Product News: Adhesives & Sealants
Flexible Adhesive serves high-temperature applications.
Press Release Summary:
August 15, 2012 - Able to be used in applications to 400Â°F, Aremco-Bond(TM) 820 is suited for general-purpose bonding of ceramics, glass, plastics, metals, and other substrates. This clear, unfilled, 100% solids epoxy system mixes in 1:1 ratio, providing mixed viscosity of 12,000 cps and cure time of 45 min at room temperature. Along with respective flexural and tensile shear strengths of 8,000 and 1,200 psi, properties include 860 V/mil dielectric strength and 70 Shore-D hardness.
Original Press Release
Aremco-Bond 820 High Temp Flexible Adhesive Now Available
Press release date: August 10, 2012
SUMMARY Aremco-Bond(TM) 820, a high temperature, flexible epoxy system developed by Aremco Products, Inc., is now used for general purpose bonding of ceramics, glass, plastics, metals and other substrates for applications to 400 °F (204 °C).
FEATURES Aremco-Bond(TM) 820 is a clear, unfilled, 100% solids, 1-to-1 mix ratio, flexible epoxy system which can be used in applications to 400 °F (204 °C). Flexural and tensile shear strengths are 8,000 and 1,200 psi, respectively. The volume resistivity is 2.0 x 1014 ohm-cm; dielectric strength is 860 volts per mil; and the dielectric constant is 6.0 at 1.0 kHz.
Aremco-Bond(TM) 820 exhibits exceptional adhesion to ceramics, glass, metals and plastics substrates, and demonstrates outstanding chemical resistance to acids, alkalis, organic fluids and salts.
Aremco-Bond(TM) 820 mixes easily in a 1-to-1 ratio, providing a mixed viscosity of 12,000 cps and cure time of 45 minutes at room temperature. The Shore-D hardness is 70 and shrinkage is less than .008 in/in upon curing.
Aremco-Bond(TM) 820 is supplied in pre-filled 50ml dispense cartridges, as well as pint, quart, and gallon kits. Cartridges can be loaded to mechanical or pneumatic guns for automatic mixing and dispensing.
Please contact Aremco's Sales Engineering Department for more information about this advanced epoxy formulation.