Low-Profile Breakout Boards facilitate USB 2.0 signal bridging.
Press Release Summary:
Based on FT200XD device, UMFT200XD consists of USB-to-I²C module with 4 control bus lines. Also designed for USB-to-I²C conversion, UMFT201XB incorporates FT201XQ IC. Featuring FT220XQ, UMFT220XB enables conversion of USB to user-chosen, parallel bit interface, where data bus may be set to bit width of 1, 2, 4, or 8. Relying on FT230XQ USB-to-UART IC, UMFT230XB has 4 control bus lines and can be utilized for UART bridging with UART rate of 3 Mbps available. Other variants are available.
Original Press Release:
FTDI Chip Strengthens X-Chip USB Platform with Family of Breakout Boards
New development hardware supports a variety of different serial & parallel interface technologies
FTDI Chip has added to the support it can offer to engineers using its highly regarded X-Chip series by introducing an array of new breakout boards. Through these compact, low-profile items, the bridging of USB 2.0 (full speed) signals to serial or parallel interfaces is greatly facilitated.
The UMFT200XD is a USB-to-I2C module with 4 control bus lines, which is based on the FT200XD device. The UMFT201XB incorporates an FT201XQ IC and is also designed for USB-to-I2C conversion. This is complemented by the UMFT220XB, featuring a FT220XQ, which enables conversion of USB to a user-chosen, parallel bit interface (FTDI Chip’s own proprietary FT1248 I/O) where the data bus may be set to a bit width of 1, 2, 4 or 8 depending on design constraints. The UMFT230XB modules relies on a FT230XQ USB-to-UART IC. It has 4 control bus lines and can be utilised for UART bridging with a UART rate of 3Mbit/s available. These modules are powered via USB, with no additional power source required. They do not have a built-in USB connector as the mechanical dimensions of the PCB allow direct insertion into the USB Host connector.
In addition to the standard -01 products, the new X-Chip breakout boards will also be offered in 2 other versions. The -NC variant is supplied without the connector on the I/O side, while the -WE variant comes with 15cm ‘flying leads’ attached. Each of these X-Chip breakout boards is suitable for use with a broad range of different operating systems. These include Windows CE.NET/Vista/7/8/XP/XP Embedded, as well as Android, Linux 3.0 (and above) and MAC OS-X.
Unit pricing on these breakout boards begins at $9.50. For more information on these products please visit: http://www.ftdichip.com/ft-xmodules.
About FTDI Chip
FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineeers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency.
FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and techical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).Â
For more information go to http://www.ftdichip.com.
For further information and reader enquiries:
Steven van der WolfÂ
FTDI Chip
Unit 1, 2 Seaward Place
Centurion Business Park
Glasgow, G41 1HH, UK
Tel: +44 (0) 141 429 2777Â Â
Fax: +44 (0) 141 429 2758
E-mail: marketing@ftdichip.com
Issued by:
Mike GreenÂ
Pinnacle Marketing Communications Ltd
Tel: +44 (0)20 84296543Â
E-mail: m.green@pinnaclemarcom.com
Web: www.pinnacle-marketing.com
