Product News: Materials & Material Processing
Immersion Tin eliminates tin whisker formation.
Press Release Summary:
August 19, 2010 - Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.
Original Press Release
TinpositTM LF Immersion Tin
Press release date: August 12, 2010
Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high tolerance for contaminants.