Immersion Tin eliminates tin whisker formation.

The Dow Chemical Company Aug 19, 2010

Press Release Summary:

Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.

Original Press Release:

TinpositTM LF Immersion Tin

The latest in immersion tin technology providing high reliability and solderability for interconnect applications

Advantages

Maintains excellent solderability after multiple lead-free PCB assembly reflow cycles, improving manufacturing process capability and yield;

Outstanding solder joint reliability, resulting from excellent bonding force between PCB pad and reflowed solder paste;

No tin whisker formation, increasing product reliability and avoiding short-circuits between closely spaced circuit features;

Effectively eliminates galvanic corrosion preventing yield loss from circuit breaks;

Significantly reduced attack on solder mask

Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free
assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high
tolerance for contaminants.