Half Bridge Module offers 600 V and 600 A capability.
Share:
Press Release Summary:
Available with modified MIL-PRF-38534 Class E, H, or industrial screening, MSK4803 Plastic Encapsulated Module is suited for military, aerospace, and other severe environments. Silicon Nitride substrate offers thermal conductivity and heat transfer from power die to heat sink, while Aluminum Silicon Carbide baseplate offers thermal conductivity and is pre-bowed for optimal flatness after mounting. SEES(TM) coating provides near hermetic encapsulation that withstands High Accelerated Stress Test.
Original Press Release:
New Half Bridge PEM Offers 600V and 600A Capability for Severe Environments
The MSK4803 half bridge is available with modified MIL-PRF-38534 Class "E", "H", or industrial screening. This device is one of a family of plastic encapsulated modules (PEM) developed specifically for use in military, aerospace and other severe environment applications. The 600V/600A performance is achieved using low inductance power lugs and "First-in, Last-out rule" layout design. The high thermal conductivity Silicon Nitride substrate provides excellent heat transfer from the power die to the heat sink, which results in lower junction temperature and increased reliability. The Aluminum Silicon Carbide (ALSiC) baseplate offers high thermal conductivity, low weight and is pre-bowed for excellent flatness after mounting.
Our proprietary coating, SEESTM-Severe Environment Encapsulation System provides near-hermetic encapsulation that withstands High Accelerated Stress Test (HAST), which assures long term reliability and makes the MSK4803 an attractive option for high reliability PEM applications.
