contacts and 30 mΩ or below for signal contacts. Combining 6-point clip-like contact structure with 8-point metal lock, connectors' mating force is resistant to intense vibration and drop impact.
Original Press Release:
Low-profile Connector Designed for Mobile Device Battery Packs Offers Twice as Much Current-carrying Capacity Compared to Conventional Products
HIROSE'S SMALL BM25 SERIES HYBRID BOARD-TO-FPC CONNECTOR HANDLES UP TO 9 AMPS
CHICAGO, ILLINOISÂ – Hirose, a leader in the development of innovative connector solutions, has developed a small, board-to-flexible printed circuit (FPC) connector designed for battery pack connections in mobile devices. The hybrid BM25 Series connector is rated up to 9 Amps per pin for power contacts and 1 Amp per pin for signal contacts. With a space-saving design that offers a stacking height of only 0.7mm and a depth of 2.6mm, the low-profile BM25 Series delivers twice as much current-carrying capacity in a smaller profile than traditional technologies.
Offering contact resistance as low as 5m ohms or below for power contacts and 30m ohms or below for signal contacts, the BM25 Series provides significant power savings by utilizing a design that minimizes contact resistance.
A six point, highly reliable clip-like contact structure combined with a robust eight-point metal lock provides a mating force that is resistant to intense vibration and drop impact. The BM25 Series also utilizes a metal guide structure that prevents housing damage due to incorrect mating. With a breaking strength of 70 N, the metal guide design ensures that if the header and the receptacle should be mated incorrectly, the metal hold-downs would dissipate the force and prevent housing damage.
Offering simple and easy mating operation, the BM25 Series utilizes guide ribs that self-align up to 0.48mm in the pitch direction and 0.46mm in the width direction.
"Our ultra-compact BM25 Series hybrid board-to-FPC connector delivers more power in a smaller package than competing technologies on the market," said Rick van Weezel, Vice-President of Sales and Marketing for Hirose Electric USA. "Designed for mobile device connectivity, the BM25 Series connector meets the power and signal transition needs for a wide variety of handheld consumer, medical, point of sale, inventory control, and other wireless equipment."
The BM25 Series has an integrally molded header and receptacle that prevents solder wicking. This space saving connector is suitable for vacuum pick & place equipment.
The BM25 Series connector has a rated voltage of 30 V AC/DC, a power contact resistance of 5 m ohms maximum and a signal contact resistance of 30 m ohms maximum, an insulation resistance of 1000 M ohms minimum, and an operating temperature of -40 degrees C to +85 degrees C.
For additional information about the BM25 Series connectors, please visit: www.hirose.com/us.
ABOUT HIROSE ELECTRIC
Hirose Electric Co., Ltd. is a leading global supplier of innovative interconnects, with sales of over $1 billion to customers worldwide. Hirose employs advanced engineering services, superior customer support and worldwide manufacturing capabilities to provide value-based connector solutions for various industries including: industrial, telecommunication, consumer electronics, computer and automotive. More information can be found on Hirose Electric's corporate website at www.hirose.com.
Editor Contact Information
Bill Kysiak
Hirose Electric
630-282-6707
bkysiak@hirose.com
Garth Miller
All Business Marketing
919-424-0090
garth.miller@allbusmarketing.com
