Product News: Adhesives & Sealants
Flexible Adhesive serves high-temperature applications.
Press Release Summary:
August 15, 2012 - Able to be used in applications to 400°F, Aremco-Bond(TM) 820 is suited for general-purpose bonding of ceramics, glass, plastics, metals, and other substrates. This clear, unfilled, 100% solids epoxy system mixes in 1:1 ratio, providing mixed viscosity of 12,000 cps and cure time of 45 min at room temperature. Along with respective flexural and tensile shear strengths of 8,000 and 1,200 psi, properties include 860 V/mil dielectric strength and 70 Shore-D hardness.
Original Press Release
Aremco-Bond 820 High Temp Flexible Adhesive Now Available
Press release date: August 10, 2012