Low-Power Optimized PMICs support Skylake core processor.
Press Release Summary:
Respectively available in 4.26 x 4.26 x 0.62 mm and 5.90 x 5.90 x 0.62 mm packages with 0.4 mm pitch, BD99991GW and BD99992GW enable fanless designs of such space-conscious mobile PC products as Ultrabooks™, 2-in-1 detachables, and tablets built around Intel® 14 nm Skylake CPU. BD99991GW supports core power rails required by the Skylake platform and Intel IMVP8 power management interface, while BD99992GW provides additional 10 power rails.
Original Press Release:
New Power Management ICs Optimized for Intel's 6th-Generation Skylake Core Processor Architecture
Enables thinner, smaller, lighter, and lower power systems such as ultrabooks, tablets and 2-in-1s
ROHM has released for mass production two system Power Management Integrated Circuits (PMICs). These PMICs are optimized for low power and will enable fanless designs of space-conscious mobile PC products such as Ultrabooks™, 2-in-1 detachables, and tablets built around Intel’s 14nm Skylake processor.
The BD99991GW PMIC supports the core power rails required by the Skylake platform and supports Intel’s IMVP8[1 power management interface, while the BD99992GW is designed to provide the additional 10 power rails required for the rest of platform (RoP[2).
Compared with discrete solutions, ROHM’s dual-PMIC chipset reduces the number of peripheral components by 18% and mounting area by 33%, contributing to greater space savings and increased system size reduction. Matching the PMICs - which feature industry-leading power efficiency - with ROHM-optimized discrete components can enable further reduction in power consumption, mounting area, and number of external parts.
“We have been shipping the previous generation BD99990GU PMIC for the Broadwell platforms for a couple of years. These new PMICs not only inherit the advantages of the BD99990GU, but also feature design enhancements optimized for Intel’s latest platform (Skylake). The BD99991GW and BD99992GW are offered in a sealed WL-CSP (Wafer Level Chip Scale Package) form factor ideal for Type 4 PCBs that reduce footprint by 44% over our previous IC, allowing for even further system size reduction,” said Jun Iida, Director of LSI Product Development at ROHM. “In addition to the required power functions, other features, such as LED driver, GPIOs, A/D converter, multiple clock generators, and coin battery charger, are built in. This contributes to significantly reduce the customers’ design efforts.”
In addition to these latest ICs, ROHM offers PMICs optimized for a variety of applications. ROHM also provides comprehensive support through a network of 11 design centers located throughout the globe. Going forward, ROHM will continue to leverage its expertise in the analog domain to develop high-performance products and solutions that contribute to energy savings and increased safety.
[1IMVP8: Short for Intel® Mobile Voltage Positioning, these are specifications that define interactions between power rail
circuits to support the CPU, GPU and system agents.
[2RoP: Rest of Platform. Refers to all other power rails within the Intel® platform besides those for the CPU, GPU, and
system agents.
*Intel, the Intel logo, and Intel Core are registered trademarks of Intel Corp. in the US and other countries.
**Other company names and products are trademarks or registered trademarks of their respective companies.
Notes:
Package Sizes
BD99991GW: UCSP55M4C (4.26mm x 4.26mm x 0.62mm, 0.4mm pitch)
BD99992GW: UCSP55M5C (5.90mm x 5.90mm x 0.62mm, 0.4mm pitch)
