Epoxy Adhesive provides semi-rigid bonds.
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Press Release Summary:
Tra-Bond 293-1T general purpose epoxy adhesive provides strong bonds to difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. It can be cured at moderate temperatures from 60 to 75°C. Tra-Bond 293-1T thixotropic adhesive is available in pre-measured bipax kits or premixed and frozen syringes.
Original Press Release:
Tra-Bond 293-1T
Tra-Bond 293-1T is a general purpose epoxy adhesive designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This version of the 293 series is more thixotropic. This product can be cured at moderate temperatures (60C to 75C).
Tra-Bond 293-IT can be packaged in our pre-measured bipax kits or premixed and frozen syringes. So call Tra-Con today to obtain a free sample from our application engineering staff at 1-800-TRA-CONI or fax us at 781-275-9249. Our staff is always ready to assist your application and packaging needs.
