Product News: Adhesives & Sealants
Conductive Adhesive suits die attach applications.
Press Release Summary:
October 29, 2013 -
Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature (Tg) and modulus.
Original Press Release
Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications
Press release date: October 1, 2013
ECM CA-165 is approximately half the cost of a pure silver-filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. CA-165 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.
CA-165 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
For more information about the CA-165 Low Cost Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.